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Micron Innovates From the Data Center to the Edge With NVIDIA

Micron HBM3E 12H and LPDDR5X-based SOCAMM solutions designed to unlock full potential of AI platforms SAN JOSE, Calif., March 18, 2025 (GLOBE NEWSWIRE) -- GTC

articleMicron Technology, Inc.March 18, 20254/company/micron-technology-inc/news/micron-innovates-data-center-edge-nvidia-2025-03-18
Micron Innovates From the Data Center to the Edge With NVIDIA

About this update from Micron Technology, Inc.

[{"type":"text","content":"Micron HBM3E 12H and LPDDR5X-based SOCAMM solutions designed to unlock full potential of AI platforms\nSAN JOSE, Calif., March 18, 2025 (GLOBE NEWSWIRE) -- GTC 2025 -- Secular growth of AI is built on the foundation of high-performance, high-bandwidth memory solutions. These high-performing memory solutions are critical to unlock the capabilities of GPUs and processors. Micron Technology, Inc. (Nasdaq: MU), today announced it is the world’s first and only memory company shipping both HBM3E and SOCAMM (small outline compression attached memory module) products for AI servers in the data center. This extends Micron’s industry leadership in designing and delivering low-power DDR (LPDDR) for data center applications. Micron’s SOCAMM, a modular LPDDR5X memory solution, was developed in collaboration with NVIDIA to support the NVIDIA GB300 Grace™ Blackwell Ultra Superchip. The Micron HBM3E 12H 36GB is also designed into the NVIDIA HGX™ B300 NVL16 and GB300 NVL72 platforms, while the HBM3E 8H 24GB is available for the NVIDIA HGX B200 and GB200 NVL72 platforms. The deployment of Micron HBM3E products in NVIDIA Hopper and NVIDIA Blackwell systems underscores Micron’s critical role in accelerating AI workloads. Think AI, think memory, think MicronAt GTC 2025, Micron will showcase its complete AI memory and storage portfolio to fuel AI from the data center to the edge, highlighting the deep alignment between Micron and its ecosystem partners. Micron’s broad portfolio includes HBM3E 8H 24GB and HBM3E 12H 36GB, LPDDR5X SOCAMMs, GDDR7 and high-capacity DDR5 RDIMMs and MRDIMMs. Additionally, Micron offers an industry-leading portfolio of data center SSDs and automotive and industrial products such as UFS4.1, NVMe® SSDs and LPDDR5X, all of which are suited for edge compute applications. “AI is driving a paradigm shift in computing, and memory is at the heart of this evolution. Micron’s contributions to the NVIDIA Grace Blackwell platform yields significant performance and power-saving benefits for AI training and inference applications,” said Raj Narasimhan, senior vice president and general manager of Micron’s Compute and Networking Business Unit. “HBM and LP memory solutions help unlock improved computational capabilities for GPUs.” SOCAMM: a new standard for AI memory performance and efficiencyMicron’s SOCAMM solution is now in volume produc...

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