Dupont De Nemours, Inc. · NYSE:DD
Dupont De Nemours — Investor Day (November 2021)
12 slides from Dupont De Nemours's investor day presentation, Nov 17, 2021
Slide 1: DuPont Interconnect Solutions (ICS)
DuPont Interconnect Solutions (ICS) Leading Sustainable Materials Solution Partner for Advanced Interconnects Investor Presentation November 17, 2021
Slide 2: Interconnect Solutions
Interconnect Solutions Vision: To be the leading sustainable materials solution partner for advanced interconnects DIFFERENTIATED KEY GROWTH DRIVERS COMPLEMENTARY BUSINESSES TECHNOLOGY 5G • Enabling reliable signal Connectivity Miniaturization integrity in interconnects by DuPont ICS providing total
Slide 3: Interconnect Solutions: At a glance
Interconnect Solutions: BY GEOGRAPHY(1) At a glance BY PRODUCT LINE 9% 78% 13% Metallization & Imaging Films & Laminates • R&D/Technical Center $1.75 B(1) Thermal Management & EMI Manufacturing Shielding (Laird) BY MARKET SEGMENT Consumer Electronics Smartphone $1.75 B(1) Automotive Telecom Industri
Slide 4: Market-leading growth
Market-leading growth STRONG FINANCIAL PROFILE AND GROWTH STRATEGY NET SALES GROWTH STRATEGY Laird Aligned to megatrends Enhancing product enabled by performance through interconnects materials expertise Preferred partner with Leveraging global 2019 2020 2021E ⁽²⁾ OEMs and leading footprint and oper
Slide 5: Industry megatrends enabled by interconnects
Industry megatrends enabled by interconnects MEGATRENDS GROWING INTERCONNECT DEMAND Printed Circuit Board Market ($Bn) 100 80 Consistent market 60 growth of ~5% 5G Connectivity Electric / Autonomous Vehicles 2010 2013 2016 2019 2022 2025 15%+ ~20-30% Targeting High- Growth Segments Enables Us to 5G
Slide 6: Solving our customers' most critical challenges
Solving our customers’ most critical challenges MEGATRENDS KEY INTERCONNECT CHALLENGES High Speed EMI Shielding High Frequency 5G Connectivity Electric / Autonomous Vehicles High Performance Miniaturization & Reliability Thermal Sustainability High Performance AI / Big Data / Management Computing /
Slide 7: Industry-leading portfolio, well-positioned for growth
Industry-leading portfolio, well-positioned for growth Electronic Materials Assemblies / Components • Polyimide • Photoresist • Gap fillers films films Thermal • Specialty films Kapton® Riston® Management COMPREHENSIVE PORTFOLIO • Laminated • Plating • Multi-function circuit chemistries solutions ma
Slide 8: Extending total solution capability across value chain
Extending total solution capability across value chain Device/Design Partner PCB Manufacturing Partner Assembly Partner Drill Hole Inner Layer Bonding Electroless & Lamination Plating Copper Clad Design Laminate Final Printed Circuit Board Product (PCB) Process Rogers(1) Soldermask Assembly & Fina
Slide 9: Enabling a broad range of solutions
Films & Laminates Enabling a broad range of solutions Metallization & Imaging Thermal Management & EMI Shielding (Laird) 5G SMARTPHONE ELECTRIC VEHICLE Infotainment Lights Display Battery Module Emotor Camera & Sensing Transmission Sensor Main Board Inverter 5G mm Wave High Power Antenna Radar Anten
Slide 10: Key Takeaways
Key Takeaways Strong portfolio with Winning combination of leading market leading-edge technology position and total solutions Focus on high-growth World-class design and Global technology segments with process capability for network and supply expanding market OEM engagement capability potential Du
Slide 11: Safe Harbor Statement
Safe Harbor Statement Overview Effective August 31, 2017, E. I. du Pont de Nemours and Company ("EID") and The Dow Chemical Company ("TDCC") each merged with subsidiaries of DowDuPont Inc. (n/k/a "DuPont”) and, as a result, EID and TDCC became subsidiaries of the Company (the "DWDP Merger"). On Apri
Slide 12: Trademarks and copyright notice
© 2021 DuPont de Nemours, Inc. All rights reserved. © 2021 DuPont. All rights reserved. DuPont™, the DuPont Oval Logo, and all trademarks and service marks denoted with ™, ℠ or ® are owned by affiliates of DuPont de Nemours, Inc. unless otherwise noted. Nothing contained herein shall be construed as