ACM Research’s Ultra ECP ap-p Horizontal Panel Electroplating Tool Receives First Production Order and Evaluation Order from Customers

About this update from Acm Research, Inc.

Advances Large-Panel Horizontal Electroplating Toward Volume Production and Strengthens ACM's Position in Advanced Packaging FREMONT, Calif., Aug. 07, 2026 (GLOBE NEWSWIRE) -- ACM Research, Inc. ("ACM") (NASDAQ: ACMR), a leading supplier of wafer and panel processing solutions for semiconductor and advanced packaging applications, today announced it has received orders for its proprietary Ultra ECP ap-p horizontal panel-level electroplating tool from two advanced packaging customers. This includes orders for: We believe our Ultra ECP ap-p represents the world's first commercial horizontal panel-level copper deposition system for large panel market, supporting plating steps across pillar, bump and redistribution layer (RDL) processes. These orders broaden market reach of the Ultra ECP ap-p, support the expansion of ACM's global customer base, and further strengthen ACM's position in the panel-level advanced packaging equipment market. "The Ultra ECP ap-p was developed to address increasing requirements for plating uniformity, process stability and production efficiency as advanced packaging moves toward higher levels of integration and larger panel formats," said Dr. David Wang, President and Chief Executive Officer of ACM. "We are encouraged by the customer response reflected in these orders and remain committed to advancing our panel-level electroplating technology, supporting customer qualification and volume-production adoption, and delivering competitive solutions for advanced packaging manufacturing."The Ultra ECP ap-p features ACM's proprietary horizontal electroplating technology and supports panel formats including 310 × 310 mm, 510 × 515 mm and 600 × 600 mm, as well as copper (Cu), nickel (Ni), tin-silver (SnAg) and gold (Au) plating processes. The system features a four-sided sealing dry contact chuck for improved reliability, in-cell rinse functionality to minimize chemical cross-contamination between different plating cells, and a horizontal electroplating design synchronizing a rotating square electrical field with the rotating chuck for superior deposition uniformity. Forward-Looking Statements Certain statements contained in this press release are not historical facts and may be forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Words such as "plans," "expects," "believes," "anticipates," ...

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