Dr. Felix Grawert, CEO
Dr. Christian Danninger, CFO April 30th, 2026
This document may contain forward-looking statements regarding the business, results of operations, financial condition and earnings outlook of AIXTRON. These statements may be identified by words such as "may", "will", "expect", "anticipate", "contemplate", "intend", "plan", "believe", "continue" and "estimate" and variations of such words or similar expressions. These forward-looking statements are based on the current assessments, expectations and assumptions of the executive board of AIXTRON, of which many are beyond control of AIXTRON, based on information available at the date hereof and subject to risks and uncertainties. You should not place undue reliance on these forward-looking statements. Should these risks or uncertainties materialize or should underlying expectations not occur or assumptions prove incorrect, actual results, performance or achievements of AIXTRON may materially vary from those described explicitly or implicitly in the relevant forward-looking statement. This could result from a variety of factors, such as those discussed by AIXTRON in public reports and statements, including but not limited those reported in the chapter "Risk Report". AIXTRON undertakes no obligation to revise or update any forward-looking statements as a result of new information, future events or otherwise, unless expressly required to do so by law.
Due to rounding, numbers presented throughout this report may not add up precisely to the totals indicated and percentages may not precisely reflect the absolute figures for the same reason.
Our registered trademarks: AIXACT®, AIX-Multi-Ject®, AIXTRON®, Close Coupled Showerhead®, EXP®, EPISON®, Gas Foil Rotation®, HXP®, HYPERION®, Multi-Ject®, Planetary Reactor®, PVPD®, STExS®, TriJet® Financials Q1/2026: Inflection point due to optoelectronics demand surge▪
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Order Intake with EUR 171m driven by strong optoelectronics momentum (Q1/2025: EUR 132m)
Revenues of EUR 59m reflecting seasonality and limited customer demand in power electronics segments
Gross Profit at EUR 11m; Gross Margin at 18%;
EBIT at EUR -22m; EBIT Margin at -38%
impacted by low volume and a mid-single-digit EUR million
expense for personnel reduction in operations area
Operational & Strategic Update
Personnel measures implemented in Q1, strengthening the operational setup and supporting sustainable profitability
New production facility in Malaysia announced, enhancing long-term capacity, supply chain resilience and proximity to Asian customers while improving structural cost competitiveness
FY/2026 Guidance1 raisedRevenues FY/26E: EUR 560m ± 30m (before: EUR 520m ± 30m)
Gross Margin FY/26E: around 42% (before: 41% - 42%) incl. mid-single-digit EUR million expense
EBIT Margin FY/26E: 17% - 20% (before: 16% - 19%) for personnel reduction in operations area
Q2/2026 Guidance1Revenues Q2/26E: ~EUR 110m ± 10m
1 FY/26 Based on $1.20/€ Budget Rate
Market & Business Development
Optoelectronics showed strong momentum, with laser systems accounting for almost 70% of Q1/2026 order intake,
underlining the strong trend reversal. Major shipments are scheduled from Q2/2026 onward
SiC tool demand remained soft, reflecting ongoing customer underutilization; recovery is expected in H2/2026 or early 2027
GaN tool demand stayed stable at low level; demand anticipated to pick up later in the year due to higher customer utilization
LED / Micro LED had no material impact on Q1/2026 performance, with investments still cyclical and at low levels
EUR million
557
560 ± 30e
429
463
Q2/26-
Q4/26e
Q1/2026
630 633
2021 2022 2023 2024 2025 2026
Optoelectronics and Communication¹ LED incl. Micro LED GaN-Power SiC-Power
Other incl. R&D After Sales FY26 Guidance low end FY26 Guidance high end
Revenues | Gross Profit | Margin | EBIT | Margin | |
Q1 | € 59.4 m -47% YoY | € 10.8 m -68% YoY | 18% | € -22.3 m n.m. YoY | -38% |
FY/24 € 633.2 m € 262.5 m 41% € 131.2 m 21%
1% YoY -6% YoY -16% YoY
Gross Profit & EBIT both impacted by low volume and a mid-single-digit EUR million one-off expense for personnel measures in operations area
Q1 Opex cost yoy up mainly due to ~40% higher R&D cost
Working Capital1
Operating Cash Flow
Free Cash Flow
Cash Balance2
Q1
€ 263.6 m
€ -76.3 m vs. Q4/25
€ 53.6 m
€ +18.5 m YoY
€ 48.5 m
€ +18.7 m YoY
€ 272.7 m
€ +48.1 m vs. Q4/25
FY/24 € 446.9 m € 26.2 m € -72.4 m € 64.6 m
€ +93.9 vs. Q4/23 € +73.5 m YoY € +37.2 m YoY € -117.1 m vs. Q4/23
Operating cash flow positively impacted by further reduction in working capital
Pre payments starting to increase as order intake rises
Capex in Q1 was fairly stable yoy.
FCF with continuing improvement due to continued reduction of working capital
Working Capital = Inventories + Trade Receivables - Trade Payables - Contract Liabilities for Advance Payments; FX-effects excluded in illustrated Change in Working Capital
Including other current financial assets 6
Key transaction highlightsEUR 450m convertible bond
Five-year maturity (April 2031) with zero coupon, ensuring no cash outflow
Initial conversion price of EUR 50.375, representing a 30% premium to the reference share price
Effective conversion price of ~EUR 51.01 at maturity, reflecting accreted redemption amount
Potential dilution of approx. 7.9% of current share capital
AIXTRON's first-ever issuance of this instrument The net proceeds of the offering will be used for general corporate purposes, which may include investments to support organic growth, acquisitions, and share buybacks.Successful placement of convertible bond increases long term strategic & financial flexibility
Power ElectronicsSiC Power
EV main inverters and EV OBCs
EV charging infrastructure
Data centers: AC/DC
Wind & PV
Traction & large drives
SiC
GaN
GaN Power & RF
Fast charging / mobile devices
Data centers: AC/DC & DC/DC
Motor drives, e.g. white goods
AI power delivery
EV OBCs
Base stations
Optoelectronics / LEDsLasers
Optical data communication
3D sensing
LiDAR
Industrial power lasers
AsP
AsP
GaN
Micro LEDs / Specialty LEDs
Industrial displays (in/outdoor)
TVs
Smart watches / AR glasses
Automotive
Horticulture
G10-AsP Platform: Securing top-tier engagements
G10 AsP recognized as tool of record by leading customers -further engagements progressing with additional prospects.
Demand for InP-based edge-emitting lasers remained robust, driven by AI and datacenter applications
PICs driving the number of orders:
Multiple photonic components are integrated on a single chip, enabling faster, energy-efficient data transmission using light.
Transition from 75/100mm to 150mm wafer size is needed to leverage advanced processing of epiwafers
G10-AsP "in-situ clean" is ideally suited to multi-step processes of PIC devices
Applications: AI, data center, 5G, LiDAR and quantum computing.
G10-AsP:
Tool of record
Datacenters are an inflection point where copper wiring is being replaced by lasers The demand we see is only at its beginning and set to last…
The trend is expected to continue until 2030 and beyond
Hyperscaler AI CapEx 2024-2026 (USD Billions, estimated) Optical Interconnects replaces Cu wiring in Datacenter
Modern AI GPU clusters (NVIDIA Blackwell GB200 NVL72 and beyond) demand high optical interconnect bandwidth.
Each rack needs thousands of high-speed optical links.
Sources: CNBC, Introl Blog, MarketWise - Feb/Mar 2026
AI infrastructure is the #1 demand driver for everything downstream: compute, networking, optics, lasers, and epitaxy equipment.G10-SiC tool
Update
AIXTRON maintains a strong (leading) position in SiC power segments
2026: Continued Market slowdown and underutilization
Mid-term (2027-2029):
OEMs switching from 400V to 800V battery systems using SiC will increase demand
Benefits from the shift toward AI-powered architectures (800V HVDC)
Qualification efforts at further customers are ongoing, expect to benefit over-proportionally when the market picks up again
~doubling of annual tool demand by 2029 due to
Continued EV ramps
Market share gains of SiC vs. silicon due to rapidly declining prices of SiC wafers
Update
AIXTRON maintains a leading (dominant) position in GaN power segments
2026: Slight decline in 2026 as GaN adoption across a broader range of applications is slower than expected
Launch of 300mm technology in 2026
Co-existence of 200mm and 300mm wafer sizes expected
Mid-term (2028-2030): accelerated (~3x) growth of annual tool demand due to
GaN penetrating more and more applications
GaN replacing silicon (energy efficiency)
AI power delivery
G10-GaN tool
≥ 1200 V
Voltage
EV main Inverter
AI power delivery
Smartphone fast chargers
AC/DC for datacenters
Class-D audio
DC/DC for datacenters
Wireless charging
LV motor drives
battery consumer
Battery tools,
Industrial PSU
devices (e-bikes, …)
Low speed electric vehicles
AI power delivery
Micro-Inverters
Solar
Time of Flight / Lidar
2020 - 2023
2024 - 2026
2027 - 2028
EV On-Board Charger (OBC)
HV motor drives, home appliances
< 200 V
500-700 V
Time of market adoption
HV motor drives, home appliances
Up to 40% energy
consumption reduction
Ramp from 2025 onwards
High unit volume, large dies
--> high wafer consumption
AI "On Board" power delivery
Replacement of silicon power chips around the GPUs
Up to 50% lower power loss in a compact form factor
Battery tools and consumer devices
Longer battery life
Smaller size and reduced weight b/c less cooling
GaN achieves > 1200V breakdown voltage
Status of GaN for EV main inverters
>= 1200V breakdown for GaN devices demonstrated, achieving key parameters required for HVM
Multiple companies with 650V or 1200V prototypes in the roadmaps for traction inverters
Potential for cost reduction in main inverter
Test at several OEMs ongoing
3-Phase traction inverter powered by GaN devices
200mm GaN multi-wafer toolG10-GaN
Leading platform for 150mm / 200mm wafer size
Based on 20+ years GaN experience
Used by all key GaN-players worldwide today (tool of record)
300mm GaN single-wafer toolHyperion
Key ingredients from 200mm technology transferred to 300mm
Builds on prior experience in GaN
Experience gained from today's installed base
300mm showerhead technology (30+ years)
Technological outperformance vs. 200mm platform recently confirmed by a leading customer
GaN PE market to be dominated by 200mm in near term - expanding in voltage range 300mm to penetrate market from Low and Mid voltage mid termVoltage
300mm Epi wafers
Expanding further to higher
voltage range
200mm Epi wafers
150/200mm Epi wafers transition towards 200mm on-going
first products for low and mid voltage
2020 - 2022 2023 - 2025 2026 - 2028
Time of market adoption
Co-existence of 200mm and 300mm GaN power expected for extended periods of time
Reuse strategies for chip-making equipment expected as key driver for 200mm vs. 300mm decisions
NVIDIA 800 V HVDC Architecture will power the next generation of AI Factories
Key efficiency gainsUp to 5% improvement in end-to-end power efficiency
Maintenance costs reduced by up to 70% due to fewer PSU failures and lower labor costs for component upkeep
Lower cooling expenses from eliminating AC/DC PSUs inside IT racks
Source: NVIDIA
Navitas developing next generation 800V HVDC architecture with NVIDIASource: Navitas
Source: Powerelectronicsnews + Infineon
G5+
G10-AsP
Update
Continued work in Asia on LED brightness and cost per display
ROY LEDs: China dominates market;
local consolidation drives vertical partnerships (e.g. with panel makers)
Micro LED: Still early-stage;
secured orders are targeting the exploration of the potential of the product,
but cost-effective production still remains the biggest challenge for high volume manufacturing

