Slide 1: Advanced Materials Solutions for Semiconductor Production
Advanced Materials Solutions for Semiconductor Production World-class specialty metals for demanding applications Booth #L1205 ©2024 Carpenter Technology Corporation. All rights reserved.
Slide 2: Tom Pease, Senior Metallurgist
Tom Pease Senior Metallurgist Tom Pease is a Senior Regional Metallurgist at Carpenter Technology Corporation based in Philadelphia, Pennsylvania. He received his B.S. in Materials Science and Engineering from Pennsylvania State University with a focus on metals. Tom is the subject matter expert at
Slide 3: Your partner in keeping up with Moore
Your partner in keeping up with Moore Compounding market growth • Strong growth in the segment with equipment spending projecting 13.7% CAGR • General increase in semiconductor demand across all industries (Generative AI, IoT, Electrification, etc.) driving need for FABs • Strong global incentives a
Slide 4: Value of material solutions
Carpenter Technology: Leader in specialty materials and solutions 135+ years Global presence of innovation in ~$2B sales Sales, distribution, manufacturing specialty alloys Product forms Global steel production (volume) 1 Ingot / Billet Transportation Aerospace 2 Strip Specialty Highly specialized V
Slide 5: Carpenter Technology metallurgical R&D capabilities
Carpenter Technology metallurgical R&D capabilities Rich history of developing benchmark alloys for critical applications • Integral part in creation of SEMI-F20 specification World-class capabilities and supporting infrastructure Modeling Metallic powders Forming • 350-lb VIM atomizer • 30- and 400
Slide 6: Alloy solutions for semiconductor applications
Alloy solutions for semiconductor applications • The leader in high-purity alloys for the semiconductor industry. We deliver solutions that enable component fit for corrosive environments with no tolerance for contamination. • The largest VIM capacity in the world • A majority producer of high-purit
Slide 7: Partnering to excel in critical applications for semiconductor FABs
Partnering to excel in critical applications for semiconductor FABs FLUID DELIVERY (DEP, ETCH, FAB) MEASUREMENT SYSTEMS MOTION SYSTEMS SHIELDING • Valves • Linear actuation • Fittings • Flux concentrators Application • Sensors, mounts • Galling prone applications • Regulators • Shielding (nuts, etc.
Slide 8: The largest product breadth for the semiconductor industry
The largest product breadth for the semiconductor industry Bar Wire Strip Flat Bar Special Shape Bar 8
Slide 9: In a full range of sizes and shapes
In a full range of sizes and shapes SHAPE CONDITION SIZE RANGE 0.1875 in. min OD (4.76 mm) Round bar Annealed 3.25 in. max OD (82.55 mm) 0.1875 in. min OD (4.76 mm) Round bar Strain-hardened 2.5 in. max OD (63.5 mm) 0.5 x 0.5 in. (12.7 mm) Flat or square bar Annealed 3 x 3 in. (76.2 mm) 0.25 x 0.25
Slide 10: Advanced chips love clean steel
Advanced chips love clean steel 10
Slide 11: Why material cleanliness matters
Why material cleanliness matters Material cleanliness enhances final yield • Material in fluid and gas systems within the semiconductor fabrication process can adversely affect final yield through contamination and corrosion. • Higher material purity can reduce contamination in the chip manufacturin
Slide 12: What is “micro-cleanliness”?
What is “micro-cleanliness”? Micro-cleanliness refers to a steel's inclusion content • So, what are “inclusions”? • Inclusions are non-metallic compounds within the metal. • Inclusions are classified into four categories (called Type) based on their morphology.* o Type A: Sulfide o Type B: Alumina o
Slide 13: Where do inclusions come from, and how do we control them?
Where do inclusions come from, and how do we control them? Nonmetallic inclusions are compounds formed during the primary melting process. • As molten metal solidifies, foreign compounds solidify as inclusions. • Controlled melt practices and premium melting decreases inclusion content. • Tight cont
Slide 14: 316L-SCQ portfolio to SEMI-F20 limits for fluid delivery systems
316L-SCQ® portfolio to SEMI-F20 limits for fluid delivery systems GENERAL PURPOSE ULTRA-HIGH-PURITY SEMI-F20 LIMITS HIGH-PURITY GRADE (HP) 316L-SCQ+ GRADE (GP) GRADE (UHP) • Type A • Thin 2.5 / Heavy 1.0 • Thin 2.0 / Heavy 1.0 • Thin 1.5 / Heavy 1.0 • Thin 1.0 / Heavy 1.0 • Type B • Thin 2.5 / Heavy
Slide 15: Cleanliness of 316L-SCQ
Cleanliness of 316L-SCQ® Inclusions Standard 316L Stainless Steel ARC+VAR 316L-SCQ® VIM+VAR 316L-SCQ® • Improved cleanliness for better corrosion resistance and safety. • Refined and uniform grain structure for enhanced electro-polishability. 316L-SCQ® is a registered trademarks of CRS Holdings, LLC
Slide 16: Typical corrosion performance of 316L-SCQ
Typical corrosion performance of 316L-SCQ® ASTM G48 Method A Corrosion Rate Grade e : A ll va r ia nts of mg/cm2 g/m2 Not ® have 3 16 L -S C Q tter Standard 316L Stainless 7.28 72.80 1/10th or be te n ra the corrosio f st a n d a rd 316L SS ARC + VAR 316L-SCQ® < 0.70 < 7.00 o VIM + VAR 316L-SCQ® < 0
Slide 17: Carpenter Technology is the leader in mission-critical semiconductor applications
Carpenter Technology is the leader in mission-critical semiconductor applications • The market leader in advanced high-purity alloys for semiconductor applications • The largest ultra-high purity capacity in the world • The broadest portfolio of alloys to solve all your needs • Deep metallurgical ex
Slide 18: Thank you
Thank you Carpenter Technology is located at booth #L1205 For additional information, please contact info@cartech.com | 610 208 2000 18