Aehr Test SystemsNASDAQ: AEHR

Company Presentation (June 2026 Company Presentation)

· Issued by Aehr Test Systems
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Setting the Test Standard for Tomorrow

Aehr Test Confidential

June 2026 Nasdaq: AEHR





Semiconductor Test & Burn-in for over 45 Years!

XP



  • Worldwide leader in wafer-level test and burn-in systems

  • Unique full-wafer test and burn-in systems and contactors

  • Technology leader in massively parallel and high-power test and burn-in systems

    High Power Multi-Wafer Test & Burn-In System

    CP



    Single Wafer Stepping Test & Burn-In System

    High Power

    Test & Burn-In System



    Medium Power Test & Burn-In System



    • State-of-the-art manufacturing facility located in Fremont, CA

    • 50,000+ sq. foot facility



    • Power and Infrastructure to support up to 400 wafers (tester Blades) and WaferPaks for Wafer Level Burn-in and 20 Package Level Burn-in Systems per month



    • Manufacturing capabilities and quality control procedures have passed rigorous Tier 1 customer qualification processes



      Need for cost-efficient wafer level, singulated die, and package level burn-in, stabilization, & testing is creating significant revenue opportunities for Aehr Test in the following key markets:



  • Artificial Intelligence Processors and Processing Infrastructure driving explosive spend in data center processing, edge processors, communication infrastructure, and power conversion infrastructure which drives AI processors, memory, data storage, Silicon Photonics I/O, and power conversion semiconductors like Silicon Carbide & Gallium Nitride

  • Data Center Infrastructure and unstoppable growth in Data Storage driving Silicon Photonics, Flash Memory Solid State Data Storage, and new Photonics Assisted Hard Disk Drive Storage

  • Heterogeneous Integration of semiconductors and 3D fabrication and stacking driving technology and cost roadmaps pushing known good die with test and burn-in of device in wafer form prior to packaging

  • Electric Vehicle & Electrification of Transportation Infrastructure driving motor control, charging infrastructure, and power conversion using Silicon Carbide & Gallium Nitride semiconductors

  • Electrification of the World's Power Infrastructure and Shift to Clean Energy

    driving efficient and economical electrical power conversion using Silicon Carbide & Gallium Nitride semiconductors

Aehr Test Headquarters, Fremont California

Aehr has been a leader in burn-in test solutions for over 45 years with thousands of systems shipped worldwide

(Partial Customer List)



Package Level Burn-In Test Flow

Aehr Sonoma



Wafer Test

Packaging

Pkg Test 1

Package Burn-In

Pkg Test 2

SLT







Aehr FOX-XP

Wafer Burn-In

Wafer Test

Packaging

Pkg Test

SLT

Wafer Level Burn-In Test Flow - High Quality Bare Die

  • Aehr's FOX-XP is capable of both functional burn-in and test solutions - leverages proprietary aligner and contactor technology

  • Multi-wafer technology enables customers to achieve an overall decrease in test equipment cost and fab footprint - while increasing die yield and throughput

    MULTI-WAFER TESTER

    FOX-XP Multi-Wafer Test System

    CONTACTOR

    FOX-XP WaferPaks

    ALIGNER

    FOX WaferPak Aligner



    • May be configured with up to 18 Blades, enabling 18 wafers to be tested in parallel - driving cost efficiency and throughput

    • High performance thermal chucks allow uniform temperature control of the wafers

    • Footprint similar to single wafer automated test equipment -reducing lab test space

    • Houses the wafer and distributes signals and power to the wafer itself

    • The WaferPak contactor is capable of over 50,000 contacts in a single touchdown on up to 300mm wafers

    • Consumable input into the test system driving recurring revenue from the installed base

    • Integral piece of test cell as it loads the wafer in the WaferPak at immense levels of precision

    • By perfectly setting the wafer in a cartridge it ensures perfect contact

    • Performs wafer alignment "offline" which eliminates the need for one wafer prober per wafer during long burn-in and test times



  • WaferPak temperature control methods
    • Vacuum & pressure-based WaferPaks
      • Maintaining probe contact over temperature
        • Electrical components in WaferPak

          • Individual DUT power supplies
            • Per Die Current Protection
              • Redundant power supplies
                • Portable WaferPaks
                  • And more . . .




  • 9 / 18 wafer system high volume production

    • FOX-P blades configurable with same resource options as FOX-NP and FOX-CP blades

    • Delivers up to 2,048 independent universal channels or 1,024 High current or high voltage channels per blade

    • Delivers and dissipates up to 3.5kW of power and up to 4,000 amps to and from the wafer

      FOX-XP 18 Wafer Test & Burn-In System

  • Uses FOX compatible WaferPaks

    • Up to 50,000 pin "probe cards"

    • Very high compliance micro pogo pins and/or MEMS capability

    • Test & burn-in temperatures to 150C





    • Offline wafer alignment via Aehr proprietary WaferPak aligners

      FOX WaferPaks



  • Fully automated FOX-XP System

  • Provides customers fully hands-free operation up to lights out SECS/GEM factory automation and integration

  • Configurable for 300mm to 100mm wafers using industry standard load ports

  • Optical wafer to WaferPak alignment up to 150C test/burn-in temperatures



    FOX-XP with Integrated WaferPak Aligner (Configured for 300mm AI Processor Wafers)



    360 Wafer Capacity Footprint with full SECS/GEM E84 Automation





  • Dual wafer system for new product introduction, engineering and low volume production

    • FOX-P blades configurable with same resource options as FOX-XP and FOX-CP blades up to 3.5 kW per blade

    • Delivers up to 2,048 independent universal channels or 1,024 high current or high voltage channels per blade

    • Integrated standard 20C to 150C thermal control unit

    • Small lab footprint

      FOX-NP Dual Wafer Test & Burn-In System

    • Excellent for program development, process monitoring, new product introduction, stress test, HALT, HTOL, and low volume production test and burn-in

  • Uses FOX compatible WaferPaks

    • Up to 50,000 pin "probe cards"



    • Very high compliance micro pogo pins and/or MEMS capability

    • Offline wafer alignment via Aehr proprietary WaferPak aligners

  • Uses FOX compatible DiePaks

    • Singulated die, modules, or packages

      FOX WaferPak & DiePak Contactors

    • Exceptional thermal density performance and uniformity via conductive thermal transfer to thermal plates



  • Extremely simple contactor "Probe Card"

    • No backside stiffener

    • No interposer required

    • No expensive tester interconnects

    • Simple per-pin repairability

    • Easy to manufacture in high volume

      FOX WaferPak Contactor

  • Enabling architecture for low cost of test



    • One aligner shared across many wafer positions

    • Supports stepping across wafer for high die count wafers

    • "Rugged" design allows movement of aligned wafers

    • Allows wide test temperatures after alignment (single probe mark)

  • Enabling architecture for small footprint

    • Allows high density stacking (18 wafers in a single column)

    • Full functional tester and interface within a 3.4" pitch

      Manual Insertion into FOX-XP

  • Conductive thermal chuck per position within 3.4" pitch

    • Production Burn-in: semiconductor components are subjected to elevated voltages and temperatures for a duration of time (2 - 48 hours) to screen for reliability and early failure in production before shipping to customers

    • Reliability Qualification Burn-in: semiconductor components subjected to elevated voltage and temperatures for 1000 hours to validate and meet industry standards for long term reliability via High Temperature Operating Life (HTOL) tests



    Burn-in Testing - The Bathtub Curve

    Time

    Decreasing Failure Rate

    Constant Failure Rate

    Increasing Failure Rate

    Hours, Days, or

    Months

    Years or

    Decades

    Months or Years

    Wear-Out Failures

Early "Infant Mortality" Failure



Failure Rate

Production Screening / Burn-in

Reliability Qualification / Burn-in



  • High-power package level test & burn-in for production, reliability qualification, and life-time tests

  • Up to 88 processors with independent test resources and high-power liquid cooling per device

  • Qualification and Production configurations



  • Shipping in volume with multiple systems

    installed at most test houses today High Power Test & Burn-in System

  • Aehr Sonoma platform has the largest installed base of ultra-high-power burn-in systems for High Temperature Operating Life (HTOL) used for AI processors at test houses around the world.

  • Successfully captured the production system capacity needs from one of the largest Hyperscalers in the world on the first AI Accelerator that they are doing production burn-in screening on. They have purchased a significant number of Sonoma systems, already installed in Asia at a leading test contract manufacturer, and are forecasting a significant ramp over the next several years.

  • Recently won multiple new HTOL reliability burn-in deals for AI processors to be used at world leading test houses that have Aehr Sonoma systems and plan to order additional systems.

  • One of these HTOL applications is already slated for production burn-in that will drive large numbers of systems in Asia at test houses and Aehr has already been selected for production burn-in of these processors





    High Power Test & Burn-in System



  • Aehr worked with and successfully captured the first production orders from an AI Accelerator company to move their AI processor system level test and burn-in to wafer level on the Aehr FOX-XP system. Recently announced production capacity to drive incremental systems and WaferPaks and also move to fully automated 300mm wafer handling

  • Announced paid-for production WLBI evaluation from a leading AI processor supplier which is currently in development with very positive results completed in the last quarter

  • Multiple additional potential customers have approached Aehr to demonstrate WLBI on their AI accelerator processors and CPUs

  • Recently announced partnership with ISE/ASE the worlds largest semiconductor Out-Sourced Assembly and Test House (OSAT) to comarket and proliferate WLBI in addition to PLBI for AI processors

XP





High Power Multi-Wafer Test & Burn-In System (Shown with Integrated WaferPak Aligner)

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