Asml Holding Nv · EURONEXT:ASML
Asml Holding Nv — Investor Presentation (December 2003)
22 slides from Asml Holding Nv's investor presentation, Dec 3, 2003
Slide 1: ASML Introduces TWINSCAN XT:1250i for Immersion Lithography
ASML Introduces TWINSCAN™ XT:1250i for Immersion Lithography December 3, 2003 / Slide 1
Slide 2: Opening Remarks
Opening Remarks Mr. Wasuke Nakano Vice President, Executive Officer, and General Manager Device Manufacturing Systems Business Group Hitachi High-Technologies Corporation / Slide 2
Slide 3: 2003 Overview: Market and ASML
2003 Overview: Market and ASML Mr. Dave Chavoustie Executive Vice President Sales ASML / Slide 3
Slide 4: 2003 Market Overview
2003 Market Overview l Third year of industry’s worst ever downturn l Order activity seen in all market segments l Lithography innovation remains key value driver for next generation electronics / Slide 4
Slide 5: Projections for lithography markets
Projections for lithography markets Stepper units 7,000 Stepper revenues 1,400 6,000 1,200 5,000 1,000 Revenue (M$) Units 4,000 800 3,000 600 2,000 400 1,000 200 0 0 1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 Source: ASML MCC / Slide 5
Slide 6: ASML has done very well: >50% $ market share in 2002
ASML has done very well: >50% $ market share in 2002 60% ASML Nikon 50% Canon 40% $ Market share 30% 20% 10% 0% 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 00 01 02 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 20 20 20 Year Source: ASML MCC / Slide 6
Slide 7: 2003 ASML overview
2003 ASML overview l Established market leadership l Reached a TWINSCAN install base of 108 systems - 50 in Asia l Shipped two full-field 157-nm tools - one to IMEC l Introduced Ultra-k1 portfolio to extend capabilities of new and existing systems l Launched new generation TWINSCAN XT:1250 / Slide 7
Slide 8: 2003 ASML Japan overview
2003 ASML Japan overview l Entered strategic litho-cluster engagement with TEL: l Multiple tool exchanges l Customer demos in Japan l Entered strategic joint-development litho-cluster engagement with Dainippon Screen l Secured new customer: Fuji Film Arch (FFA) l Successfully delivered TWINSCAN syst
Slide 9: ASML and Immersion
ASML and Immersion Mr. Paul van Attekum Senior Vice President Marketing and Technology ASML / Slide 9
Slide 10: 300-mm product roadmap and decision points
300-mm product roadmap and decision points >>1 Wet 157 nm 0.85 Wet F2 >0.9 Dry 0.85 Dry 0.75 MSVII Decide Mid-04 >>1 Wet 193 nm ArF >1 Wet >0.9 Wet 0.85 Wet 0.75 1150i PROTO TOOL ASML Dry >0.9 0.85 1200 1250 NA 2003 2004 2005 2006 2007 2008 / Slide 10
Slide 11: Early positive immersion results
Early positive immersion results Dry (NA=0.75, s=0.55/0.85) Wet (NA=0.75, s=0.55/0.85) DOF improvement in hydraulic image / Slide 11
Slide 12: AT:1150i, 90-nm dense lines and spaces
AT:1150i, 90-nm dense lines and spaces Dry Focus (um) Wet -0.5 -0.4 -0.3 -0.2 -0.1 0.0 0.1 0.2 0.3 0.4 0.5 / Slide 12
Slide 13: TWINSCAN XT:1250i
TWINSCAN XT:1250i A / Slide 13 yy ASML
Slide 14: TSMC selects ASML for industry's first immersion tool order
TSMC selects ASML for industry’s first immersion tool order l TSMC is an industry driver of immersion technology l ASML and TSMC to work closely in joint-development immersion program l TSMC chose ASML due to ASML’s technology leadership and early product availability l TSMC to take delivery of XT:1
Slide 15: TWINSCAN immersion changes
TWINSCAN immersion changes Integrate liquid supply system - temperature - degassing - purification Modified lens Use existing alignment sensor in air Liquid Wafer stage containment sealing and flattening Use existing level sensor in air Integrate wet- chuck swap solution Wet-image sensor Key advanta
Slide 16: Basic rules and trends of lithography
Basic rules and trends of lithography Resolution µ l / NA Depth of Focus µ n x l / NA2 l = wavelength NA = Numerical Aperture n = refractive index (air = 1, water = 1.4) 0.9 0.8 0.7 NA Value ( m m) 0.6 Depth of Focus 0.5 0.4 Resolution Advanced Production 0.3 Immersion KrF (248nm) 0.2 ArF (193nm) 0.
Slide 17: Room to shrink
Room to shrink Smaller process windows make system performance even more critical for die yield and to avoid rework 12 70 nm Process Window + Ultra-k1 9 Exposure energy [%] 0.85 NA ArF Scanner + Hydrolith 6 3 0 -3 System & -6 Process -9 Requirement -12 -0.6 -0.45 -0.3 -0.15 0 0.15 0.3 0.45 0.6 Focus
Slide 18: 157-nm update
157-nm update l Delivered two 157-nm systems (Micrascan VII) l First 157-nm full-field tool operational at IMEC l ASML continues to offer 157-nm process development l Next generation product lines include 157-nm / Slide 18
Slide 19: 300-mm product roadmap and decision points
300-mm product roadmap and decision points >>1 Wet 157 nm 0.85 Wet F2 >0.9 Dry 0.85 Dry 0.75 MSVII Decide Mid-04 >>1 Wet 193 nm ArF >1 Wet >0.9 Wet 0.85 Wet 0.75 1150i PROTO TOOL ASML Dry >0.9 0.85 1200 1250 NA 2003 2004 2005 2006 2007 2008 / Slide 19
Slide 20: Conclusion
Conclusion l ASML marks its technology leadership with industry first – the XT:1250i immersion system l ASML secures first-ever immersion order from TSMC l ASML delivers on both 157-nm dry and 193-nm immersion technology – customers choose / Slide 20
Slide 21: Closing Remarks
Closing Remarks Shinji Nagatani President ASML Japan / Slide 21
Slide 22: Commitment
Commitment / Slide 22