BE Semiconductor Industries N.V. · EURONEXT:BESI
BE Semiconductor Industries — Investor Day (June 2021)
78 slides from BE Semiconductor Industries's investor day presentation, Jun 10, 2021
Slide 1: Analyst Presentation June 10, 2021
ANALYST PRESENTATION June 10, 2021
Slide 2: Safe Harbor Statement
Safe Harbor Statement This presentation contains statements about management's future expectations, plans and prospects of our business that constitute forward-looking statements, which are found in various places throughout the press release, including, but not limited to, statements relating to ex
Slide 3: Agenda
Agenda I. Strategic Overview Richard Blickman II. Assembly Market Trends Richard Blickman III. End User Trends Ruurd Boomsma IV. Growth Opportunities Ruurd Boomsma V. Equipment Portfolio Update Chris Scanlan VI. Strategic Initiatives Chris Scanlan VII. Supply Chain & ESG Nickolay Stepanenko VIII. Q&
Slide 4: I. Strategic Overview
I. STRATEGIC OVERVIEW June 10, 2021 4
Slide 5: CEO Summary
CEO Summary Inflection point reached in assembly market development • Higher advanced packaging capex required for increased chip performance • Advanced packaging key to realize <7 nano device ambitions of front-end players • Besi/AMAT partnership facilitates large scale, wafer level process adoptio
Slide 6: History of Superior Long-Term Value Creation
History of Superior Long-Term Value Creation Disciplined Strategic Execution Capital Allocation Program Total Shareholder Return Leader in advanced packaging € 888 million of dividends and Consistent outperformance vs. for assembly equipment share repurchases since 2011* peers Total shareholder retu
Slide 7: Step Function, Through Cycle Revenue and Profit Growth
Step Function, Through Cycle Revenue and Profit Growth € millions Revenue Gross Margin Gross Margin 700 70% 59.0% 600 60% 593 51.1% 555 500 +28% 50% 424 +22% 400 39.5% 434 40% 34.1% 379 356 300 302 30% 4 year 351 averages 200 20% 164 191 100 10% 0 0% 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015
Slide 8: Revenue and Operating Profit Levels Significantly Above Last Cycle
Revenue and Operating Profit Levels Significantly Above Last Cycle Orders (€MM) Revenue (€MM) 600 +18.6% 555 800 +33.5% 681 700 500 468 600 510 400 349 356 • Orders up 33.5% vs. 2017 cycle* 500 300 • Approaching € 800MM target 400 348 349 300 200 • LTM Revenue +18.6% vs. LTM H1-17 200 100 100 0 • Op
Slide 9: Liquidity Position Also Enhanced
Liquidity Position Also Enhanced 700 Cash and Deposits Net Cash 598.7 605.8 600 527.8 500 475.5 +96.0% Total cash +96% from Q1-17 to reach € 605.8 million 408.4 400 • Strong foundation for future growth € millions 304.8 309.0 Similarly, net cash +23% vs. Q1-17 300 • Despite € 559.2 million in divide
Slide 10: Overhead Remains Under Control
Overhead Remains Under Control Significant Operating Leverage in Business Model Baseline Opex Other Opex* Baseline Opex % of Revenue 40 60% 34.9 35 34.0 50% 33.0 Operating Expenses (€ millions) 30 28.6 8.9 40% 7.6 26.8 25.2 3.6 2.3 24.2 23.9 25 1.5 23.3 30% 0.5 27.8% 0.9 26.4% 25.7% 26.4% 20.1% 21.3
Slide 11: Structural, Through Cycle Outperformance Achieved vs. Peers
Structural, Through Cycle Outperformance Achieved vs. Peers Return on Average Equity (2016-2020) Gross Margin 45.0 Δ Besi 2016 2017 2018 2019 2020 LTM** 2016/ 40.0 LTM** Besi’s margins and ROE have 35.0 exceeded direct peers through Besi 51.0% 57.1% 56.8% 55.8% 59.6% 59.8% +8.8pts cycles: ASM PT 30.
Slide 12: Besi Addressable Market Share Increasing
Besi Addressable Market Share Increasing Particularly in Key Die Attach Markets 2016 2017 2018 2019 2020 ∆ ‘20/‘19 ∆ ‘20/’16 Assembly Market ($MM) 3,587 4,503 4,391 2,998 3,603 +20.1% +0.4% Besi Market Share 9.9% 13.1%% 11.6% 10.8% 11.4% +0.6pts +1.5pts Addressable Market ($MM) 1,507 1,942 1,850 1,2
Slide 13: Leader in Addressable Market, Die Attach Market and Advanced Die Placement
Leader in Addressable Market, Die Attach Market and Advanced Die Placement Adv. Die Placement** Die Attach ($236 Million) ($911 Million) Others 15% Addressable Mkt* 82% of Revenue SNK 2020 Assembly Mkt 6% ($3.6 Billion) ($1.4 Billion) ASM-PT Besi Other 12% 67% 23% Disco Other 20% 21% Besi Other Besi
Slide 14: Shareholder Base and Market Liquidity Has Expanded
Shareholder Base and Market Liquidity Has Expanded Symbol/ • BESI Avg. Daily Volume & Liquidity Avg Vol * Avg Price (€ thousands) 1500 Index • Euronext AEX 50,000 Volume (thousands) 1250 40,000 Market Market • € 4.9 billion 1000 30,000 750 Cap* ($5.9 billion) Profile 500 20,000 250 10,000 Dividend •
Slide 15: Business Model Objectives
Business Model Objectives Current Target New Target Revenue € 800MM € 1,000MM+ Addressable Market Share 40%+ 40%+ Gross Margin 55-60% 57-62% Net Margin 30-35% 30-35% Headcount Split 80% Asia/20% Europe/NA 80% Asia/20% Europe/NA Scope 1 and 2 Emissions 60% Reduction 60% Reduction Global Energy Needs
Slide 16: II. Assembly Market Trends
II. ASSEMBLY MARKET TRENDS June 10, 2021 16
Slide 17: Industry Upturn Continues Post Pandemic Downturn
Industry Upturn Continues Post Pandemic Downturn Source: VLSI, June 2021 June 10, 2021 17
Slide 18: Semi Capex Expected to Increase 31% in 2021 to Reach $143.0 Billion
Semi Capex Expected to Increase 31% in 2021 to Reach $143.0 Billion 2021 TOP IDM & FOUNDRY CAPEX SPENDERS 140 (Capital expenditures by company, $B, ranked by 2021 Forecast) IDM & Foundry Capex ($B) 13.5 CAGR 2018 2019 2020P 2021F 120 26.8 Samsung 21.6 19.3 28.1 31.1 9.3 100 +3.4% TSMC 10.5 14.9 17.2
Slide 19: Leading Producers Announced Significant Capex Expansion in H1-21
Leading Producers Announced Significant Capex Expansion in H1-21 Total Announcements Through May = $1 Trillion+ $78.4 Billion Direct and $125.5 Billion Indirect Spending Per Annum Source: VLSI June 2021 Date Amount $ Timing $ p.a. Location Purpose Direct Investments TSMC Mar 2021 100.0B 3 years (202
Slide 20: Assembly Equipment Forecast Upgraded Through 2023
Assembly Equipment Forecast Upgraded Through 2023 7.0 50% Market Size* YoY Growth Rate 5.9 6.0 41.7% 40% 6.0 25.7% 5.1 30% 5.0 4.5 4.4 13.3% 20.6% 20% US$ billions 15.0% 4.0 3.6 3.6 10% 3.0 2.5% 3.0 -2.4% 0% -10% 2.0 +41% growth now estimated for 2021 -20% 1.0 -30% -31.7% 60% growth forecast 2020-20
Slide 21: 2021 Could Be Inflection Point for Assembly Spending
2021 Could Be Inflection Point for Assembly Spending Post Significant Underinvestment Since Last Cycle 16.0% Assembly % Total Equipment 6000 (ex-Service) 6,018 14.0% 5 year avg. 6.4% 5,870 5000 10 year avg. 7.8% 12.0% 5,105 12.0% 20 year avg. 8.4% 11.6% 4,659 4,503 4,391 4000 10.0% 4,353 10.0% 10.0%
Slide 22: Increased Investment Expected to Favor Besi's Product Portfolio
Increased Investment Expected to Favor Besi’s Product Portfolio, Particularly Die Attach Growth in Besi Addressable Markets ($MM) 6,018 5,870 6,000 Die Attach CAGR (2020-2023) 5,105 5,000 1,883 +8.3% 2,030 Die Attach 30.6% +25.7% 1,355 Packaging & Plating 15.3% 4,000 3,603 +48.7% 735 +1.5% 746 Packa
Slide 23: III. End User Trends
III. END USER TRENDS June 10, 2021 23
Slide 24: All Key Besi End User Markets Growing Post Pandemic
All Key Besi End User Markets Growing Post Pandemic Mobile Internet (39%) Computing (21%) Automotive (13%) Industrial/Other (10%) 5G Ramp Underway Digital Society Accelerating Development Continues Energy Efficient/Green Lidar ALL CONNECTED IN MANY DIFFERENT WAYS Electrification Percentages based on
Slide 25: Technology Adoption and Digitalization Accelerating
Technology Adoption and Digitalization Accelerating Move to digital society drives computing advancements • Widespread use of digital applications: • Social media • e-commerce • Work from home • School from home • Requires ever faster computation, data transfer and data storage Source: INTEL June 10
Slide 26: Mobile: 5G Adoption Increasing
Mobile: 5G Adoption Increasing Driven By New Smartphone Applications and Features Growing 5G Smartphone Penetration Number of mobile phones sold per year now fairly constant at about 1.7 billion of which 80%+ are represented by smart phones Growth driven by new features and innovation: 5G broade
Slide 27: Mobile: Technology Converging With Computing World
Mobile: Technology Converging With Computing World Source: Qualcomm Source: NXP June 10, 2021 27
Slide 28: Mobile: Besi's Largest End User Market
Mobile: Besi’s Largest End User Market Besi Involved in Almost All Components RF Front End Antennas GPS RF Tranceiver Modem Local Connectivity WiFi/NFC Microphone Cameras Application Sensors Processor Display TouchScreen Power Lidar Battery Memory Source: Unitedlex.com and ifixit.com and System plus
Slide 29: Computing: Exponential Data Growth Requires Higher Performance
Computing: Exponential Data Growth Requires Higher Performance Logic and Memory Devices and New Assembly Solutions We are creating ever more data We use more and more computing power to accomplish daily tasks: Need faster computing Need faster data transfer between compute and memory Need bigg
Slide 30: Computing: Usage of High Performance Computing Expanding
Computing: Usage of High Performance Computing Expanding to Many Other Commercial Applications Data centers Laptops/Gaming/Engineering Mobile Phones Autonomous Driving Super Computers AI/Vision/Recognition Industry 4.0 Medical June 10, 2021 30
Slide 31: Computing: Hybrid Bonding Offers Higher Level of Performance
Computing: Hybrid Bonding Offers Higher Level of Performance for Next Generation Computing Needs Principal advantages Contact density increases by factor of 1,000x (1,000/mm2 to 1,000,000/mm2) More contacts per mm2 means greater and faster data transfer per mm2 Shorter distance between dies al
Slide 32: Computing: Chiplet Adoption Enables Cost Effective Performance
Computing: Chiplet Adoption Enables Cost Effective Means of Increasing Performance Chiplet Adoption Also Increases Assembly Capital Intensity For many years the most direct way to improve capacity and performance was to increase wafer size and design by using smaller devices with more transistors/mm
Slide 33: Automotive: Electronic/Electric Content Growing Over time
Automotive: Electronic/Electric Content Growing Over time First Automobile Reliable Ignition Electric Starter Car Radio Car Phone All Transistor Anti-Lock Braking System 3 Wheels Double Coil Small Unit First connected cars! Real connected car Car Radio ABS 0.75 HP Magneto Induction High Current Bulk
Slide 34: Automotive: Today's Car is an Electric-Driven Supercomputer
Automotive: Today’s Car is an Electric-Driven Supercomputer on Wheels It senses surroundings It connects to outside world C-V2X Need supercomputer in car using state of the art technology L5 28 Sensors 14 nm 6 B Transistors Jan 27, 2021 5 NM It analyzes and understands It makes decisions NVIDIA Orin
Slide 35: Automotive: Increased Content Will Require New Assembly Solutions
Automotive: Increased Electronic Content and Power Requirements Will Require New Assembly Solutions Increase In General Electronic Components Electric Vehicles: Requires More Power/Devices Source: Infineon Source: Amkor Autonomous Driving Incorporates High End Content Charging Infrastructure: Requir
Slide 36: Automotive: Semiconductor Content and Cost per Car Increasing
Automotive: Semiconductor Content and Cost per Car Increasing EV Adoption Will Further Increase Content and Cost/Car Increasing Semi Content and Cost/Car Growth in Automotive Semiconductors Source: IHS Markit 10/2020 June 10, 2021 36
Slide 37: IV. Growth Opportunities
IV. GROWTH OPPORTUNITIES June 10, 2021 37
Slide 38: Growth in Advanced Packaging Will Continue
Growth in Advanced Packaging Will Continue As Gateway to Realizing Improved Performance in Next Gen Applications Advancements in New Computing Methods New Packaging Methods: Real 3D Device Coupling Miniaturization Chiplets / 2.5 D Stacking With Die Stacking SMALLER DEVICES ARE FASTER AND REQUIRE LES
Slide 39: Hybrid Bonding Now on Agenda of All Big Players
Hybrid Bonding Now on Agenda of All Big Players Source: TSMC, AMD presentations Source: Intel Archtecture Day 2020 Source: Samsung presentations June 10, 2021 39
Slide 40: Hybrid Bonding Merges Front-end/Back-end Processes
Hybrid Bonding Merges Front-end/Back-end Processes Requiring Higher Levels of Requiring Much Smaller Dimensions Requiring Much Higher Precision Cleanliness Comparable to Front-End Reducing cost/contact Align Contacts Typical 10% Max Very Precisely Deviation of contact size In X and Y 1 um contact =>
Slide 41: More Process Steps Resulting in Higher Assembly Capital Intensity
And More Process Steps Resulting in Higher Assembly Capital Intensity Hybrid Bonding Adoption Will Generate Additional Demand For Assembly Equipment LOGIC MEMORY Example: COWOS TYPE STRUCTURE CASE 1 => HYBRID MAY REPLACE 1 TO 1 TCB Current Design With Hybrid Bonding 3 BONDING STEPS 5 BONDING STEPS T
Slide 42: Different Wafer Level Structures Will Also Drive Growth
Different Wafer Level Structures Will Also Drive Growth for High End Assembly Market. Hybrid Bonding Will Coexist with TCB/Flip-Chip MANY DIFFERENT FORM FACTORS WILL REQUIRE DIFFERENT BONDING BESI ACTIVE IN ALL KEY DIE TECHNOLOGY PER PACKAGE BONDING PROCESS TECHNOLOGIES HIGHEST LEVEL HYBRID D2W &
Slide 43: Status Update: Besi/AMAT Development Cooperation
Status Update: Besi/AMAT Development Cooperation SYSTEM IMPROVEMENTS JOINT DEVELOPMENT COOPERATION SUBSTANTIAL INVESTMENT IN CLEAN ROOM AMAT AND BESI INFRASTRUCTURE, MEASUREMENT EQUIPMENT, REACHING 122nm ACCURACY AND PEOPLE OUTPUT UP TO 2000 UPH ANNOUNCED OCTOBER 2020 Front and Back-End Process Ex
Slide 44: Besi's Hybrid Die Bonding Progress
Besi’s Hybrid Die Bonding Progress Status Today • First production orders received • Multiple customer engagements • First hybrid die to wafer products introduced Capacity/Support Expanded • Expanded R&D teams in Europe and Singapore • Added clean room facility Malaysia (Q1) • Completed clean room f
Slide 45: Hybrid Die Bonding Market Update
Hybrid Die Bonding Market Update June 2020 estimate Market tracking towards high case developed in June 2020 • High level of customer engagement • Significant interest expressed by both logic and memory players • Collaboration with AMAT enhances market position • 2020 market estimate confirmed with
Slide 46: Photonics: Additional Growth Opportunity
Photonics: Additional Growth Opportunity Applications for Photonics Expanding Beyond Communications End Markets Photonics combines optical elements and silicon Lasers, receivers and modulators integrated within silicon chip Initially utilized for short distance communication in data centres Ap
Slide 47: Expansion of Flip Chip in Mobile Market
Expansion of Flip Chip in Mobile Market is Another Revenue Opportunity Area Examples Substantial number of applications shifting to flip chip PC GPU, Bitcoin/Gaming • High end <20nm applications Expand • High end gaming and crypto currency mining applications Servers Expanding FC-BGA • New mobile ap
Slide 48: MicroLED Update
MicroLED Update MicroLED still in development phase Qualified process and mass production complexity underestimated First application probably smaller form factor like AR/VR glasses and watches Besi focused primarily on monolithic microLEDs Microsoft Patent Application Developing specificati
Slide 49: Summary
Summary Summary • COVID has accelerated move to digital society and increased technology adoption • Importance of advanced processes like hybrid bonding and chip to wafer has increased substantially • Customer roadmaps have been accelerated • Will increase capital intensity of advanced packaging • H
Slide 50: V. Equipment Portfolio Update
V. EQUIPMENT PORTFOLIO UPDATE June 10, 2021 50
Slide 51: Industry Leading Die Attach Equipment Portfolio
Industry Leading Die Attach Equipment Portfolio Multi-Module Attach Die Attach Flip-chip • 2200 evo • 2200 evo plus • 2200 evo hS • 2200 evo advanced • 2100 hS • 2009 SSI • 8800 CHAMEO advanced / PLP • 2200 evo hf Q4’21 • 2100 hS i • 2100 SSI New • 8800 FC CHAMEO Ultra Q3’21 • 2100 sD advanced i • 2
Slide 52: Best in Class Packaging and Plating Equipment Portfolio
Best in Class Packaging and Plating Equipment Portfolio Substrate Molding Leadframe Molding Wafer & Panel Molding AMS-i AMS-X New AMS-LM • MEMS • HD Leadframe FML • Substrate strip format • Sensors • Power Devices • Wafer molding • Exposed die • Panel molding Trim and Form Plating Singulation • Lead
Slide 53: Key Development Programs Currently
Key Development Programs Currently • Hybrid bonding production launch for leading foundry and IDM customers Advanced Interconnect • TCNext platform: sub-micron accuracy in chip on chip placement with advanced TCB process control Camera Modules • ‘Clean’ evo system to reduce particulate contamination
Slide 54: 2200 evo: Industry Leading Multi-Module Attach Platform
2200 evo: Industry Leading Multi-Module Attach Platform Continuously Upgraded for New Applications > 6,000 Units Shipped New Developments 2021 Gen 4 Platform: 2200 evohf evo ‘Clean’ Performance upgrade High bond force for large Front-end cleanliness levels and lower cost design die, power devices fo
Slide 55: 2100 Epoxy Die Attach: Industry Leading Platform
2100 Epoxy Die Attach: Industry Leading Platform Highest Speed and Accuracy for Single Die Placement > 3,300 Units Shipped New Developments 2021 Focus: Automotive power, advanced quality control and 5G performance 3D Dispensing 6 Side Die Inspection Multi-Device Matching Sinter bonding for power Aut
Slide 56: 2009 and 2100 Soft Solder Systems
2009 and 2100 Soft Solder Systems: Industry Leading Platforms for Automotive and Industrial Applications New Developments 2021 Next Generation Soft Solder Common platform with 2100 epoxy system to extend capabilities and reduce cost Wide Leadframe Advanced N2 Chamber Process Control Large leadframe
Slide 57: 8800 Chameo Ultra Plus: Next Generation Hybrid Bonding
8800 Chameo Ultra Plus: Leading the Transition to Next Generation Hybrid Bonding Interconnect New Product Introduction New Developments 2021 Shipping production systems in H2-2021 Van Gogh Bond Head Auto Product Change Advanced Cleanliness Nanometer accuracy Front-end fab integration Best-in-class y
Slide 58: Industry Leading Flip-Chip Die Attach Product Portfolio
Industry Leading Flip-Chip Die Attach Product Portfolio Advanced Flip-Chip and Fan-out High Speed Flip-chip 2100 FC hS 8800 CHAMEO 8800 QUANTUM Lowest COO New Quatro bond system New advanced bondhead with V-axis New Quatro bondhead system Lowest COO for smaller devices Multi-die handling capable to
Slide 59: Thermo Compression Bonding (TCB): Next Generation System
Thermo Compression Bonding (TCB): Next Generation System Targeting Chip to Wafer Applications for HPC Market New Developments 2021 Next Generation TCB Fine pitch process 8800 TCNext Next Gen Process Chamber 5 µm pitch C2W demonstrated Sub-micron accuracy Ultra low gas consumption for chiplets Key co
Slide 60: Molding: AMS LM Substrate Molding
Molding: AMS LM Substrate Molding: Leading Exposed Die System for 5G and Complex 3D Molding Applications 350+ Systems Shipped New Developments 2021 Focus on 5G System in Package Applications Low ESD <50V/Inch Low transfer pressure Particle reduction Safe for MEMS and RF Safe for MEMS and XTALs Targe
Slide 61: FML Wafer Level Molding For Exposed Die Applications
FML Wafer Level Molding For Exposed Die Applications Including Hybrid Bonding New Developments 2021 Auto leveling TSV Wafer molding Exposed die molding to Precise thickness across wafer encapsulate hybrid bonded die Key competitive advantages Target Markets Exposed die wafer molding No die swim
Slide 62: AMS X: Next Generation Leadframe Molding
AMS X: Next Generation Leadframe Molding Focused on Automotive and Other Quality Critical Applications New Product Introduction New Developments 2021 Unique clamping mechanism Common module Reduced power consumption High quality and yield Scaleable automation Lowest operating cost Key competitive ad
Slide 63: FCL-X/P High Precision Trim and Form
FCL-X/P High Precision Trim and Form for Industrial and Automotive Markets 1,500+ Units Shipped New Developments 2021 IGBT single unit handling Deflashing module Reject punching Key competitive advantages Target Markets Handles most complex HD leadframes Industrial: Power/IGBT Fast configurati
Slide 64: Besi's Plating and Wet Processing Systems are Industry Standard
Besi’s Plating and Wet Processing Systems are Industry Standard for Leadframe Plating 820 Systems Shipped New Developments 2021 Wettable Flank QFN Flux Cleaning - Clip Attach Source: Semiconductor Packaging News • Plating of QFN leads after full cut saw • Improved reliability for automotive • Leadfr
Slide 65: Development Summary
Development Summary Enhancing Capabilities of Existing Portfolio for Future Growth • Focus on new mobile features and functionality for evo. Next gen facial recognition, 3D imaging and sensors • Focus on power devices and automotive electrification for die attach and packaging • Innovation in high s
Slide 66: VI. 2021 Strategic Initiatives
VI. 2021 STRATEGIC INITIATIVES June 10, 2021 66
Slide 67: Summary Strategic Initiatives 2021
Summary Strategic Initiatives 2021 Expand Align Extend Besi’s production organization technology capacity to meet with customer leadership €1B+ revenue capex model expansion Meet customer Execute on cost Engage with delivery reduction and industry leaders schedules, efficiency in highest Expand supp
Slide 68: 2021 Revenue Initiatives
2021 Revenue Initiatives “Pick the winners” Hybrid bonding engagement with leading foundry, logic and memory IDMs Expand technical service in US, Taiwan and Korea Revenue New 5G and AI applications Growth Initiatives Wire bonding to flip chip conversion Increased penetration of Korean and Chinese an
Slide 69: Strategic Operating Initiatives 2021
Strategic Operating Initiatives 2021 Production • Scale production capacity to € 250 million/quarter • > 20% floor space expansion in MY and CHN • Increase temporary Asian production personnel • Expand clean room for hybrid production MY Supply Chain • Active management to satisfy customer demand •
Slide 70: VII. Supply Chain & ESG
VII. SUPPLY CHAIN & ESG June 10, 2021 70
Slide 71: Besi's Supply Chain Network
Besi’s Supply Chain Network Two Principal Supply Chains: Besi Customers • Southeast Asia and China • Europe utilized for specific high-end parts • ~1,600 total suppliers Value creation • ~50 key suppliers • Virtually all dual-sourced Final system assembly/test in-house, production outsourced: • Base
Slide 72: Besi's Supply Chain Scaled Rapidly to Meet 77% Year Over Year Order Growth
Besi’s Supply Chain Scaled Rapidly to Meet 77% Year Over Year Order Growth* Despite Challenging Environment Unprecedented disruptions to global supply chain networks • Current delays related to basic components such as motors, PCBs and cameras, certain subassemblies and transportation/logistics Laun
Slide 73: ESG Infrastructure Established: Three Pillars, 12 Topics, 75 Initiatives
ESG Infrastructure Established: Three Pillars, 12 Topics, 75 Initiatives. Goals Defined For 2022-2030 Energy use and renewable energy* Carbon emissions* Environmental Water use Responsible Impact Business 10 Waste and hazardous material use* 13% Sustainable design Diversity and inclusion People Well
Slide 74: ESG Targets Set to Significantly Reduce Besi's Environmental Footprint
ESG Targets Set to Significantly Reduce Besi’s Environmental Footprint Direct Emissions Energy Consumption 9,000 8,482 50.0 16.0 100.0 7,536 13.5 8,000 45.0 14.0 12.6 90.0 11.8 80.0 7,000 40.0 12.0 tCO2e/million € 35.0 70.0 kWh/million € 6,000 10.0 30.0 60.0 tCO2e GWh 5,000 19.6 21.2 25.0 8.0 50.0 4
Slide 75: Targeting 65% of Energy Needs from Renewable Sources
Targeting 65% of Energy Needs from Renewable Sources Currently 23% of global energy needs from renewable sources • Europe 92% • Focused on solar power and clean energy purchases Besi APac facility June 10, 2021 75
Slide 76: VIII. Q&A
VIII. Q&A June 10, 2021 76
Slide 77: Investment Considerations
Investment Considerations Market Assembly Long term Disciplined presence has market ever secular trends strategic focus grown via key more critical in drive advanced has created an IDMs, supply semiconductor packaging industry leader chains and value chain growth partners Tech leadership Commitment
Slide 78: Financial Calendar
Financial Calendar 10-Jun-21 Analyst meeting, audio webcast 17-Jun-21 Goldman Sachs Inaugural Digital Economy conference, virtual 17-Jun-21 ING Benelux conference Frankfurt, virtual 24-Jun-21 ABN AMRO/ODDO BHF – When Benelux meets London conference, virtual 27-Jul-21 2021 Second Quarter Results 24-A
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