Company news

Shanghai Prisemi Electronics Co., Ltd. Class A (SSE:688230) news

Shanghai Prisemi Electronics Co., Ltd. Class A news releases on 6ix. Latest, Sep 23, 2026: "SHANGHAI PRISEMI ELECTRONICS CO., LTD."Announcement on Completion…

Shanghai Prisemi Electronics Co., Ltd. Class A (SSE:688230) news

Press releases & updates

"SHANGHAI PRISEMI ELECTRONICS CO., LTD."Announcement on Completion of Transfer of Target Assets in Connection with the Issuance of Convertible Corporate Bonds and Cash Payment for Asset Acquisition

"SHANGHAI PRISEMI ELECTRONICS CO., LTD."Announcement on Participating in the 2026 Semi-annual Collective Performance Briefing for the STAR Market Chip Design Industry

"SHANGHAI PRISEMI ELECTRONICS CO., LTD."Announcement on Adjustment of Internal Investment Structure of Raised Funds Investment Projects and Capital Reduction of Certain Implementation Entities

"SHANGHAI PRISEMI ELECTRONICS CO., LTD."Announcement on Resolutions of the 2nd Extraordinary General Meeting in 2026

"SHANGHAI PRISEMI ELECTRONICS CO., LTD."Notice on Convening the 2nd Extraordinary General Meeting in 2026

"SHANGHAI PRISEMI ELECTRONICS CO., LTD."Announcement on Obtaining Registration Approval from the China Securities Regulatory Commission for the Issuance of Convertible Corporate Bonds and Payment of Cash for Asset Acquisition

"SHANGHAI PRISEMI ELECTRONICS CO., LTD."Announcement on Revision of Report on Issuance of Convertible Corporate Bonds and Cash Payment for Asset Acquisition (Registration Draft)

"SHANGHAI PRISEMI ELECTRONICS CO., LTD."Announcement on Approval by the Shanghai Stock Exchange M&A and Restructuring Review Committee of the Issuance of Convertible Corporate Bonds and Cash Payment for Asset Acquisition

"SHANGHAI PRISEMI ELECTRONICS CO., LTD."Announcement on Meeting Arrangement of the M&A and Restructuring Review Committee of the Shanghai Stock Exchange for the Review on the Company's Issuance of Convertible Corporate Bonds and Cash Payment for Asset Acquisition

"SHANGHAI PRISEMI ELECTRONICS CO., LTD."Announcement on Receiving Letter of Implementation of Review Center's Opinions from Shanghai Stock Exchange

"SHANGHAI PRISEMI ELECTRONICS CO., LTD."Indicative Announcement on the Update to the Reply to the Review Inquiry Letter Regarding the Application for the Issuance of Convertible Corporate Bonds and Cash Payment for Asset Acquisition, and Raising Supporting Funds

Announcement on Resolutions of the 1st Extraordinary General Meeting in 2026

Indicative Announcement on Update of Reply to the Inquiry Letter Regarding the Review of the Application for Issuance of Convertible Corporate Bonds and Cash Payment for Asset Acquisition, as well as the Fundraising for Supporting Funds

and Handling Industrial and Commercial Change Registration, as well as Amending the Senior Management Members

Announcement on Resolutions of the 4th Meeting of the 3rd Board of Directors

Announcement on Change of Sponsor Representative for Continuous Supervision

Announcement on Attending Annual Performance Briefing for Analog Chip Design Sector on SSE STAR Market 2025 for the "15th Five-Year Plan" - Research on Core Technologies of Integrated Circuits for Self-Reliance and Self-Development in Science and Technology

Announcement on Implementation of Dividend Distribution for 2025

Announcement on Acceptance by Shanghai Stock Exchange of Application Documents for Issuing Convertible Corporate Bond to Purchase Assets in Cash and Raise Supporting Funds

Announcement on Resolutions of the 2025 Annual General Meeting

Self-Inspection Report on the Trading of Stocks by Related Entities in the Transaction

Report on the Use of Previously Raised Funds

Announcement on Progress in Planning Major Asset Restructuring

Announcement on Election of Chairman and Members of Special Committees of the Board of Directors and Appointment of Senior Management Members and Securities Affairs Representative

Announcement on Resolutions of the 2nd Extraordinary General Meeting in 2025

Announcement on Using Self-owned Funds to Pay Funds Required for Investment Projects Financed by Raised Funds and Replacing Them with an Equal Amount of Raised Funds

Report for Q3 2025

Announcement on Resolutions of the 1st Extraordinary General Meeting in 2025

Announcement on Attending Semi-annual Performance Briefing for Chip Design Industry on SSE STAR Market 2025

Announcement on Resolutions of the 19th Meeting of the 2nd Board of Supervisors

Announcement on Resolutions of the 18th Meeting of the 2nd Board of Supervisors

Announcement on Opening and Assigning Special Settlement Accounts for Cash Management Products of Raised Funds

Announcement on Listing and Circulation of Restricted Stocks before Initial Public Offering

Announcement on Implementation of Dividend Distribution for 2024

Announcement on Resolution of the 2024 Annual General Meeting

Report for Q1 2025

Announcement on Convening Performance Meeting for 2024 and 1st Quarter of 2025

Notice on Convening the 2024 Annual General Meeting

Announcement on Preliminary Earnings Estimate for 2024

Announcement on Resolution of the 1st Extraordinary General Meeting in 2024

Announcement on Resolution of the 15th Meeting of the 2nd Board of Supervisors

Announcement on Resignation of Shareholder Representative Supervisor

Announcement on Attending Collective Q3 Report Performance Briefing of Listed Companies in Shanghai Jurisdiction in 2024

Announcement on Resolution of the 14th Meeting of the 2nd Board of Supervisors

Announcement on Attending Semi-annual Collective Performance Briefing 2024

Announcement on Using Some Temporarily Idle Raised Funds for Cash Management

Announcement on Signing Agreement on Supervision over Saving of Special Accounts for Raised Funds among Three Parties

Announcement on Implementation of Dividend Distribution for 2023

Announcement on Resolution of 12th Session of 2nd Board of Supervisors

Announcement on Resolutions of 2023 Annual General Meeting