Tokyo Electron : Presentations（979KB）

FY2026 (April 2025-March 2026) Financial Announcement

April 30, 2026 Agenda:

• Consolidated Financial Summary

Investor Relations / April 30, 2026 1

Hiroshi Kawamoto, SVP & GM, Division Officer of Finance Division

• Business Environment and Financial Estimates

Toshiki Kawai, Representative Director, President & CEO

FY2026 Consolidated Financial Summary

April 30, 2026 Hiroshi Kawamoto

Investor Relations / April 30, 2026 3

SVP & GM, Division Officer of Finance Division

Financial Summary (Quarterly)

(Billion yen)

1. In principle, export sales of Tokyo Electron's products are denominated in yen. Although some sales and expenses are denominated in foreign currencies, the impact of foreign exchange rate fluctuations on profits is negligible, unless extreme fluctuations occur.

2. Profit ratios are calculated using full amounts, before rounding.

3. FY20xx refers to the financial year ending in March 20xx.

Composition of Net Sales by Region (Quarterly)

（Billion yen）

700

654.5 655.4

630.0

711.8

11.6%

Japan

600

500

400

547.2 555.0 566.5

10.4%

5.1%

8.8%

10.6% 14.1%

4.2%

2.8%

12.2%

15.0% 14.1%

14.4%

6.9%

8.8%

2.4%

17.5%

18.3%

8.1%

7.1%

3.1%

22.4%

20.7%

549.5

11.7%

7.9%

2.6%

16.1%

8.4%

6.1%

1.7%

21.1%

19.0%

552.0

7.1%

5.1%

2.3%

27.1%

8.0%

4.2%

24.3%

North America Europe

South Korea

300

200

10.1%

3.2%

3.1%

13.3%

3.7%

3.4%

4.3%

20.3%

2.8%

3.4%

20.3%

6.3%

22.0%

3.1%

Taiwan

Southeast Asia, Others

100

0

47.4% 49.9% 41.3%

4Q

1Q 2Q 3Q 4Q

FY2024

FY2025

42.7%

34.3%

38.6%

40.3%

31.8%

1Q 2Q 3Q 4Q

FY2026

26.8%

China

Japan

Q4

56.7

Q1

38.5

Q2

52.6

Q3

45.3

Q4

53.4

Q1

64.3

Q2

52.9

Q3

39.3

Q4 82.8

China

259.1

277.0

233.9

279.4

224.6

212.1

254.1

175.5

190.7

Financial Summary

(Billion yen)

1,092.0

45.3%

593.0

24.6%

550.0

1,200.05

290.0

86.0

1. In principle, export sales of Tokyo Electron's products are denominated in yen. Although some sales and expenses are denominated in foreign currencies, the impact of foreign exchange rate fluctuations on profits is negligible, unless extreme fluctuations occur.

2. Profit ratios are calculated using full amounts, before rounding.

Financial Trend (FY2022~FY2026)

（Billion yen）

2,500

2,000

1,500

1,000

500

60%

40%

20%

0 0%

Net sales reached record high

SPE New Equipment Sales by Application

（Billion yen）

2,000

1,500

1,000

500

31%

31%

27%

7%

10%

7%

62%

66%

59%

• DRAM:

  • Investment in HBM and leading-edge technologies remained strong

• Non-volatile memory:

  • Customers' fab utilization improved, and investments showed a gradual recovery. Both revenue and proportion increased

• Non-memory:

  • Robust investment in leading-edge equipment

    0

    FY2024 FY2025 FY2026

    1. SPE: Semiconductor Production Equipment

    2. Percentages on the graph show the composition ratio of new equipment sales. Field Solutions sales are not included.

Field Solutions Sales

（Billion yen）

600

500

• Field Solutions sales for FY2026 were

190.0

149.1

104.0

389.1

435.9

324.4

626.0 billion yen, up 16.3% YoY

400

300 ▪ Customers' fab utilization climbed further;

parts & services and modifications

200 delivered solid growth

100

0

FY2024 FY2025 FY2026

Balance Sheet (Quarterly)

Assets Liabilities and Net Assets

480.3

713.1

561.2

573.9

35.5

35.7

36.4

589.3

37.5

(Billion Yen)

2,625.9

2,509.3

2,667.0 2,635.0

2,860.9

Cash and cash equivalents*

Notes and accounts receivable (trade, and contract assets)

(Billion Yen)

2,625.9

2,509.3

2,667.0 2,635.0

2,860.9

Liabilities

Q4 Q1 Q2 Q3 Q4

Inventories

Other current assets Tangible assets Intangible assets

Investment and other assets

Q4 Q1 Q2 Q3 Q4

Net assets

*Cash and cash equivalents: "Cash and deposits" + "Short-term investments", etc. ("Securities" in Balance Sheet).

Cash Flow (Quarterly)

(Billion Yen)

300

205.7 239.0

33.2

-23.0

-14

-79.9

-46.9

-150.8

200

100

0

-100

9.9

-200

-300

*1 Cash flow from investing activities excludes changes in time deposits and short-term investments.

*2 The amount for share repurchase excludes the cost incurred to purchase odd-lot shares.

*3 Free cash flow = "Cash flow from operating activities" + "Cash flow from investing activities" (excluding changes in "Time deposits" and "Short-term investments").

*4 Cash on hand includes "Cash and cash equivalents" + "Time deposits and short-term investments" with original maturities of more than three months.

Total Return Amount

(Billion yen)

500

287.4

*2

31.3

Commemorative

dividend

400

300

200

422.7 437.4

Share Repurchase Dividend

100

0

FY2021 FY2022 FY2023 FY2024 FY2025 FY2026

*1 https://www.tel.com/news/ir/2026/kn008f00000000ho-att/20260327_002_e.pdf

*2 The year-end dividend for FY2026 is provisional and pending approval by the Board of Directors.

Combined with share buyback, total return amount is expected to be record high

Business Environment and Financial Estimates

April 30, 2026 Toshiki Kawai

Investor Relations / April 30, 2026 13

Representative Director, President & CEO

Business Highlights for FY2026

• Net Income

  • Q4: 214.2 billion yen

  • FY2026: 574.4 billion yen

• Net Sales

  • Q4: 711.8 billion yen

  • FY2026: 2,443.5 billion yen

• Under Construction

- New production building at Miyagi: implementing TEL's Smart Production concept

• Construction Completed

  • R&D center: Miyagi and

    Kumamoto

  • Production & logistics center at Iwate

• Advanced Packaging

- PORs in multiple products

• Memory

- Leading position in major processes such as DRAM capacitors, HBM interconnects

Business Environment (WFE Market Outlook as of April 2026)

($B) 150

100

50

0

WFE Market Trend

CY2024 CY2025 CY2026 CY2027

• WFE Market Outlook: (CY2026-27)

  
  
  

  • Projected range:

    $150B-170B/year

    (20%+ growth vs CY2025)

  • Leading edge applications: 30%+ growth

  • Geopolitical risks require close monitoring

FY2027 Revenue Drivers

Financial Estimates for FY2027

（Billion Yen）

• FY2027 H1：

  Forecast record high of net sales, gross profit and operating profit driven by AI server demand

• Incremental shipping for DRAM and leading-edge logic in latter CY2026

• Monitoring the impact of blockade in the Strait of Hormuz

FY2027 SPE New Equipment Sales Forecast

（Billion yen）

1,200

1,000

800

600

400

200

Sales by Application

57%

61%

8%

12%

1,200.0

（Logic, foundry, others）

0

FY2026 H1 FY2026 H2 FY2027 H1

Estimate

* Percentages on the graph show the composition ratio of new equipment sales. Field solutions sales are not included.

SPE new equipment sales to grow by 41% YoY

FY2027 R&D Expenses and Capex Plan

Miyagi Development Building No. 3 Kumamoto Process Development Building

Etch system

Coater/developer, cleaning system

（Billion Yen）

R&D expenses

330.0

250.0

277.8

191.1

202.8

400

300

200

100

Kurokawa-gun, Miyagi Prefecture

Completed in April 2025

Tohoku Production and Logistics Center

Deposition system

Oshu-city, Iwate Prefecture

Completed in November 2025

Koshi-city, Kumamoto Prefecture

Completed in October 2025

Miyagi Innovative Production Center

Etch system

Kurokawa-gun, Miyagi Prefecture

Completion scheduled for summer 2027

0

Capex

Depreciation

216.0

162.1

190.0

121.8

74.4

80.9

100.0

42.9

52.3

62.1

（Billion Yen）

300

200

100

0

FY2023 FY2024 FY2025 FY2026 FY2027

Estimate

FY2023 FY2024 FY2025 FY2026 FY2027

Estimate

Continue strengthening competitiveness with a focus on R&D investment Leveraging this solid infrastructure to steadily capture future gains

Dividend Forecast

(Yen)

300

Dividend per Share

200

100

0

H1

FY2024

H2 FY2024

H1 FY2025

H2 FY2025

H1 FY2026

H2 FY2026

H1 FY2027

(Estimate)

Dividend per share for H1 FY2027 (interim dividend) is expected to be 361 yen

TOKYO ELECTRON

Appendix

Investor Relations / April 30, 2026 22

Yearly

Financial Performance (Quarterly)

(Billion Yen)

600

400

200

711.8

46.8%

28.9%

214.2

205.6

60%

40%

20%

0%

Yearly

SPE New Equipment Sales by Application (Quarterly)

(Billion yen)

600

500

400

300

417.0 431.5 415.0

26%

2%

510.6 503.9

395.0

455.0

385.1

540.1

200

63%

72%

51%

64%

59%

100

0 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

1. SPE: Semiconductor Production Equipment

2. Percentages on the graph show the composition ratio of new equipment sales. Field Solutions sales are not included.

Yearly

Field Solutions Sales (Quarterly)

(Billion yen)

200

160.3 161.6 162.8

150

100

50

0 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

Yearly

SPE New Equipment Sales by Product

（Billion yen）

2,000

1,692.7

1,775.4

1,499.0

27%

26%

1,372.7

28%

23%

30%

35%

34%

36%

39%

32%

22%

19%

21%

20%

21%

11%

5%

12%

13%

1%

5%

1%

12%

3%

9%

2%

4%

2%

5%

2%

1,861.1

1,500

1,000

500

Yearly

Sales by Region

（Billion yen）

2,500

2,431.5 2,443.5

2,209.0

10.9%

7.8%

9.8%

2,003.8

11.5%

10.0%

3.1%

6.8%

2.8%

15.6%

13.4%

1,830.5

10.1%

9.2%

6.5%

16.8%

22.3%

5.4%

8.3%

19.0%

16.2%

16.9%

15.6%

20.4%

3.7%

18.0%

19.6%

11.2%

3.0%

3.8%

4.4%

5.5%

41.7%

44.4%

34.1%

28.3%

23.9%

2,000

1,500

1,000

500

27%

20%

World Market Share of Major Products (CY2025)

91%

27%

23%

Coater/Developer Dry Etch System

Deposition System Cleaning System

Wafer Bonder

15%

38%

31%

ALD CVD Oxidation/Diffusion

Source

SPE (excluding Wafer Prober) : Gartner®, Market Share: Semiconductor Wafer Fab Equipment, Worldwide, 2024, Bob Johnson and Menglin Cao, 2 April 2026, Revenue from Shipments basis. Chart created by TEL based on Gartner research. Gartner research. Calculations performed by TEL.

Coater/Developer: Photoresist Processing (Track), Dry Etch System: Dry Etch, Deposition System: Tube CVD + Atomic Layer Deposition Tools + Oxidation/Diffusion Furnaces + Nontube LPCVD, ALD: Atomic Layer Deposition Tools, CVD: Tube CVD + Nontube LPCVD, Oxidation/Diffusion: Oxidation/diffusion Furnaces, Cleaning System: Single Wafer Processors + Wet Stations + Batch Spray Processors + Scrubbers + Other Clean Equipment, Wafer Bonder: Wafer Bonder.

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Tokyo Electron

Investor Relations / April 30, 2026