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Teradyne Introduces Integrated Test Solution for AI and Data Center Devices in Collaboration with Tokyo Electron
Teradyne Introduces Integrated Test Solution for AI and Data Center Devices in Collaboration with Tokyo
About this update from Teradyne, Inc.
Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, today announced an integrated test cell solution supporting known good device (KGD) screening for devices used in AI and data center applications, developed in collaboration with Tokyo Electron (TEL™). The solution pairs Teradyne’s UltraFLEXplus platform with TEL’s Prexa™ SDP (Singulated Device Prober) to provide fabless designers, foundries, and OSATs a production-ready path to high-quality device screening at multiple points in the advanced packaging flow. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260608994172/en/Teradyne and Tokyo Electron (TEL) have collaborated to deliver an integrated test cell solution supporting known good device screening for devices used in AI and data center applications. The solution pairs Teradyne’s UltraFLEXplus platform with TEL’s Prexa™ SDP to provide fabless designers, foundries, and OSATs a production-ready path to high-quality device screening at multiple points in the advanced packaging flow. As AI and data center device architectures increasingly adopt chiplet-based designs that integrate multiple die into a single 2.5D or 3D package, a single defective die can compromise the entire high-value package. Adding KGD screening is essential to protecting final yield, improving quality, and maximizing output. The joint solution between Teradyne and TEL delivers a validated test cell designed to reduce integration risk for high-volume manufacturing. Within the test cell, Teradyne’s UltraFLEXplus instruments coordinate with TEL’s Prexa SDP, which maintains device temperature and manages the high-power dissipation characteristics typical of leading-edge AI silicon. Built on an open ecosystem architecture, the solution provides customers with flexibility across complementary probe cards, manipulators, and interface technologies, and can be integrated with other probers or testers as required. “AI device innovation is moving at an unprecedented speed, and our customers need dependable screening at every stage of advanced packaging,” said Shannon Poulin, president of the Semiconductor Test Group at Teradyne. “TEL’s industry-leading Prexa SDP, combined with Teradyne’s UltraFLEXplus, gives customers a production-ready solution that covers singulated device testing wit...