Tokyo Electron : Presentations（903KB）

Q3 FY2026 (October - December 2025) Financial Announcement

February 6, 2026 Agenda:

• Consolidated Financial Summary

Investor Relations / February 6, 2026 1

Hiroshi Kawamoto, SVP & GM, Division Officer of Finance Division

• Business Environment and Financial Estimates

Toshiki Kawai, Representative Director, President & CEO

Q3 FY2026 Consolidated Financial Summary

February 6, 2026 Hiroshi Kawamoto

Investor Relations / February 6, 2026 3

SVP & GM, Division Officer of Finance Division

Financial Summary (Quarterly)

(Billion yen)

1. In principle, export sales of Tokyo Electron's products is denominated in yen. Although some sales and expenses are denominated in foreign currencies, the impact of foreign exchange rate fluctuations on profits is negligible, unless extreme fluctuations occur.

2. Profit ratios are calculated using full amounts, before rounding.

3. FY20xx refers to the financial year ending in March 20xx.

Financial Performance (Quarterly)

(Billion Yen)

600

400

60%

552.0

42.7%

21.0%

116.1 118.5

40%

200

20%

0%

Composition of Net Sales by Region (Quarterly)

（Billion yen）

700

654.5 655.4

630.0

600

500

463.6

12.4%

547.2 555.0 566.5

7.0%

10.4%

15.0%

5.1%

8.8%

10.6% 14.1%

2.8%

6.9%

8.8%

9.3%

2.4%

17.5%

8.1%

7.1%

3.1%

22.4%

549.5

11.7%

7.9%

8.4%

6.1%

1.7%

21.1%

552.0

7.1%

5.1%

2.3%

Japan

North America Europe

400

300

200

6.3%

9.1%

12.5%

10.0%

2.8%

10.1%

3.2%

12.2%

14.4%

3.1%

4.2%

14.1%

13.3%

3.7%

18.3%

3.4%

20.7%

4.3%

2.6%

16.1%

20.3%

2.8%

19.0%

3.4%

27.1%

20.3%

6.3%

South Korea

Taiwan

Southeast Asia, Others

100

46.9% 47.4% 49.9% 41.3%

42.7%

34.3%

38.6%

40.3%

31.8%

China

0

FY2024

FY2025

FY2026

China

217.2

259.1

277.0

233.9

279.4

224.6

212.1

254.1

175.5

SPE New Equipment Sales by Application (Quarterly)

(Billion yen)

600

DRAM

Non-volatile memory

500

Non-memory (Logic, foundry, others)

417.0 431.5 415.0

400

510.6 503.9

395.0

455.0

385.1

300

353.0

26%

2%

200

63%

72%

51%

64%

59%

100

0 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3

1. SPE: Semiconductor Production Equipment

2. Percentages on the graph show the composition ratio of new equipment sales. Field Solutions sales are not included.

Field Solutions Sales (Quarterly)

(Billion yen)

200

139.5

141.5

138.9

141.2

119.3

118.1

104.4

160.3 161.6

150

100

50

0 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3

Balance Sheet (Quarterly)

Assets Liabilities and Net Assets

(Billion Yen)

2,501.9

75.0

2,625.9

2,509.3

2,667.0 2,635.0

Cash and cash equivalents*

Notes and accounts receivable (trade, and contract assets)

Inventories

Other current assets

(Billion Yen)

2,005.2

2,004.6

629.7

662.3

2,501.9

2,625.9

2,509.3

2,667.0 2,635.0

Liabilities

Net assets

431.4

34.2

389.6

561.2

35.7

397.4

573.9

36.4

388.8

Tangible assets

Intangible assets Investment and other assets

Q3

Q4

Q1

Q2

Q3

FY'25

FY'26

35.8

347.6

Q3 Q4 Q1 Q2 Q3 Q3 Q4 Q1 Q2 Q3

*Cash and cash equivalents: "Cash and deposits" + "Short-term investments", etc. ("Securities" in Balance Sheet).

Cash Flow (Quarterly)

(Billion Yen)

300

200

100

0

-23.0

83.1

1.2

84.3

-100

-200

-79.9 -46.9

-122.3

Share Repurchase

-300

*1 Cash flow from investing activities excludes changes in time deposits and short-term investments.

*2 Free cash flow = "Cash flow from operating activities" + "Cash flow from investing activities" (excluding changes in "Time deposits" and "Short-term investments").

*3 Cash on hand includes "Cash and cash equivalents" + "Time deposits and short-term investments" with original maturities of more than three months.

Business Environment and Financial Estimates

February 6, 2026 Toshiki Kawai

Investor Relations / February 6, 2026 11

Representative Director, President & CEO

Market Environment (WFE Market Outlook as of February, 2026)

• CY2026: Expect 15%+ growth

  • Rapid expansion of chip demand for AI servers is driving significant increase in leading-edge logic and DRAM investment

  • Variables: Customer fab cleanroom space, lead times (parts/component supply, labor), exchange rates, etc.

• Over the mid- to long-term, investment in leading-edge semiconductors is expected to continue expanding, driven by strong demand for AI applications

  • DRAM: Investments in both general-purpose DRAM and HBM are surging, with strong demand to bring investment timelines forward

  • NAND: Rapid increase in demand for SSDs. Utilization rate rising, leading to momentum for new investments

  • Logic/foundry: Investment in leading-edge nodes accelerates, with progress in advanced packaging

  • Mature nodes: WFE spending is expected to remain at similar levels

    Demand for high-value-added equipment expected to grow

    Expanding Business Opportunities in Leading-edge Technologies

    * POR (Process of Record): Certification of the adoption of equipment in customers' semiconductor production processes

    Etch
    Coater/Developer
    Deposition
    Cleaning
    Prober
    Bonder/ Laser-related
    Display

    • DRAM: HBM interconnect (POR) / Capacitor (POR in all major customers)

    • NAND: Slit (POR) / Channel hole (POR)

    • Logic: Advanced packaging (POR)

    • Progress in Ultimate Wet Development technologies for metal oxide resist

    • Newly released CLEAN TRACK LITHIUS Pro DICE

    • Logic: Capacitor high-k material deposition for advanced packaging (POR), evaluation started for gap-filling process with single-wafer plasma CVD

    • NAND: Novel low-resistance metal for word line (POR)

    • DRAM: Evaluation started with multiple customers for next generation super critical technology

    • Logic/memory: Evaluation ongoing with multiple customers for resist stripping (one POR)

    • Logic/memory: Evaluation started for hybrid batch & single-wafer system

    • Logic: Dominating the advanced logic market for AI/HPC; prober sales to exceed 100B yen in FY2027

    • Die prober: Evaluation started with multiple customers. Release scheduled in April 2026

    • Temporary bonder/debonder: HBM wafer thinning

    • Permanent bonder: NAND cell + peripheral circuit, logic backside PDN, advanced packaging

    • Laser liftoff/trimming: Process evaluation progressing with multiple customers

    • Bonder/laser related tools: Expect over 500B yen in accumulative sales in 5 years

    • With over 80% share in etch, deployed of high value-added equipment for IT OLED

    With the expansion of leading-edge applications in the equipment business, AI-related demand is also driving growth in Field Solution opportunities

    Business Progress

    
    
    
    
    

• New tools released to enhance productivity and environmental performance

  • CLEAN TRACK LITHIUS Pro DICE :

    
    
    

    • Latest coater/developer equipped with world-class productivity and innovative defect control technology

  • EVAROS :

    • CVD/ALD tool capable of high-precision, high-quality deposition control with a maximum processing capacity of 200 wafers

• Wins recognition as a Clarivate Top 100 Global Innovator 2026

  • Received this prestigious award for the 6th time in recognition of consistently delivering high-impact innovations

  • Industry's largest number of active issued patents: 26,029 (as of end of December 2025)

Will keep investing in R&D actively to continuously

to create innovative, high-value-added proprietary technologies

Financial Estimates for FY2026

(Billion Yen)

* Changes from the figures announced on October 31, 2025

Full-year outlook revised upward based strong business environment.

Reflected extraordinary income from additional sales of strategic shareholdings

FY2026 SPE New Equipment Sales Forecast

Sales by Application

DRAM Non-volatile memory Non-memory (Logic, foundry, others)

(Billion Yen) (Billion Yen)

1,000

800

600

400

200

900.0

27%

33%

12%

11%

61%

56%

850.1

600

400

200

395.0 455.0 385.1

514.8

0 H1 H2 (E) 0 Q1 Q2 Q3 Q4 (E)

* Percentages on the graph show the composition ratio of new equipment sales. Field solutions sales are not included.

Updated SPE new equipment sales forecast for H2 FY2026 to 900.0 billion yen.

Q4 sales are expected to grow +30% QoQ

FY2026 R&D Expenses and Capex Plan

Miyagi Development Building No. 3

Etch system

Kumamoto Process Development Building

Coater/developer, cleaning system

R&D expenses

290.0

250.0

191.1

202.8

158.2

（Billion Yen）

300

200

100

Kurokawa-gun, Miyagi Prefecture

Completed in April 2025

Tohoku Production and Logistics Center

Deposition system

Oshu-city, Iwate Prefecture

Completed in November 2025

Koshi-city, Kumamoto Prefecture

Completed in October 2025

Miyagi Innovative Production Center

Etch system

Kurokawa-gun, Miyagi Prefecture

Completion scheduled for summer 2027

0

Capex

Depreciation

240.0

162.1

121.8

57.2

74.4

36.7

42.9

52.3

62.1

86.0

（Billion Yen）

300

200

100

0

FY2022 FY2023 FY2024 FY2025 FY2026

Estimate

FY2022 FY2023 FY2024 FY2025 FY2026

Estimate

Established capabilities to support technology innovation and rapid expansion of demand.

Leveraging this solid foundation, we will reap the future gains to maximize our corporate value.

FY2026 Dividend Forecast

(Yen)

800

600

Dividend per Share

570

467

(1,403)

dividend

393

(1,179)

260

(781)

Year-end 337

(1,711) Commemorative

592

(1,776)

601

(1,803)

TEL shareholder return policy

400

200

0

FY2021 FY2022 FY2023 FY2024 FY2025 FY2026

(E)

*Due to the stock split on April 1, 2023, the amount has been changed from 150 yen to 50 yen.

• Dividends per share from FY2021 to FY2023 are calculated on the assumption that the stock split was conducted at the beginning of FY2021.

• FY2023 includes the 60th anniversary commemorative dividends.

• Amounts before the stock split are shown in parentheses.

Full-year dividend estimates are revised upward to be record-high 601 yen per share

Acquisition of Treasury Stock

Plan to implement share repurchase of up to 150B yen

• Type of shares to be acquired: Shares of common stock

• Total number of shares to be acquired: Up to 7.5 million shares

  (Equivalent to 1.6% of outstanding shares excluding treasury stock)

• Total cost of acquisition: Up to 150 billion yen

• Period of acquisition: From February 9, 2026 to March 31, 2026

TEL will continue to manage our balance sheet appropriately, considering our ability to generate cash, necessary cash on hand and growth investment capital

Total Return Amount

(Billion yen)

500

400

31.3

422.7 426.2

300

200

100

121.9

Commemorative

dividend

219.3 267.9 302.4 Share Repurchase (Planned)

Share Repurchase (Completed)

Dividend

0

FY2021 FY2022 FY2023 FY2024 FY2025 FY2026

Estimate

*1 https://www.tel.com/news/ir/2026/i85lab00000000nn-att/02062026_002_e.pdf

Combined with share buyback, total return amount is expected to be record high

TOK'flLI ELECTRON

Invitation to Small Meeting Hosted by Tokyo Electron

For institutional investors and analysts This will be a follow-up session for the Q3 FY2026 earnings briefing.

• Date & Time:

  • English session Friday, February 20, 2026, 8:00 a.m.-9:00 a.m. (JST)

  • Japanese session Thursday, February 19, 2026, 10:30 a.m. - 11:30 a.m. (JST)

• Speakers:

  • Koichi Yatsuda, Global Head of Investor Relations

  • Junko Takagi, Vice President of Investor Relations

• Format:

  
  
  

  • Webinar

• Preregistration link:

  • https://app.msetsu.com/stocks/8035/ir_events

Investor Relations / February 6, 2026