Phoenix Silicon International Corp. · TWSE:8028

Phoenix Silicon International — Q3 2025 Earnings Presentation

27 slides from Phoenix Silicon International's earnings presentation, November 2025

  1. Slide 1: PSI Roadshow in Q3,2025

    PSI Roadshow in Q3,2025 Nov. 2025

  2. Slide 2: Safe Harbor Notice

    Safe Harbor Notice • Psi’s statements of its current expectations are forward-looking statements subject to significant risks and uncertainties and actual results may differ materially from those contained in the forward-looking statements. • Information as to those factors that could cause actual r

  3. Slide 3: Agenda

    Agenda • Q3 Finance Results • Semi Industry Outlook • Reclaim wafer Demand Drivers and Market Share Forecast • Potential Drivers from 12” Silicon and SiC Thinning Business • Long Term Expansion Plan • Key Messages Phoenix Silicon International Corporation Confidential 2

  4. Slide 4: Q3 Finance Results

    Q3 Finance Results

  5. Slide 5: Financial Highlights

    Financial Highlights 2025Q3 Revenue GPM OPM M TWD NT$ 1,164M 33.4% 20.9% 1,400 37.3% 40% 34.7% 33.4% 1,200 31.7% 32.0% 35% 26.7% 30% 1,000 24.0% 25% 800 20.1% 19.7% 20.9% 18.5% 20% 600 13.6% 1,164 1,050 1,082 1,044 15% 938 400 828 10% 200 5% 0 0% 24Q2 24Q3 24Q4 25Q1 25Q2 25Q3 Revenue GM% OPM% Phoeni

  6. Slide 6: Scaling In-Time to Meet Customer's Need

    Scaling In-Time to Meet Customer’s Need M TWD 1,000 87% 100% 900 90% 800 76% 80% 62% 700 70% Q1~Q3 600 52% 60% 49% Payment 500 50% Schedule 400 40% 28% 27% 300 30% 200 20% 100 10% 0 0% 24Q2 24Q3 24Q4 25Q1 25Q2 25Q3 CaPeX Capital intensity Phoenix Silicon International Corporation Confidential 5

  7. Slide 7: Financial Matrix

    Financial Matrix Item 2025Q1 2025Q2 2025Q3 Shipment (Kpcs, 12"-equiv. Wafer) 2,099 2,292 2,531 Net Revenue (US$ Millions) 33 34 38 Net Revenue (NT$ Millions) 1,082 1,044 1,164 Gross Margin 37.3% 32.0% 33.4% Operating Margin 24.0% 19.7% 20.9% Net Profit Margin 21.3% 9.5% 17.3% EPS (NT$) 1.34 0.58 1.1

  8. Slide 8: Semi Industry Outlook

    Semi Industry Outlook

  9. Slide 9: AI to Drive Semiconductor Market to $1 Trillion

    AI to Drive Semiconductor Market to $1 Trillion Bn USD 1,200 CAGR 11.2% 1,000 800 600 400 200 - 2024 2025E 2026F 2027F 2028F Automotive Communication Consumer Data Processing Industrial and Military/Civil Aerospace Source: Gartner Phoenix Silicon International Corporation Confidential 8

  10. Slide 10: AI From Centralized Cloud to Distributed Edge

    AI From Centralized Cloud to Distributed Edge 2.5Mu 2.5Mu 50Mu 200Mu 1,000Mu 100Mu 280Mu 5Mu 50Mu E F F F F F Source: WSTS, IDC, TSMC Phoenix Silicon International Corporation Confidential 9

  11. Slide 11: Reclaim Wafer Drivers and Market Share Forecast

    Reclaim Wafer Drivers and Market Share Forecast

  12. Slide 12: Wafer Demand Two Growth Drivers

    Wafer Demand Two Growth Drivers Front-End Capacity Growing Adv. Packaging Volume Ramping up Capacity Kwpm Capacity Index(2024=100) 3,000 700 2,500 600 500 2,000 400 1,500 300 1,000 200 500 100 0 0 2024 2025E 2026F 2027F 2024 2025E 2026F 2027F Leading-edge Logic HBM/DRAM Existing Capacity New Capacit

  13. Slide 13: PSI's Emerging Driving Vectors

    PSI’s Emerging Driving Vectors Reclaim wafer for HBM/DRAM Reclaim wafer for Adv. Packaging Shipment Index(2020=100) Shipment Index(2020=100) 2,500 CAGR 86% CAGR 54% 1,000 2,000 800 1,500 600 1,000 400 500 200 0 0 2020 2021 2022 2023 2024 2025-Q1~Q3 2020 2021 2022 2023 2024 2025-Q1~Q3 Source: company

  14. Slide 14: Strategic CapEx & Investment Directions

    Strategic CapEx & Investment Directions • 12-inch Reclaim Capacity Expansion Proactively expanding capacity to fulfill robust demand for high-spec products, thereby securing long-term order stability. • SiC Wafering Technology R&D Investing in Silicon Carbide wafering and processing technology, whic

  15. Slide 15: Accelerating Market Share Gains

    Accelerating Market Share Gains PSI Share % 60% 59% 57% 55% 51% 50% 47% 45% 43% 42% 43% 40% 38% 33% 30% 29% 20% 23 24 25E 26F 27F 28F WW TW Source: company data, PSI Phoenix Silicon International Corporation Confidential 14

  16. Slide 16: Potential Drivers from 12" Si and SiC

    Potential Drivers from 12” Si and SiC

  17. Slide 17: Capitalizing on the Power and Thermal Imperative

    Capitalizing on the Power and Thermal Imperative An unprecedented challenge to data center power and cooling infrastructure. TDP(W) 4,000 3,500 3,000 2,500 2,000 1,500 1,000 500 0 4Q22 2Q24 4Q24 3Q25 2H26 2H27 Source: company data, Nomura, GFHK Phoenix Silicon International Corporation Confidential

  18. Slide 18: Dr. MOS Capturing Multi-market Growth

    Dr. MOS Capturing Multi-market Growth Traditional Design Driver MOSFET High Density Power Module Phoenix Silicon International Corporation Confidential 17

  19. Slide 19: Scaling Up 12-inch Si Thinning for Next-Gen

    Scaling Up 12-inch Si Thinning for Next-Gen 12” Silicon thinning CAGR 96.9% 2024 2025E 2026F 2027F 2028F 8" Si 12"Si Phoenix Silicon International Corporation Confidential 18

  20. Slide 20: Beyond Silicon - Silicon Carbide Key Properties

    Beyond Silicon - Silicon Carbide Key Properties High Breakdown Field Mechanical Strength ~10× stronger than Si Mohs ~9.2, 1.3X than Si Thinner Drift Layer High Hardness & Strength High Performance Optical Transmission Thermal Conductivity Material SiC, best 0.4–2μm, strong & durable 260–450 W/MK, Gl

  21. Slide 21: SiC New Era – Blooming Applications

    SiC New Era – Blooming Applications Heat Dissipater IC Substrate Specialty glass Phoenix Silicon International Corporation Confidential 20

  22. Slide 22: Long Term Expansion Plan

    Long Term Expansion Plan

  23. Slide 23: Long Term Opportunities

    Long Term Opportunities USA Taiwan Drivers Drivers • Rising advanced-node demand • CHIPS Act driving • Skilled talent and ecosystem • Shorter lead times Strategy Strategy • AI-driven fab • Collaborate with local suppliers • Just-in-time delivery • Premium pricing India Drivers • Government promoting

  24. Slide 24: Taiwan Expansion Plan Update

    Taiwan Expansion Plan Update Hsinchu, hybrid fab • Reclaim MP in 1998 • Thinning MP in 2005 Taichung, pure reclaim fab • 1st fab MP in 2022 • 2nd fab under construction Southern Taiwan • Hub for Advanced node Manufacturing • PSI is assessing the feasibility Phoenix Silicon International Corporation

  25. Slide 25: Key Messages From PSI

    Key Messages From PSI

  26. Slide 26: Focused on Growth, Anchored by Discipline

    Focused on Growth, Anchored by Discipline • Advanced nodes and heterogeneous packaging accelerating reclaim demands • Development in 12” power device thinning and new TIM for next-gen AI products • Sustainable leadership and profitability via innovative and disciplined investments Phoenix Silicon In

  27. Slide 27: https://www.psi.com.tw ir@psi.com.tw

    Https://www.psi.com.tw ir@psi.com.tw

Phoenix Silicon International — Q3 2025 Earnings Presentation on 6ix