Asml Holding Nv · EURONEXT:ASML
Asml Holding Nv — Credit Suisse European Technology Conference 2010
23 slides from Asml Holding Nv's conference presentation, May 12, 2010
Slide 1: Credit Suisse European Technology Conference
Credit Suisse European Technology Conference Franki D’Hoore Director European Investor Relations May 12, 2010
Slide 2: Safe Harbor
Safe Harbor "Safe Harbor" Statement under the US Private Securities Litigation Reform Act of 1995: the matters discussed in this document may include forward-looking statements, including statements made about our outlook, realization of backlog, IC unit demand, financial results, average selling pr
Slide 3: Agenda
Agenda Business summary Lithography trends Outlook and summary
Slide 4: Business summary
Business summary & ASML ly
Slide 5: Q1 results - highlights
Q1 results - highlights Net sales of € 742 million, 34 systems shipped valued at € 632 million, service revenue at € 110 million Average selling price for new systems shipped is € 25.8 million Gross Margin of 40.3% Shipped 17 immersion systems Booked 50 systems, valued at € 1,004 million Backlog inc
Slide 6: Net sales per quarter 2003-2010
2003 2004 2005 2006 2007 2008 2009 2010 Q1 318 453 685 629 949 919 183 742 Q2 329 616 763 942 930 844 277 1000 Q3 370 611 533 958 934 697 555 Q4 526 785 548 1053 955 494 581 Total net sales M€ 1,543 2,465 2,529 3,582 3,768 Numbers have been rounded for readers' convenience. 2,954 1,596 ASML guidance
Slide 7: Key financial trends 2009 - 2010
Key financial trends 2009 - 2010 Consolidated statements of operations M€ Numbers have been rounded for readers' convenience. Numbers have been adjusted for consolidation of variable interest entity
Slide 8: Backlog: value and litho units
Backlog: value and litho units Backlog Jan 04 Apr 04 Jul 04 Oct 04 Jan 05 Apr 05 Jul 05 Oct 05 Jan 06 Apr 06 Jul 06 Oct 06 Jan 07 Apr 07 Jul 07 Oct 07 Jan 08 Apr 08 Jul 08 Oct 08 Jan 09 4/9/2009 Jul 09 Oct 09 Jan 10 Apr 10 Backlog value 993 1357 1800 2053 1691 1377 987 1245 1434 1596 1830 2126 2146
Slide 9: Backlog by technology, region and end-use
Korea Taiwan USA Japan Singapore Europe China 23 31 19 11 6 3 7 memory IDM Foundry 75 14 11 0 0 0 immersion KrF 1-line ArF dry 89 9 1 1 Backlog in value per March 28, 2010 Total value M€ 2,170 Technology ArF immersion 89% KrF 9% i-line 1% Region USA 19% Taiwan 31% Korea 23% Europe 3% Japan 11% End-u
Slide 10: Sector growth summary
Sector growth summary DRAM Significant new immersion lithography tools required as immersion layers increase from node to node which will continue in 2011 DRAM unit growth forecasted by analysts at 16%, bit growth at 50% primarily met by shrink NAND Immersion demand ramping in Q3 and Q4 due to requi
Slide 11: TWINSCAN NXT moving to volume chip manufacturing
TWINSCAN NXT moving to volume chip manufacturing TWINSCAN NXTs have been shipped to several customers for volume semiconductor production in Q2 2010 Proven industry leading performance of CD imaging uniformity well below 1 nm and overlay of less than 2 nm Booked 14 systems in Q1 Backlog 28 systems e
Slide 12: Lithography
Lithography Arends| W & ASML
Slide 13: IC segment roadmaps follow each a different pace
IC segment roadmaps follow each a different pace Lithography supports shrink roadmap Year of production start* Resolution/half pitch, "Shrink" [nm] 20 30 40 50 60 80 200 100 '02 '03 '04 '05 '06 '07 '08 '09 '10 '11 '12 '13 '14 '15 ARF ARFi EUV Logic *Average customer input, (1/10) NAND DRAM XT:1400 X
Slide 14: Customer lithography roadmap by sector
Customer lithography roadmap by sector EUV Single exposure Double patterning Spacer Double patterning LELE Source: ASML Marketing (4/10) Mainstream die density 1 Gb by 2015 Mainstream die density 512 Gb by 2015
Slide 15: DRAM industry wafer production capacity
Source: ASML (4/10) * Gartner DRAM bit forecast (3/10): 2009 2010 2011 Mio GB (new): 1348 2123 3129 YoY gr.: +24% +57% +47% DRAM industry wafer production capacity 2 concurrent node transitions in 2010
Slide 16: NAND industry wafer production capacity
Source: ASML (4/10) * Gartner NAND bit forecast (3/10): 2009 2010 2011 Mio GB (new): 6467 10718 19680 YoY gr.: +43% +66% +84% NAND industry wafer production capacity 2 concurrent node transitions in 2010
Slide 17: DRAM bit sufficiency analysis
DRAM bit sufficiency analysis: Continued mild undersupply throughout 2010 Sources. Bit Supply: ASML (4/10). Bit Demand: Gartner (3/10) * Gartner DRAM bit forecast (3/10): 2009 2010 2011 Mio GB (new): 1348 2123 3129 YoY gr.: +24% +57% +47%
Slide 18: NAND bit sufficiency analysis
NAND bit sufficiency analysis: Demand / supply in balance in 2010 Sources. Bit Supply: ASML (4/10). Bit Demand: Gartner (03/10) * Gartner NAND bit forecast (3/10): 2009 2010 2011 Mio GB (new): 6467 10718 19680 YoY gr.: +43% +66% +84%
Slide 19: Memory wafer output by wafer size and node
Wafer Output [300 mm equiv. KWSM] By end 2010 memory output capacity is estimated to be more than 10% below peak capacity of 2008 Source: ASML Marketing (9/09) 0 200 400 600 800 1000 1200 1400 1600 1800 2000 2200 2400 2600 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 2007 2008 2009 2010 Memory WW
Slide 20: ASML Systems: 300mm Memory
ASML Systems: 300mm Memory Average number of systems required for new fab 120k wafers/month 100k wafers/month 3xnm NAND 32 litho layers ArFi ArF KrF KrF ArF I-Line I-Line KrF KrF I-Line I-Line KrF I-Line I-Line I-Line ArFi ArFi ArFi ArFi I-Line I-Line I-Line KrF KrF KrF ArFi KrF KrF KrF KrF KrF KrF
Slide 21: Outlook and summary
Outlook and summary
Slide 22: Q2 2010 outlook
Q2 2010 outlook Net sales expected around € 1 billion Gross margin expected of about 42% in Q2 R&D is expected at € 125 million net of credits SG&A is expected at € 42 million Q2 bookings are expected at similar level as in Q1 2010 We expect this cycle to be sustained by the normal technology transi
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