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Aehr Test : Company Presentation (June 2026 Company Presentation)
Aehr Test : Company Presentation (June 2026 Company
About this update from Aehr Test Systems
Setting the Test Standard for Tomorrow Aehr Test Confidential June 2026 Nasdaq: AEHR Semiconductor Test & Burn-in for over 45 Years! XP Worldwide leader in wafer-level test and burn-in systems Unique full-wafer test and burn-in systems and contactors Technology leader in massively parallel and high-power test and burn-in systems High Power Multi-Wafer Test & Burn-In System CP Single Wafer Stepping Test & Burn-In System High Power Test & Burn-In System Medium Power Test & Burn-In System State-of-the-art manufacturing facility located in Fremont, CA 50,000+ sq. foot facility Power and Infrastructure to support up to 400 wafers (tester Blades) and WaferPaks for Wafer Level Burn-in and 20 Package Level Burn-in Systems per month Manufacturing capabilities and quality control procedures have passed rigorous Tier 1 customer qualification processes Need for cost-efficient wafer level, singulated die, and package level burn-in, stabilization, & testing is creating significant revenue opportunities for Aehr Test in the following key markets: Artificial Intelligence Processors and Processing Infrastructure driving explosive spend in data center processing, edge processors, communication infrastructure, and power conversion infrastructure which drives AI processors, memory, data storage, Silicon Photonics I/O, and power conversion semiconductors like Silicon Carbide & Gallium Nitride Data Center Infrastructure and unstoppable growth in Data Storage driving Silicon Photonics, Flash Memory Solid State Data Storage, and new Photonics Assisted Hard Disk Drive Storage Heterogeneous Integration of semiconductors and 3D fabrication and stacking driving technology and cost roadmaps pushing known good die with test and burn-in of device in wafer form prior to packaging Electric Vehicle & Electrification of Transportation Infrastructure driving motor control, charging infrastructure, and power conversion using Silicon Carbide & Gallium Nitride semiconductors Electrification of the World's Power Infrastructure and Shift to Clean Energy driving efficient and economical electrical power conversion using Silicon Carbide & Gallium Nitride semiconductors Aehr Test Headquarters, Fremont California Aehr has been a leader in burn-in test solutions for over 45 years with thousands of systems shipped worldwide (Partial Customer List) Package Level Burn-In Test Flow Aehr Sonoma Wafer Test Packaging Pkg Test 1 Package Burn-In Pkg Test 2 SLT Aehr FOX-XP Wafer Burn-In Wafer Test Packaging Pkg Test SLT Wafer Level Burn-In Test Flow - High Quality Bare Die Aehr's FOX-XP is capable of both functional burn-in and test solutions - leverages proprietary aligner and contactor technology Multi-wafer technology enables customers to achieve an overall decrease in test equipment cost and fab footprint - while increasing die yield and throughput MULTI-WAFER TESTER FOX-XP Multi-Wafer Test System CONTACTOR FOX-XP WaferPaks ALIGNER FOX WaferPak Aligner May be configured with up to 18 Blades, enabling 18 wafers to be tested in parallel - driving cost efficiency and throughput High performance thermal chucks allow uniform temperature control of the wafers Footprint similar to single wafer automated test equipment -reducing lab test space Houses the wafer and distributes signals and power to the wafer itself The WaferPak contactor is capable of over 50,000 contacts in a single touchdown on up to 300mm wafers Consumable input into the test system driving recurring revenue from the installed base Integral piece of test cell as it loads the wafer in the WaferPak at immense levels of precision By perfectly setting the wafer in a cartridge it ensures perfect contact Performs wafer alignment "offline" which eliminates the need for one wafer prober per wafer during long burn-in and test times WaferPak temperature control methods Vacuum & pressure-based WaferPaks Maintaining probe contact over temperature Electrical components in WaferPak Individual DUT power supplies Per Die Current Protection Redundant power supplies Portable WaferPaks And more . . . 9 / 18 wafer system high volume production FOX-P blades configurable with same resource options as FOX-NP and FOX-CP blades Delivers up to 2,048 independent universal channels or 1,024 High current or high voltage channels per blade Delivers and dissipates up to 3.5kW of power and up to 4,000 amps to and from the wafer FOX-XP 18 Wafer Test & Burn-In System Uses FOX compatible WaferPaks Up to 50,000 pin "probe cards" Very high compliance micro pogo pins and/or MEMS capability Test & burn-in temperatures to 150C Offline wafer alignment via Aehr proprietary WaferPak aligners FOX WaferPaks Fully automated FOX-XP System Provides customers fully hands-free operation up to lights out SECS/GEM factory automation and integration Configurable for 300mm to 100mm wafers using industry standard load ports Optical wafer to WaferPak alignment up to 150C test/burn-in temperatures FOX-XP with Integrated WaferPak Aligner (Configured for 300mm AI Processor Wafers) 360 Wafer Capacity Footprint with full SECS/GEM E84 Automation Dual wafer system for new product introduction, engineering and low volume production FOX-P blades configurable with same resource options as FOX-XP and FOX-CP blades up to 3.5 kW per blade Delivers up to 2,048 independent universal channels or 1,024 high current or high voltage channels per blade Integrated standard 20C to 150C thermal control unit Small lab footprint FOX-NP Dual Wafer Test & Burn-In System Excellent for program development, process monitoring, new product introduction, stress test, HALT, HTOL, and low volume production test and burn-in Uses FOX compatible WaferPaks Up to 50,000 pin "probe cards" Very high compliance micro pogo pins and/or MEMS capability Offline wafer alignment via Aehr proprietary WaferPak aligners Uses FOX compatible DiePaks Singulated die, modules, or packages FOX WaferPak & DiePak Contactors Exceptional thermal density performance and uniformity via conductive thermal transfer to thermal plates Extremely simple contactor "Probe Card" No backside stiffener No interposer required No expensive tester interconnects Simple per-pin repairability Easy to manufacture in high volume FOX WaferPak Contactor Enabling architecture for low cost of test One aligner shared across many wafer positions Supports stepping across wafer for high die count wafers "Rugged" design allows movement of aligned wafers Allows wide test temperatures after alignment (single probe mark) Enabling architecture for small footprint Allows high density stacking (18 wafers in a single column) Full functional tester and interface within a 3.4" pitch Manual Insertion into FOX-XP Conductive thermal chuck per position within 3.4" pitch Production Burn-in: semiconductor components are subjected to elevated voltages and temperatures for a duration of time (2 - 48 hours) to screen for reliability and early failure in production before shipping to customers Reliability Qualification Burn-in: semiconductor components subjected to elevated voltage and temperatures for 1000 hours to validate and meet industry standards for long term reliability via High Temperature Operating Life (HTOL) tests Burn-in Testing - The Bathtub Curve Time Decreasing Failure Rate Constant Failure Rate Increasing Failure Rate Hours, Days, or Months Years or Decades Months or Years Wear-Out Failures Early "Infant Mortality" Failure Failure Rate Production Screening / Burn-in Reliability Qualification / Burn-in High-power package level test & burn-in for production, reliability qualification, and life-time tests Up to 88 processors with independent test resources and high-power liquid cooling per device Qualification and Production configurations Shipping in volume with multiple systems installed at most test houses today High Power Test & Burn-in System Aehr Sonoma platform has the largest installed base of ultra-high-power burn-in systems for High Temperature Operating Life (HTOL) used for AI processors at test houses around the world. Successfully captured the production system capacity needs from one of the largest Hyperscalers in the world on the first AI Accelerator that they are doing production burn-in screening on. They have purchased a significant number of Sonoma systems, already installed in Asia at a leading test contract manufacturer, and are forecasting a significant ramp over the next several years. Recently won multiple new HTOL reliability burn-in deals for AI processors to be used at world leading test houses that have Aehr Sonoma systems and plan to order additional systems. One of these HTOL applications is already slated for production burn-in that will drive large numbers of systems in Asia at test houses and Aehr has already been selected for production burn-in of these processors High Power Test & Burn-in System Aehr worked with and successfully captured the first production orders from an AI Accelerator company to move their AI processor system level test and burn-in to wafer level on the Aehr FOX-XP system. Recently announced production capacity to drive incremental systems and WaferPaks and also move to fully automated 300mm wafer handling Announced paid-for production WLBI evaluation from a leading AI processor supplier which is currently in development with very positive results completed in the last quarter Multiple additional potential customers have approached Aehr to demonstrate WLBI on their AI accelerator processors and CPUs Recently announced partnership with ISE/ASE the worlds largest semiconductor Out-Sourced Assembly and Test House (OSAT) to comarket and proliferate WLBI in addition to PLBI for AI processors XP High Power Multi-Wafer Test & Burn-In System (Shown with Integrated WaferPak Aligner)