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Intel Announces Leadership Appointment at Intel Foundry to Accelerate Development and Manufacturing
Intel Announces Leadership Appointment at Intel Foundry to Accelerate Development and
About this update from Intel Corporation
Intel Corporation today announced the appointment of Seok-Hee Lee as executive vice president of Intel Foundry, reporting directly to CEO Lip-Bu Tan. In this role, Lee will lead all advanced packaging, system integration, back-end technology development, and back-end manufacturing, strengthening Intel’s ability to deliver differentiated, system-level innovation for customers. Seok-Hee Lee Appointed to Lead Advanced Packaging As part of the continued evolution of the Intel Foundry strategy, the company is establishing advanced packaging as a focused business with dedicated leadership. This reflects the growing importance and complexity of packaging as a key enabler of performance, power efficiency, and heterogeneous integration across AI systems. “Advanced packaging and system integration are becoming defining capabilities for next-generation computing systems,” said Lip-Bu Tan, Intel CEO. “Seok-Hee brings deep expertise in leading complex, high-scale technology and manufacturing organizations, along with a strong track record of operational execution. Seok-Hee’s insights will help Intel further strengthen our system integration capabilities, allowing us to tightly couple leading-edge logic, memory, networking, and other components to build high-performance computing systems for Intel Foundry customers. He is the right leader to build and scale this critical part of the Intel Foundry business as we prepare to ramp advanced packaging technologies, including EMIB-T and HBI, to high volume for customers and partners.” Lee joins Intel from SK On, where he served as president and CEO, and previously served as president and CEO of SK hynix. A semiconductor veteran, he has also held engineering leadership roles at Intel and in academia, bringing deep expertise in advanced process technologies and large-scale manufacturing. “Intel is uniquely positioned to lead in advanced packaging as demand for system-level integration accelerates across AI and high-performance computing,” said Lee. “I’m excited to return home and to join the Intel team as we help advance the company’s technology leadership, manufacturing capabilities, and customer commitments in this critical area.” With this change, Naga Chandrasekaran, executive vice president of Intel Foundry, will continue to report to CEO Lip-Bu Tan and lead front-end technology development and front-end manufacturing as t...