Toray Industries, Inc. TSE:3402
Toray Industries : Overview of Semiconductor Inspection Equipment Business
Source: MarketScreener
TORAY IR Seminar
Toray Group's Initiatives for Digital Innovation Business
Overview of Semiconductor
Inspection Equipment Business
September 13, 2024
Toray Engineering Co., Ltd. Director, Vice President, Mechatronics & Fine Technology Business Div., President, TASMIT, Inc.
Kenji Sato
Contents
- Toray Engineering's Semiconductor-related Business
- Overview of Toray Engineering (TRENG)
- Semiconductor-relatedBusiness of Toray Engineering (TRENG)
- Semiconductor Inspection and Measurement Equipment Business
- Overview of TASMIT
-
Growth of the Semiconductor Market and TRENGMI's
Inspection and Measurement Equipment
III. Conclusion
Copyright © 2024 Toray Industries, Inc. | 1 |
I
Toray Engineering's Semiconductor-related Business
1. Overview of Toray Engineering (TRENG)
Established
Head Office
Paid-in Capital
Revenue
(consolidated)
August 10, 1960
Head Office
6th Floor, Yaesu Ryumeikan Bldg., 3-22, Yaesu 1-chome,Chuo-ku, Tokyo
Second Headquarters
1-1, Sonoyama 1-chome, Otsu, Shiga
(Inside the Toray Industries, Inc., Shiga Plant)
1.5 billion yen
129.6 billion yen
(FY 2023)
Representative
Number of
Employees
(consolidated)
Main Business
Locations
Takashi Iwade
President and Chief Executive Officer
2,088
(as of March 31, 2024)
- Seta Plant (Shiga)
- FA Innovation Center (Shizuoka)
- Yokohama Office (Kanagawa)
- Shanghai
- Seoul
- Taipei
- Munich
Copyright © 2024 Toray Industries, Inc.
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1. Overview of Toray Engineering (TRENG)
Basic Strategy for Growth
• Development of the business brand "TRENG"
• Promotion of design
Sustainability Initiatives
Promotion of
"Sustainable Engineering"
Brand
management
In line with the Toray Group Sustainability Vision, promoting the provision of plants and manufacturing
Strategy
A company and its | ||
employees | ||
changing and | ||
Human | growing together | |
Business | ||
Resources | ||
Strategy | ||
Strategy | ||
equipment that contribute to the realization of a sustainable society for our customers.
Carbon
Neutrality
Nature | Circular |
Positive | Economy |
- Increase in sales per employee
- Strengthening investment in human capital
- Selective expansion of existing businesses with strengths
- Creation of new businesses
Life
DigitalInnovation
Innovation
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1. Overview of Toray Engineering (TRENG)
Key Areas for Business Expansion
Key Areas of TRENG | Main Products of the TRENG Group | |||
・LiB-related facility | Green Coater | |||
Environmentally-friendly | ||||
EV, FCV | ・Power semiconductor inspection equipment | LIB coater | ||
・Semiconductor molding equipment | ||||
・Fuel cell (FC) manufacturing equipment | ||||
・Flip chip bonder | Semiconductor inspection system INSPECTRA and NGR | |||
INSPECTRA | ||||
Semiconductor | ・Semiconductor inspection system | |||
・Laser micro trimming equipment | ||||
・Semiconductor material manufacturing plants | ||||
・High potency bulk drug manufacturing | Surgical support | High potency | ||
Pharmaceuticals, Medical | plant | robot, Saroa | active | |
pharmaceutical | ||||
・Surgical support robot | ||||
ingredient plant | ||||
・Nucleic acid drug manufacturing equipment | ||||
Next Generation FPD | ・μLED manufacturing equipment | |||
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2. Semiconductor-related Business of Toray Engineering (TRENG)
Equipment
Mask Process | ||||
Design | Manufacturing | Inspection | ||
Electron beam wafer inspection and measurement equipment
NGR
Awarded "Semiconductor of
the year 2022" at Sangyo
Times news paper
Optical wafer appearance inspection | Bonder |
equipment | |
(Mounting equipment) | |
INSPECTRA | |
Electronic Device Industry News
Semiconductor of the Year
2023 Excellence Award
2024 Excellence Award
Wafer
Oxidation PR Coating Exposure
Front-end Process
Exposure/ | Etching |
Development |
Back-end Process
Flattening | Electrode | Inspection | Singulation | Mounting | Molding |
Formation | |||||
Final
Inspection
Unit
Ultrasonic transducer | Oxygen concentration meter | |
(Ultrasonic flaw detection inspection) | (Oxygen concentration control in manufacturing process) | |
Semiconductor material | [Today's explanation] | |
Plant | ||
TASMIT (TRENGMI) | ||
manufacturing plant | ||
Semiconductor inspection equipment | ||
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II
Semiconductor Inspection and Measurement
Equipment Business
1. Overview of TASMIT
- Company name: TASMIT, Inc. (TRENGMI)
- Major shareholder: Toray Engineering Co., Ltd. (TRENG)
- Business scale: Revenue 8.9 billion yen (FY 2023)
- Head office location: Yokohama, Kanagawa Pref.
- Domestic bases: Seta Office (Otsu, Shiga Pref.)
- Overseas bases: Utilizes Toray Engineering's overseas bases
- Main products:
1 μm = 0.001 mm
1 nm = 0.001 μm = 0.000001 mm
◆Optical Wafer Inspection Equipment (INSPECTRA)
◆Electron Beam Wafer Inspection and Measurement
Equipment (NGR)
High-speed,
High-definition
Inspection
Hybrid
Inspection
Die to Statistical
Image
■ 3μm sensitivity at 100WPH @300mm
■ 100%, full-surface inspection to eliminate defective product outflow
■ Capable of various inspections such as fluorescence inspection and differential interference inspection
■ Comparison inspection with statistical image data of mass production products
■ Algorithm with minimal over-detection
Wide Field, Low
Distortion
Image
High Sensitivity
Die to Database
algorithm
■ Maximum field of view: 70μm × 70μm
■ Image distortion within 0.01%
■ Thousands of data points obtained in one measurement
■ High resolution: 1.8nm
(= Detection sensitivity required for cutting- edge devices below 3nm)
- Capable of high-speed,high-precision comparison and measurement between design data and SEM images
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Optical vs. Electron Beam
Optical wafer inspection equipment | 970 μm | *1 Relay lens: 0.81x, objective lens magnification 20x |
μm | Resist coating irregularities | Film peeling | Scratches | Abnormalities in PAD | ||
693 | ||||||
Resolution: 0.28 μm | Substrate | Substrate color | Pattern abnormalities | Aluminum peeling | ||
contamination | irregularities | |||||
70 μm | Pattern shape inspection | |||||
・ | Alignment | |||||
FOV = | and measurement | |||||
300 mm | EPE | |||||
μm | CD | |||||
70 | ||||||
EPE | ||||||
Electron beam wafer inspection and | Resolution: 1.8 nm | 1 μm = 0.001 mm | ||||
1 nm = 0.001 μm = 0.000001 mm | ||||||
measurement equipment | ||||||
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