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SAWsense investment to accelerate scale-up
Transense Technologies plc has invested £0.4 million in a new high-precision die bonding machine to facilitate the commercial scale-up of its SAWsense division, bringing the total capital investment for the pilot SAW sensor installation line to over £1 million, funded by internal cash flow and asset-backed financing. This investment enables micron-level precision placement of SAW sensing elements, crucial for high-volume production of their patented Surface Acoustic Wave technology used in demanding applications across robotics, aerospace, automotive, and motorsport sectors. The new equipment supports prototyping and high-mix production, demonstrating capability for manufacturing hundreds of thousands to millions of units annually, and is a key step towards scalable revenue and significant volume contracts. Disclaimer*
About this update from Transense Technologies Plc
RNS Reach - non-regulatory announcement Transense Technologies plc ("Transense" or the "Company") Transense accelerates SAWsense scale-up with precision equipment investment Transense Technologies plc, a leading innovator in sensor technology and measurement systems, has taken delivery of a bespoke, high-precision die bonding machine to support the commercial scale-up of its SAWsense division. The £0.4m investment in this new machine marks a key step towards developing high-volume production processes for customers requiring highly repeatable sensor installations at scale and takes the capital investment for the pilot SAW sensor installation line to more than £1m. This investment programme has been funded by internally generated cash flow, augmented by an asset backed financing facility to provide additional headroom. Transense's patented Surface Acoustic Wave (SAW) technology is used to measure torque, force and temperature in safety and performance-critical applications, particularly in demanding environments such as robotics, aerospace, automotive, electric drive systems, and motorsport. The new equipment enables micron-level precision placement of SAW sensing elements onto shafts and other components, delivering consistent, repeatable installations suitable for high-volume production. SAWsense designs, supplies and licenses advanced SAW-based sensor solutions to leading aerospace, automotive and industrial customers, including GE Aerospace, Motion Applied and Airbus, alongside other confidential OEM and Tier 1 customers. The purchase follows an 18-month development programme, including trials at Newcastle University's Driving the Electric Revolution Industrialisation Centre (DER-IC) to define a production-ready process. The automated die bonder, based on commercially available equipment commonly used in semiconductor packaging, provides the accuracy and flexibility required for prototyping and high-mix production, and demonstrates process capability for future high-volume manufacturing from hundreds of thousands to millions of units per year. Ryan Maughan, Managing Director at Transense Technologies plc, commented: "This investment marks an important milestone for SAWsense as we transition from development into scalable manufacturing capability. "As demand for our wireless, passive sensing technology continues to grow globally, we aim to accelerate th...
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