SCI Engineered Materials, Inc. · OTC:SCIA

SCI Engineered Materials — Investor Presentation (November 2011)

25 slides from SCI Engineered Materials's investor presentation, Nov 10, 2011

  1. Slide 1: An ISO 9001:2008 Registered Provider of PVD Materials

    An ISO 9001:2008 Registered Provider of PVD Materials http://www.sciengineeredmaterials.com 5/06/2011 1

  2. Slide 2: Corporate History

    Corporate History SCI Engineered Materials was founded in 1987 Initially, pursued R & D of high temperature superconducting materials and devices Capabilites led to production of advanced ceramic compositions for sputtering Evolved into a production company for PVD materials 5/06/2011 2

  3. Slide 3: The Company Today

    The Company Today 32,000+ square feet of manufacturing and office space in Columbus, Ohio Traded on OTCBB exchange (symbol: SCIA) 5/06/2011 3

  4. Slide 4: Quality

    Quality Achieved ISO 9001:2008 registration in 2010, and had ISO 9001:2000 registration prior to 2010 Committed to providing customers with quality products and services in a timely manner. Dedicated to achieving and sustaining this goal by meeting the requirements of ISO 9001:2008 and continually i

  5. Slide 5: Total Revenue

    Total Revenue $000 $12,000 $10,833 $10,000 $9,620 $8,916 $8,046 $8,010 $8,000 $6,884 $6,000 $4,000 $3,457 $2,000 $ , $0 2005 2006 2007 2008 2009 2010 2011 * * Nine months ended September 30, 2011 11/10/2011 5

  6. Slide 6: Gross Profit

    Gross Profit $000 $3 000 $3,000 $2,274 $2,211 $2,058 $1,870 $2,000 $1 788 $1,788 $1,259 $1,000 $741 $0 * 2005 2006 2007 2008 2009 2010 2011 * Nine months ended September 30, 2011 11/10/2011 6

  7. Slide 7: Management

    Management Dan Rooney – President and C.E.O. Jerry Blaskie – V.P and C.F.O Dr. Scott Campbell – V.P. Technology Mike Barna – V.P. Sales Nathan Hyest – Q.A. Manager Jeremy Young – Production Manager Teri Snyder – Customer Service Supervisor 5/06/2011 7

  8. Slide 8: Full Service Materials Provider

    Full Service Materials Provider Ceramic and Metal Targets for PVD  Custom oxide compositions  Ceramic and metal powder densification  Metal and ceramic machining Backing Plate/Bonding Services  Backing plate fabrication  Solder and elastomer bonding available Evaporative and Superconducting Mat

  9. Slide 9: Markets Served

    Markets Served Optic Photonic Photovoltaic Semiconductor Thin Film Battery 5/06/2011 9

  10. Slide 10: Manufacturing Capabilities

    Manufacturing Capabilities Ceramic Powder Synthesis & Processing Forming Heat Treating Ceramic & Metal Machining, Grinding, and Electrical Discharge Machining Target Bonding 5/06/2011 10

  11. Slide 11: Powder Processing

    Powder Processing In-House Processes  Solid State Processing  Chemical Precipitation  Sonically-Assisted Chemical Precipitation 5/06/2011 11

  12. Slide 12: Analytical Capabilities

    Analytical Capabilities • Rigaku mini-flex X-Ray diffractometer • Thermo Scientific XRF • Micromeretics Sedigraph PSA • Quantichrome Monosorb BET Analyzer • Quantichrome Autotab Tap Density analyzer • Linseis DTA • LECO carbon analyzer • Hitachi U-4100 Spectrophotometer • Veeco Dektak 6M Profiler 5/

  13. Slide 13: Quality Control Capabilities

    Quality Control Capabilities Zeiss Spectrum C99/II Coordinate Measuring Machine with Vi Scan Camera Sierra Instruments Ultrasonic Scanner (bond integrity testing) NuLine TR1000 Surface Finish Tester 5/06/2011 13

  14. Slide 14: Targets

    Targets Compositions  Metal  Ceramic Form Factor  Planar  Cylindrical  Custom 5/06/2011 14

  15. Slide 15: Backing Plates

    Backing Plates As specified by customer or OEM Materials  Copper  Molybdenum  Stainless Steel 5/06/2011 15

  16. Slide 16: In-House Bonding Capability

    In-House Bonding Capability 5/06/2011 16

  17. Slide 17: Evaporation Materials

    Evaporation Materials Metals  Single Elements  Rare Earth Alloys 5/06/2011 17

  18. Slide 18: Vacuum Hot Presses

    Vacuum Hot Presses One-Piece sizes up to  20” dia. Rounds  14” squares 5/06/2011 18

  19. Slide 19: Development Sputtering Systems

    Development Sputtering Systems In-house sputtering capability Up to 300mm by 300mm substrate 5/06/2011 19

  20. Slide 20: CMM Room

    CMM Room Temp. controlled Humidity controlled Houses analytical instruments 5/06/2011 20

  21. Slide 21: CNC Mills

    CNC Mills 5/06/2011 yy NS aap SCI Engineered Materials y 21

  22. Slide 22: CNC Lathe

    CNC Lathe oy WN 5/06/2011 aap SCI Engineered Materials 22

  23. Slide 23: CNC Lathe

    CNC Lathe 4a». 5/06/2011 aap SCI Engineered Materials 23

  24. Slide 24: Large Planar

    Large Planar yy NS <a> SCI Engineered Materials 5/06/2011 NU” 24

  25. Slide 25: Equipment

    Equipment Small Grinder 5/06/2011 25

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