Tongfu Microelectronics Plans Share Private Placement

About this update from Tongfu Microelectronics Co., Ltd. Class A

TongFu Microelectronics Co Ltd SZSE:002156:SAYS IT AIMS TO RAISE UP TO 4.4 BILLION YUAN ($630.13 million) IN SHARE PRIVATE PLACEMENT TO FUND PROJECTS, BOOST CAPITAL, REPAY BANK LOANS($1 = 6.9827 Chinese yuan renminbi)

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