Suss Microtec Se · XETR:SMHN
Suss Microtec — Investor Day (2025)
23 slides from Suss Microtec's investor day presentation, 2025
Slide 1: Business Unit Advanced Backend Solutions
Business Unit Advanced Backend Solutions (Dr. Robert Wanninger) Public | SUSS Capital Markets Day 2025 1
Slide 2: SUSS serves three essential process blocks in Advanced Backend
SUSS serves three essential process blocks in Advanced Backend We tailor our product solutions to support our customer’s product and manufacturing needs. Our target markets Bonding Systems Solution offering Heterogeneous Logic/Memory devices from “one” SUSS MEMS & Sensors Coating Systems Power/Discr
Slide 3: Our strategic focus – driving sustainable and profitable growth
Our strategic focus – driving sustainable and profitable growth Focus on high-volume markets: Focus on the right applications and provide right equipment with the right specifications Focus on key customers: Focus on industry leaders, identify customer success factors & turn these into differentiati
Slide 4: Strong market growth across all Product Lines, driven by Logic/Memory devices
Strong market growth across all Product Lines, driven by highly performant Logic/Memory devices – put differently AI Serviceable Available Market Serviceable Available Market Strong market tailwinds across all by SUSS equipment [€M] by device [€M] Product Lines expected driven by Heterogeneous Logic
Slide 5: Ongoing portfolio optimization since 2023 to reduce complexity
Ongoing portfolio optimization since 2023 to reduce complexity In Advanced Backend Solutions, we are focusing on high-volume markets and specifically reducing our range of semi-automated equipment Bonding Systems Coating Systems Imaging Systems Number of products Number of products Number of product
Slide 6: Advanced Backend Solutions delivered on last long-term plan & committed to further growth
Advanced Backend Solutions delivered on SUSS’ last long-term plan & is committed to further growth Revenues in €m & Gross Profit Margin in % 2018 – 2024 600 Doubling revenues by focusing on key customers and securing a strong position Capital Markets 550 in the AI ecosystem Day 2023 500 2026 Tempora
Slide 7: Let's deep-dive into our three Product Lines
Let’s deep-dive into our three Product Lines Public | SUSS Capital Markets Day 2025 7
Slide 8: Bonding | Temporary Bonding is the key revenue driver, Hybrid Bonding gaining momentum
Bonding | Temporary Bonding is – and will remain – the key revenue driver, with Hybrid Bonding gaining momentum SUSS revenues by Equipment Key Takeaways equipment type Temp. Bonding Key applications: Wafer thinning (e.g. HBM) Debonding Market leader supplying 2 of 3 IDMs (HBM) Deep-Dive next slides
Slide 9: Temporary Bonding & Debonding | SUSS market leader in a growing market
Temporary Bonding & Debonding | SUSS market leader in a growing market fueled by demand for AI and HBM Market Outlook 2024 – 2030 Current SUSS market position Others Competitor 2 Memory thinning (HBM) Advanced Packaging (esp. Logic) Power Other (e.g., MEMS) Competitor 1 2024 2030 Memory stacking & A
Slide 10: Temporary Bonding & Debonding | Battle-proven, flexible tool with high yield
Temporary Bonding & Debonding | Battle-proven, flexible tool with high yield – ready for next device generations 1 2 3 4 High yield (>99%) Robust & HVM proven Ultra-thin Wafer Seamless adaptation through low TTV1 & mechanical & laser de- handling and across various HVM high cleanliness bonding techn
Slide 11: Hybrid Bonding | Fast-growing market – ready to shape it
Hybrid Bonding | Fast-growing market – With our broad portfolio, we are ready to shape it Market Outlook 2024 – 2030 Current SUSS market assessment D2W Hybrid Bonding Market favors independent Surface Preparation & (esp. HBM & Advanced Logic) Hybrid Bonding tools Short-Term W2W Hybrid Bonding New (g
Slide 12: Hybrid Bonding | SUSS represents excellence in technical performance
Hybrid Bonding | SUSS represents excellence in technical performance 1 2 3 Leading in accuracy – W2W HB already ready for future Platform flexibility according ideal for Advanced Logic Logic – due to low & repeatable to customer needs post-bond distortion W2W HB: 80nm Low distortion: 120nm Ø post bo
Slide 13: Coating | Inkjet drives growth, Spin Coating remains on positive trajectory
Coating | Inkjet drives growth as a disruptive technology, Spin Coating remains on a positive trajectory SUSS revenues by Equipment Key Takeaways equipment type Inkjet Key applications: Coating of complex structures, cost- Deep-Dive efficient coating of expensive resists & Additive next slides Manuf
Slide 14: Inkjet | Flexible, cost-efficient coating and enabler for Additive Manufacturing
Inkjet | More than flexible & cost-efficient Coating – also a key enabler for Additive Manufacturing Inkjet as alternative to Spin Coating Inkjet as enabler for Additive Manufacturing Inkjet coating is particularly an alternative to conventional spin or In addition to traditional coating, Inkjet add
Slide 15: Inkjet | >50% material savings and top Coating quality
Inkjet | >50% material savings and top Coating quality – even on complex surfaces and independent of substrate geometry 1 2 3 Attractive Cost of Ownership Enabler for homogeneous Similar processes for Wafer through >50% material savings coating of 3-dimensional surfaces and Panel – ensuring consiste
Slide 16: Imaging | Dual growth path: UV-Scanner momentum & NextGen Mask Aligner
Imaging | Dual growth path: UV-Scanner momentum in Advanced Packaging & market share expansion with NextGen Mask Aligner SUSS revenues by Equipment Key Takeaways equipment type UV-Scanner Key applications: Advanced Packaging of Deep-Dive Heterogeneous devices and Power next slides Market leader & so
Slide 17: UV-Scanner | Positioned to capture accelerating demand for UV-Scanning
UV-Scanner | SUSS well positioned to capture accelerating demand for UV-Scanning through exclusive market leadership Market Outlook 2024 – 2030 Current SUSS market position Full-field projection UV-Scanning (ghi-line) Stepper ghi-line 2024 2030 • Advanced Packaging & Power device manufacturing • SUS
Slide 18: UV-Scanner | Best-in-Class Cost of Ownership for Advanced Packaging
UV-Scanner | Best-in-Class Cost of Ownership for Exposure use cases in Advanced Packaging 1 2 3 Higher yields through Best-in-Class throughput for Versatile tool for multiple stitchless & contactless large reticle sizes applications enabled by exposure adjustable optic For large products, stitchless
Slide 19: Close ecosystem collaboration: NextGen UV-Scanner for CoWoS/CoPoS
In close collaboration with our ecosystem, NextGen UV-Scanner for CoWoS/CoPoS is developed as right fit product to set standards Projected annual UV-Scanner Current Partner of Choice CoW(P)oS capacity ramp (dph1) We were chosen as key supplier for leading CoWoS and CoPoS production Joint roadmap ali
Slide 20: Advanced Packaging partly moving to Panel – Lithography Panel solutions launching soon
Advanced Packaging partly moving to Panel – SUSS Lithography Panel solutions launching soon Planned future 310x310mm2 Panel Portfolio PLP has been used for years, but mostly in simple, customized Before 2024 processes with varying large Panel sizes Out of scope Now, heterogeneous integration is 310x
Slide 21: Analyzing Advanced Packaging trends and turning them into solutions
We consistently analyze future Advanced Packaging trends and turn them into real solutions by working hand in hand with our ecosystem Selection of key Adv. Packaging Trends Further development of existing products ‘26 ‘27 ‘28 ‘29 ‘30 Backside-Power-Delivery Pot. future business for Temporary Bonding
Slide 22: Summary | Driving profitable growth through focus on fast growing segments
Summary | Driving profitable growth through focus on fast growing market segments & key customers with a streamlined portfolio Revenue development (in €m) Advanced Packaging of Heterogenous devices – focus market & main innovation area CAGR: 8 – 11% across all three Product Lines: 500 – 600 Temporar
Slide 23: Disclaimer
Disclaimer The following presentations contain forward-looking statements relating to the business, financial performance and earnings of SUSS MicroTec SE and its subsidiaries and associates. Forward-looking statements are based on current plans, estimates, projections and expectations and are there