Resonac : Launches R&D Center for Next-Gen Semiconductor Package Technology under U.S.-Japanese Consortium “US-JOINT”- Public and private sector representatives from Japan and the U.S. gather for ceremony in Silicon Valley

Opening Ceremony

The new R&D center is the first in the United States dedicated to developing advanced semiconductor-packaging technologies. Resonac and the consortium partners will leverage this R&D base in Silicon Valley to validate new concepts in collaboration with major users of advanced semiconductors. By capturing market needs in real time and combining the technological capabilities of leading Japanese and U.S. manufacturers of materials and equipment, the consortium will accelerate the research and development of materials, evaluation and packaging technologies to enable the rapid commercialization and deployment.

Hidehito Takahashi, President and CEO of Resonac, commented: "US-JOINT aims to shorten the proof-of-concept (PoC) period from approximately six months to as little as one month by enabling 12 participating Japanese and U.S. companies to conduct development in Silicon Valley, home to major hyperscalers. Through "collaboration" between semiconductor-related companies from Japan and the United States, the initiative will accelerate global semiconductor innovation."

Resonac will leverage US-JOINT's technological foundation and knowledge to play a central role in promoting co-creation while overseeing the consortium. As a materials manufacturer with a comprehensive understanding of the entire semiconductor manufacturing process, Resonac will bring together the technologies and ideas of participating companies to contribute to concept validation and accelerate co-creation targeted at market needs.

Dilip Vijay, Vice President and Head of Global IC Operations, Broadcom Inc., commented: "A collaborative effort like US-JOINT is exactly what the industry has needed. I am very much looking forward to the US-JOINT R&D center's full-scale operation in Silicon Valley. We expect this initiative to speed up semiconductor innovation and spark entirely new breakthroughs beyond what we see today."

Raja Swaminathan, Vice President of Heterogeneous Integration Technologies, Advanced Micro Devices, Inc., said: "With US-JOINT now fully operational in Silicon Valley, we expect face-to-face technical dialogue to lead to more efficient joint development through faster feedback and clearer understandings. We welcome US-JOINT's efforts and look forward to the innovations and strengthened ecosystem collaboration this initiative can enable."

Kazumi Nishikawa, Director-General for Economic Security Policy, Trade and Economic Security Bureau, Ministry of Economy, Trade and Industry, remarked: "The expansion of generative AI and the current requirements of computing demands more advanced packaging. I am very confident that US-JOINT is just the start of innovation for advanced packaging and chiplets in generative AI computing. Finally, I truly appreciate the effort that led to today, and I hope that today's one step can lead to a tremendous outcome for the U.S. and Japan and to the world."

• The latest milestone in technological collaboration and industry leadership
  Resonac is a world-leading supplier of semiconductor materials essential for each stage of semiconductor manufacturing. It also has a proven track record of promoting co-creation with material and equipment manufacturers in other consortia, including JOINT2 and JOINT3. Going forward, Resonac will leverage its operational capabilities and industry trust as a materials manufacturer to accelerate the efforts of US-JOINT and related collaborators to develop next-generation semiconductor packages.
  Advanced semiconductor packaging and improved performance support growth in key sectors, including generative AI and autonomous driving. Notably, new packaging concepts are emerging as major IT firms and hyperscalers begin designing their own custom AI semiconductors. A limited environment for rapid, practical validation has been a bottleneck in technology development, but consortium partners anticipate that US-JOINT will significantly accelerate validation trials and offer new packaging technologies moving forward.

  Partner Overview

  Company name	Azimuth Industrial Co., Inc.
  About	Azimuth specializes in fast-turn, complex assembly multi-chip QFN, BGA, SiP, and new package development for high power, high frequency, and unique substrate configuration.
  Position in Industry	A leading USA assembly company for quick turn assembly, engineering evaluations and customized semiconductor packaging, founded in 1972.
  Participating Technologies in US-JOINT	Low-volume, high-mix and pilot production assembly.

  Company name	KLA Corporation
  About	KLA develops industry-leading equipment and services that enable innovation throughout the electronics industry. KLA provides advanced process control and process-enabling solutions for manufacturing wafers and reticles, integrated circuits, packaging and printed circuit boards.
  Position in Industry	KLA's direct imaging systems, with innovative technologies such as large scan optics, are leading digital lithography solutions for PCB and IC substrate manufacturing.
  Participating Technologies in US-JOINT	Laser direct imaging systems

  Company name	Kulicke and Soffa Industries, Inc.
  About	Kulicke & Soffa is a global leader in semiconductor assembly technology, advancing device performance across automotive, compute, industrial, memory and communications markets.
  Position in Industry	Founded on innovation in 1951, K&S is uniquely positioned to overcome increasingly dynamic process challenges - creating and delivering long-term value by aligning technology with opportunity.
  Participating Technologies in US-JOINT	Fluxless thermo-compression bonder

  Company name	MEC COMPANY LTD.
  About	MEC provide technologies that enhance the reliability of electronic devices, including improved adhesion technology, fine wiring formation technology, and selective etching technology as core competencies, contributing to higher performance, miniaturization, weight reduction, and reduced power consumption of electronic products.
  Position in Industry	A global niche leader that provides chemical processes essential for the manufacture of cutting-edge semiconductor packaging substrates.
  Participating Technologies in US-JOINT	Metal activator and etcher

  Company name	Moses Lake Industries, Inc.
  About	Moses Lake Industries (MLI) specializes in wet chemicals used in the semiconductor industry for lithography, etch/clean, interconnect metallization applications, and custom bulk chemical blending.
  Position in Industry	MLI is a major supplier in both tetramethyl ammonium hydroxide (TMAH) and copper plating products for advanced semiconductor manufacturing.
  Participating Technologies in US-JOINT	Copper electroplating

  Company name	NAMICS Corporation
  About	NAMICS specializes in liquid encapsulant technology for semiconductors.
  Position in Industry	Globally leading technological capabilities in liquid encapsulants for semiconductors
  Participating Technologies in US-JOINT	Liquid compression molding materials and other liquid encapsulants for semiconductors

  Company name	TOKYO OHKA KOGYO CO., LTD.
  About	Tokyo Ohka Kogyo (TOK) specializes in microfabrication technology and high-purification technology.
  Position in Industry	A global top-class photoresist manufacturer
  Participating Technologies in US-JOINT	Photoresist for semiconductor packaging

  Company name	TOPPAN Inc.
  About	Development technologies for large-size and high-layer-count multilayer FC-BGA substrates for semiconductor packages
  Position in Industry	A leading global supplier of high-end FC-BGA substrates for data centers and advanced applications
  Participating Technologies in US-JOINT	FC-BGA substrates and interposers

  Company name	TOWA CORPORATION
  About	TOWA specializes in compression molding technology that realizes high reliability and productivity for narrow gap mold under fill.
  Position in Industry	Semiconductor molding equipment world market share No.1
  Participating Technologies in US-JOINT	Compression molding equipment

  Company name	ULVAC, Inc.
  About	ULVAC specializes in the development and manufacturing of process equipment for semiconductors and displays, sputtering materials, and vacuum components using vacuum technology.
  Position in Industry	ULVAC provides the market with industry-leading process equipment for deposition and plasma processing in the wafer-level package/panel-level package area.
  Participating Technologies in US-JOINT	Sputtering system and ashing system

  Company name	3M Company
  About	For more than 25 years, 3M has applied its core strength in materials science to help the semiconductor industry push technology forward. Through advanced solutions in planarization, wafer handling, and precision component transport, 3M enables customers to manufacture next-generation devices with greater consistency, yield, and speed. With global R&D and manufacturing in the U.S., Taiwan, Singapore, Japan, and other key regions, 3M partners closely with semiconductor leaders to solve critical process challenges and support innovation across the value chain.
  Position in Industry	3M is a materials science-based solutions partner supporting both legacy and advanced nodes. Rather than providing discrete components, 3M works directly with semiconductor fabs, OSATs, OEMs, and ecosystem partners to co-develop process-enabling materials that deliver tighter control, higher consistency, and improved cost of ownership. Leveraging more than 40 technology platforms and deep bench-to-bench technical engagement, 3M helps customers accelerate innovation in CMP, advanced packaging, and precision transport.
  Participating Technologies in US-JOINT	3M is contributing core semiconductor-enabling technologies including: CMP: Advanced CMP materials, including 3M™ Trizact™ CMP Pads and pad conditioning solutions designed for leading-edge nodes Wafer Support: Temporary wafer bonding and debonding solutions through the 3M™ Wafer Support System, supporting ultrathin wafer processing and advanced packaging flows Advanced packaging: Low loss dielectric bonding and build up film for advanced packaging IC substrate

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  Media Relations Group, Brand Communication Department

  https://www.inquiry.resonac.com/inquiryEn?typeId=brand_en&_ifbs-inquiryEnForm=s1_Input>Inquiry form

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