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Shangtai Technology Plans To Fund Via Bond Issue

Shangtai Technology Plans To Fund Via Bond Issue

Shijiazhuang Shangtai Technology Co., Ltd. Class AFebruary 2, 20265
Shangtai Technology Plans To Fund Via Bond Issue

About this update from Shijiazhuang Shangtai Technology Co., Ltd. Class A

Shijiazhuang Shangtai Technology Co Ltd SZSE:001301:SAYS CO PLANS TO RAISE 1.7 BILLION YUAN ($244.85 million) VIA BOND ISSUE TO FUND PROJECT($1 = 6.9430 Chinese yuan renminbi)

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