TongFu Microelectronics Co Ltd SZSE:002156:
SAYS IT AIMS TO RAISE UP TO 4.4 BILLION YUAN ($630.13 million) IN SHARE PRIVATE PLACEMENT TO FUND PROJECTS, BOOST CAPITAL, REPAY BANK LOANS
($1 = 6.9827 Chinese yuan renminbi)
Tongfu Microelectronics Plans Share Private Placement
Earlier from Tongfu Microelectronics Co., Ltd. Class A
- TongFu Microelectronics To Issue Debt Financing Tools
- Tongfu Microelectronics: Net profit surged 95.08% in Q3 2025 on strong sales and investment returns
- TongFu Microelectronics Q3 Net Profit Up 95.1% Y/Y
- Tongfu Microelectronics: H1 2025 revenue up 17.67%, net profit up 27.72%, led by AI and automotive demand