Lam Research : Establishes Panel-Level Packaging Center of Excellence in Salzburg, Austria

About this update from Lam Research Corporation

Lam Research Establishes Panel-Level Packaging Center of Excellence in Salzburg, Austria SALZBURG, Austria, May 20, 2026 - Lam Research Corp. (Nasdaq: LRCX) today announced the establishment of its Panel-Level Packaging Center of Excellence (CoE) in Salzburg, Austria, marking another milestone in the company's ongoing investment in advanced packaging technologies. Lam's new processing lab expands panel-level processing research and development (R&D) and enables closer customer collaboration to evaluate, refine, and scale solutions for evolving packaging needs to meet the demands of the AI era. The Salzburg site builds on the legacy of Semsysco GmbH, founded in Salzburg in 2012 and acquired by Lam Research in 2022. That acquisition added panel-level wet processing expertise and an additional European R&D base to Lam's global laboratory network. "The expansion of our Salzburg site reflects a long-term investment in advanced packaging," said Aaron Fellis, corporate vice president and general manager, Wet Equipment Technology Systems, Lam Research. "As demand for AI and high-performance technologies continues to grow, the industry must move faster from innovation to manufacturing readiness. Our Panel-Level Packaging CoE strengthens Salzburg's role within Lam's global innovation network and helps increase velocity in R&D through closer collaboration with customers and ecosystem partners." "Lam Research is a global titan in the semiconductor industry. For Salzburg, the opening of this Panel Center of Excellence is more than an honor; it is a testament to our standing as a high-tech location. This new campus, a state-of-the-art laboratory for panel-level processing, seamlessly bridges the gap from research and development to production," said Karoline Edtstadler, Governor of Salzburg. Purpose-Built to Increase R&D Velocity as the Industry Shifts from Wafer to Panel Artificial intelligence, high-performance computing, and heterogeneous integration are driving demand for larger, more complex semiconductor packages. As advanced package designs stretch the limits of round wafers, panel-level processing is being explored across the industry as a path to improved scalability and manufacturing efficiency. The Salzburg Panel CoE is designed to accelerate the panel-level packaging journey-bringing together panel-focused R&D, infrastructure and enginee...

View stock analysis, news, and events for Lam Research Corporation