Singapore Exchange Ltd. · SGX:S68
Singapore Exchange — Grand Venture Technology — Investor Presentation (2025)
29 slides from Singapore Exchange's investor presentation, 2025
Slide 1: Grand Venture Technology Corporate Presentation 2025
GRAND VENTURE TECHNOLOGY Corporate Presentation 2025
Slide 2: Disclaimer
DISCLAIMER This presentation may contain forward-looking statements which are subject to risks and uncertainties that could cause actual results to differ materially from such statements. Such risks and uncertainties include those arising from industry and economic conditions, competition, and legal
Slide 3: High Precision Components, Complex Mechatronics & Assembly
HIGH PRECISION COMPONENTS, COMPLEX MECTRONICS & ASSEMBLY Our solutions are key to the overall functionality of mission critical end products within High Precision Capital Mission Critical Products & Modules* Equipment End Products Chamber lid Chip Manufacturing Hinge bracket (wafer fab, packaging, S
Slide 4: Precision Engineering Solution Provider for Mission Critical Applications
PRECISION ENGINEERING SOLUTION PROVIDER FOR MISSON CRITICAL APPLICATIONS Strategically positioned for multi-year growth Strategic partners to blue-chip customers across the semiconductor value chain from front-end to back-end Key beneficiary of AI and technological driven drivers in semiconductor -
Slide 5: Company Overview
COMPANY OVERVIEW Powering the next generation technologies with our manufacturing solutions KEY BLUE-CHIP CUSTOMERS(1) Semiconductor (front & back-end) Life Sciences EAMO(2) North American Global Producer of Leading Front-End Leading Front-End Surgical Life Science Semi Equipment Maker Semi Metrolog
Slide 6: Key Milestones
KEY MILESTONES 2012 – 2016 2017 – 2021 2022 – 2025 “FOUNDATION” “DEVELOPMENT” “ACCELERATION” S$0m - S$16m revenue S$16m - S$116m revenue S$116m - ? revenue Acquired J-Dragon: entry into Aerospace 2012 Established GVT SG 2017 Incorporated GVT Suzhou 2022 Acquired Formach: Sheet metal competency for f
Slide 7: Key Management Team
KEY MANAGEMENT TEAM Led by seasoned entrepreneurs that came together, backed by a track record of building companies Lee Tiam Nam, Ricky Ng Wai Yuen, Julian Chief Executive Officer, Executive Director Executive Deputy Chairman & Co-Founder & Co-Founder ➢ Industry veteran with 40+ years of experience
Slide 8: Selected Core Competency Illustration
SELECTED CORE COMPETENCY ILLUSTRATION Sub-micron machining What is Sub-Micron Machining & Importance ➢ A high-precision manufacturing process: materials are processed at an atomic scale, in the vicinity of one micron (for scale, a human hair is 20 – 70 microns) ➢ Requires the use of single crystal d
Slide 9: Our Key Processes
OUR KEY PROCESSSES Design for Manufacturability/ Manufacturing Surface Treatment Assembly & Testing Assembly MACHINING SHEET METAL Precision cutting, Self- Cutting, shearing, Plating 3rd Party machining, and manufactured rolling, bending, Components finishing of materials Components punching, weldin
Slide 10: The Vendor of Choice for Blue-Chip Customers
THE VENDOR OF CHOICE FOR BLUE-CHIP CUSTOMERS Well-positioned to capitalize on the next semiconductor upcycle Long gestation period and stringent process to win customers give incumbents like GVT a strong moat Trusted with product roadmaps, strong ties with customer local and global R&D, engineering
Slide 11: Our Core Capabilities
OUR CORE CAPABILITIES Comprehensive end-to-end capabilities enabled us to wallet share across new and existing customers Electronics, Life Capabilities Semiconductor Aerospace Medical Sciences and Others Design for Design for Manufacturability / Assembly ✓ ✓ ✓ ✓ Manufacturability / Assembly Ultra Pr
Slide 12: Enhancing Capabilities and Expanding Offerings
ENHANCING CAPABILITIES AND EXPANDING OFFERINGS Moving up the value chain through organic and inorganic growth Transformative acquisitions since 2022 Consumables & Services Advanced Material Moving up the value chain Vertical Integration Potential Future Acquisitions Design-in including penetration J
Slide 13: Track Record of Capturing New US & EU Blue Chip Customers
TRACK RECORD OF CAPTURING NEW US & EU BLUE CHIP CUSTOMERS Successfully grew wallet share with no churn Multiple new North front-end American Life semicon Science Front-end customers company semicon metrology New back-end $159m player customer North American Life $131m Science company $116m Global Pr
Slide 14: Industry Outlook
INDUSTRY OUTLOOK
Slide 15: Our Exposure to the Semiconductor Value Chain
OUR EXPOSURE TO THE SEMICONDUCTOR VALUE CHAIN Deep engagements with blue-chip customers across the semiconductor equipment space FRONT-END (WAFER FAB) BACK-END (ASSEMBLY & TEST) US$98Bn1 US$11Bn1 Front-end refers to the fabrication process of the main structures of the Back-end process involves the
Slide 16: Semiconductor Equipment Spend Is Accelerating
SEMICONDUCTOR EQUIPMENT SPEND IS ACCELERATING Multi-year growth expected on the back of strong secular growth drivers and exposure across the value chain Semiconductor Equipment Sales Forecast (US$B) 8.9% CAGR GVT is well positioned as 162 a key beneficiary across the entire value Supply chain South
Slide 17: Life Sciences and Aerospace Segment Ripe for Growth
LIFE SCIENCES AND AEROSPACE SEGMENT RIPE FOR GROWTH Diversified customer base in high growth areas will drive long-term growth for GVT Life Sciences Aerospace Incremental market growth expected for our key addressable tools Global aircraft fleet to double over the next 20 years 48,230 Healthcare ref
Slide 18: Secular Growth Driver – AI Devices
SECULAR GROWTH DRIVER – AI DEVICES Rising importance of AP and HBM will drive packaging and testing equipment demand Artificial Intelligence is creating technological Artificial Intelligence is creating technological challenges which are enabled by AP and HBM challenges which are enabled by AP and H
Slide 19: Financial Results & Company Highlights
FINANCIAL RESULTS & COMPANY HIGHLIGHTS
Slide 20: Poised to Capitalize on Semi Upcycle
POISED TO CAPITALIZE ON SEMI UPCYCLE Poised to continue winning new programs and wallet share across its core segments, especially semiconductor Segmental Results (S$M) 21.0% CAGR 2020-2024 159.5 Dual growth engine for semiconductor: strong 131.1 performance from back-end 116.3 111.3 across high ban
Slide 21: Malaysia Is Our Core Market Catered for Semiconductor
MALAYSIA IS OUR CORE MARKET CATERED FOR SEMICONDUCTOR GVT mainly serves the global MNCS who have a production base in SE Asia Revenue by geographical markets (% of total) 41% 41% 38% 55% 25% 27% 27% 28% 13% 16% 18% 15% 8% 13% 9% 8% 9% 1% 3% 5% FY2021 FY2022 FY2023 FY2024 Others* United States China
Slide 22: Operating Leverage to Pave Way for Profitability
OPERATING LEVERAGE TO PAVE WAY FOR PROFITABILITY Margins set to return to the higher-end, with improved utilization from cyclical recovery and new programs Revenue & Profit Margins (1) FY2020 FY2021 FY2022 FY2023 FY2024 We have invested ahead of the curve into new facilities and capabilities to capt
Slide 23: Revenue Performance and Guidance
REVENUE PERFORMANCE AND GUIDANCE 4Y CAGR of 27%, with the strong momentum expected to continue into FY2025 Revenue Guidance (S$M) 1H FY2025 Semiconductor 27% CAGR Stronger demand expected from AI and complexity- driven equipment sales Aerospace 90.0 – 96.0 Higher demand for aircraft components with
Slide 24: Investment Highlights
INVESTMENT HIGHLIGHTS Veteran management team Experienced team who has experience in delivering strong design engineering proposition with progressive mindset to innovate Large addressable market driven by tailwinds Led by blue chip customer’s end market growth and technology supply chain shifts to
Slide 25: Thank You!
‘Y Grand Venture Pa Technology Grand Venture Pd Technology
Slide 26: Appendix: Industry
° Grand Venture f Technology APPENDIX: INDUSTRY
Slide 27: Growth Enabler – Advanced Packaging
GROWTH ENABLER – ADVANCED PACKAGING Advanced Packaging is becoming increasing important to address complexity challenges in AI devices AP and its advantages AP focuses on integrating multiple chips or components in a single package to improve chip performance and power efficiency Higher Cost Better
Slide 28: Growth Enabler – High Bandwidth Memory
GROWTH ENABLER – HIGH BANDWIDTH MEMORY HBM will create incremental demand for 2.5D/3D packaging and TSVs due to increasing miniaturization HBM and its advantages High Bandwidth Memory (HBM) is a dense, stacked version of memory with high-speed interface and lower power consumption Higher Bandwidth M
Slide 29: Promising Market Fundamentals
PROMISING MARKET FUNDAMENTALS Multi-year growth expected for both Advanced Packaging and High Bandwidth Memory 2.5D/3D to drive overall AP market growth HBM3E/4 and beyond expected (US$B) to drive volume growth HBM Package Volume – Market Forecast (Mu) CAGR(23-29) 100 69.5 15% CAGR(23-29) 91 Overall
Grand Venture Technology — Investor Presentation (2025) on 6ix