Toray Industries, Inc. TSE:3402
Toray Industries : R&D of Toray Group’s Digital Innovation (DI) Business
Source: MarketScreener
TORAY IR Seminar
Toray Group's Initiatives for Digital Innovation (DI) Business
R&D of Toray Group's
Digital Innovation (DI) Business
September 13, 2024
Yuichiro Iguchi
Corporate Vice President
General Manager of Research Division,
Toray Industries, Inc.
Contents
- R&D Priority Areas in DI Business
II. R&D Initiatives
III. Future Prospects and Summary
Copyright © 2024 Toray Industries, Inc. | 1 |
Ⅰ
R&D Priority Areas in DI Business
R&D structure
Fibers & Textiles | Resins & Chemicals |
Division | Division |
Synthetic | Recycled fiber | PBT resin | PPS resin |
fiber | &+TM | TORAYCONTM | TORELINATM |
Silk-textured textile | Man-made suede | ABS resin (clear-grade) |
KinariTM | UltrasuedeTM | TOYOLACTM |
Films Division
Polyester film | OPP film |
LumirrorTM | TORAYFANTM |
Functional nano- | PPS film |
multilayer film | |
TORELINATM | |
PICASUSTM |
Electronic &
Information Materials
Division
Polyimide materials for semiconductors and
electronic parts
FALDATM / SEMICOFINETM / PHOTONEECETM
Environmentally- | Plastic optical fiber |
friendly printing plate | |
RAYTELATM | |
TM | |
IMPRIMA |
Water Treatment &
Environment Division
Reverse osmosis (RO) | Household water purifier |
membrane elements | |
TrayvinoTM |
MeltblownHigh-performance
non-woven fabric | cleaning cloth |
TraymicronTM | |
TrayseeTM |
Research & Development Division
Toray Engineering Toray Research Center
Role of the R&D Division | Seamlessly promote the Division Research in collaboration with | |||||||||
each business division and the Forward-Looking Research | ||||||||||
New Product Development | Research on next-generation | Advanced Research | ||||||||
products that strengthen the | Aiming for Future Creation | |||||||||
business foundation | ||||||||||
Division Research
Corporate Research
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Trend in Semiconductor Technology and Future Society
1990s
Social
implementation
Mobile phones
Semiconductor | Surface | ||||||||||||||
technology | |||||||||||||||
mount | |||||||||||||||
trend | |||||||||||||||
Fewer pins, | |||||||||||||||
Large substrate | |||||||||||||||
Semiconductor | |
Package | SOP, QFN |
2010s | 2030s |
LCD, Smartphone | Server, generative AI, 5G, |
autonomous driving, and telemedicine | |
PCB mounting | Combined, 3D Mounting (SiP, SiC), | |
Si-Photonics | ||
Multi-pin, | Compact, Thin film, | 3D Packaging |
Redistribution Layer | ||
Hybrid bonding | ||
IC chip | ||
Si-Photonics | ||
BGA, CSP | FO-WLP,FO-PLP | Chiplet |
Rapidly developing with trends towards High Integration, High Performance, and Miniaturization
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R&D Priority Areas in DI Business
Electronic & | Products in the engineering business |
Information Materials | |
Optoelectronic fusion technology | (3) |
Display Materials
μLED
Electronic coating and | Semiconductor mounting equipment and | ||||||||||||||||||||||||||||||||||
mounting materials | Micro LED | ||||||||||||||||||||||||||||||||||
inspection equipment | |||||||||||||||||||||||||||||||||||
Laser transfer | |||||||||||||||||||||||||||||||||||
Optical fiber | Display | ||||||||||||||||||||||||||||||||||
Cleaning and release solvent | |||||||||||||||||||||||||||||||||||
Circuit formation | Dicing | Assembly and sealing |
Semiconductor infrastructure -related products | (1) | Semiconductor film -related products | ||||||||||||||
Cleaning technology | wastewater reuse | Release film for semiconductor molds | ||||||||||||||
Water | Air | Chemical | ||||||||||||||
(2) | ||||||||||||||||
liquid | ||||||||||||||||
Flexible Printed Circuit Boards | ||||||||||||||||
Films for Multilayer | ||||||||||||||||
Clean | ||||||||||||||||
room | Semiconductor | Gas separation and recycling | Ceramic Capacitors | |||||||||||||
RO membranes Reuse | (MLCC) | |||||||||||||||
Equipment | ||||||||||||||||
Manufacturing | ||||||||||||||||
for ultrapure | ||||||||||||||||
water production | ||||||||||||||||
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II
R&D Initiatives
(1)Semiconductor infrastructure -related technology
(2)Semiconductor-related technology: Release film for semiconductor molds (3)Optoelectronic fusion-related technology
(1) Semiconductor Infrastructure-related Technology
Si wafer
Chip placement, | Molding | |||
Wafer processing | Dicing | Redistribution, etc | Final test | |
Front-end process | Back-end process | |||
RO membranes
Water filtration | |||
Silica | Urea | High silica | |
removal rate | |||
High urea | |||
removal rate | |||
⇒ Suitable for | |||
wastewater | |||
reclamation | |||
Factory | |||
Waste | |||
Used RO | Performance | Reuse of | |
membrane | recovery | RO |
Reduction of waste membrane
Air filter material
Air cleaning
Clean
roomSemiconductor
Manufacturing
Equipment
Nanofiber
Microporous film
PFAS-free
Filter material for resist
Clean chemical liquids
Photoresist
Filter media
Removal of microscopic impurities
gas separation
Collection and recycling of gas
N2 | He | Large gas | |
H2 | N2, etc. | ||
Selective separation membrane of the gas
Collection of rare/high-priced gases
We have not only materials but also technologies that contribute to yield improvement and
environmental-friendliness
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(1) Semiconductor-Infrastructure-Related Technology:
High-Silica-Removing Reverse Osmosis (RO) Membrane
RO elements
Separation layer
(cross-linked polyamide)
Raw
water | Surface |
Supporting layer | ||||||||
Permeate | ||||||||
(Non-woven fabric, etc.) | High surface area and thin | |||||||
water | protuberance structure | |||||||
for high water permeability | ||||||||
Solute | Ion | Neutral molecule | ||||||
Examples | Na+ SO42- | Silica, boron, and urea |
Removal | |
mechanism | |
Polyamide | |
Size exclusion | ONLY size exclusion |
+ | |
Electric repulsion | Hard to remove |
For high rejection, pore size control is important.
Performance
For next-generation
100 | |||||||
2nd target (<2nm node) | |||||||
99.9 | |||||||
[%] | 99.8 | New-productTBW-HR | 1 | st | target | ||
(Launched in 2022) | |||||||
rejection | |||||||
99.6 | Energy-saving Type | ||||||
99.5 | (Under development) | ||||||
99.4 | Toray | ||||||
Silica | |||||||
(TMD) | Competitor | Competitor | |||||
B | A | ||||||
99.2 | Toray | ||||||
Performance line of Toray's | (TMGD) | ||||||
conventional membrane | |||||||
99.0 | 20 | 25 | 30 | 35 | 40 | ||
Flux [m3/day] |
High-silica-removal and high-water production was achieved through pore structure and surface structure control
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(1)Semiconductor-Infrastructure-Related Technology:
Wastewater Reuse for Securing Water Sources
Ultrapure water sources | Negative effect of urea | Exposure |
Water Demand/Supply Forecast (2030)
*From METI data
Estimated supply: about 60% of demand
(trillion m3) | ⇒ Considering utilization of wastewater reuse |
hydrolysis
Mask
NH3 NH3 NH3
8
7
6
5
4
3
Drinking | Water |
Industrial | Shortage |
Agriculture | River |
Example of wastewater reuse
Wastewater reuse plant for drinking water using our membranes
Water production capacity:
NH3
Gas
Ureageneration
H+
Resist
H+
H+ | H+ |
Substrate NH3
2
1
0
Groundwater | |
Sea water | |
Demand forecast | Supply forecast |
56,000 m3/day
Photograph :
Albert Robles Center
Acid inactivation (neutralization) in resist ⇒ Photosensitive inhibition
Pattern defect generation
Comparison of water quality
Recycled wastewater | Tap water | |
TOC* | 5-10 mg/L | < 4 mg/L |
(Organic index) | ||
Urea * | 30 μg/L | 10 μg/L |
*Science of the Total Environment 785 (2021) 147254
Formation of
Insoluble
layer
Hemming
bottom
Urea concentration is 3 times higher than tap water. Large risk of yield
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