Kla Corporation · NASDAQ:KLAC
Kla — Investor Day (March 2026)
60 slides from Kla's investor day presentation, Mar 12, 2026
Slide 1: Process Control for the AI Era
Process Control for the AI Era Ahmad Khan President, Semiconductor Products and Customers March 12, 2026
Slide 2: Key Messages
Key Messages Inflections, share gains and portfolio expansion 1 will increase KLA’s process control intensity from 7.4% (CY25) to ~9% (CY30) Strong customer collaboration enables a broad, 2 differentiated product portfolio, reinforcing KLA’s competitive advantage Unique, connected portfolio, driven
Slide 3: KLA – Inspection & Metrology for 50 Years
KLA – Inspection & Metrology for 50 Years We Originally Thought it was About Finding Defects and Making Measurements – It’s Not Inspection Metrology Find Critical Defects Measure Critical Parameters Learning faster is the only sustainable competitive advantage in semiconductor manufacturing You can’
Slide 4: KLA Supports Markets Across the Semiconductor Ecosystem
KLA Supports Markets Across the Semiconductor Ecosystem Our Comprehensive Solutions and Expertise Play a Crucial Role in Enabling AI Chips Wafer-Level Packaging Components Printed Circuit Boards Logic | Foundry Memory Specialty | Legacy Wafers Reticles Semiconductor OEMs Chemicals | Materials IC Sub
Slide 5: KLA's Indispensable Process Control Portfolio
KLA’s Indispensable Process Control Portfolio Provides Solutions for Manufacturing Success BBP Patterned Wafer Inspection LS Patterned Wafer Inspection Macro Patterned Wafer Inspection Systems and All-Surface Patterned Wafer Inspection Inspection Unpatterned Wafer Inspection Co-Intelligence e-Beam I
Slide 6: The KLA Operating Model Provides a Strategic Engine for Product Differentiation
The KLA Operating Model Provides a Strategic Engine for Product Differentiation and Competitive Advantage Strategy: Provide leading technologies, differentiated solutions and superior customer experiences by leveraging our operating model Collaboration Innovation Execution KLA builds strong customer
Slide 7: Systems Market-Leading Performance
Systems Market-Leading Performance Our Ability to Uniquely Solve Our Customers’ Critical Challenges Drives Success $9.8B $9.0B 19% 62.8% Systems Revenue1 Semi PC Revenue1 Semi PC Revenue CAGR KLA Gross Margin1 CY25 CY25 CY19 – CY25 CY25 $1.44B >65% 56.5% 7.4% R&D1 PhD/Master’s Among Process Control
Slide 8: KLA Semi PC Share of Wafer Equipment
KLA Semi PC Share of Wafer Equipment Multiple Device Segments in R&D and HVM Drive New +7% Baseline Wafer Equipment ($B) $60 $56 $65 $93 $101 $99 $109 $122 9.0% 8.0% 7.4% 7.4% 6.8% 6.9% 7.0% 7.0% 7.1% 6.7% 6.0% 5.7% 5.7% 5.8% 6.4% 5.5% Annualized 5.8% 5.6% 3 Year Rolling Average 5.0% 5.3% 5.4% 4.0%
Slide 9: KLA Continues to Decisively Lead the Industry
KLA Continues to Decisively Lead the Industry #1 Market Position is Driven by Technology Differentiation and Strength in Execution Process Control Market Share 60% 50% KLA 56.5% KLA Share in 2024 40% ▪ Up 2% from 2021 30% ▪ 6.5x nearest competitor 20% Comp A ▪ Gains in optical, e-beam, 10% Comp B ad
Slide 10: Multiple Process Control Segments Drive Intensity and Share
Multiple Process Control Segments Drive Intensity and Share Higher Cost of Failure in Today’s AI-Driven Semiconductor Landscape Reticle Inspection Unpatterned Inspection Optical Inspection e-Beam Inspection ▪ 100% defect capture is ▪ More process steps, ▪ More layers ▪ 3D architectures introduce man
Slide 11: The KLA Operating Model Drives Semi PC Success
The KLA Operating Model Drives Semi PC Success Customer Collaboration Product Innovation Execution Technology High-Volume Point Product Co-Intelligent 2030 Target Inflections Manufacturing Differentiation Solutions Model 11 KLA Non-Confidential | Unrestricted
Slide 12: The KLA Operating Model Drives Semi PC Success: Technology Inflections
The KLA Operating Model Drives Semi PC Success Customer Collaboration Technology Inflections AI-Based Inflections and Chip Complexity Drive Process Control Intensity and Share 12 KLA Non-Confidential | Unrestricted
Slide 13: Evolution of AI
Evolution of AI AI Growth Will Drive Significant Demand for Compute Resources Phase 1 Phase 2 Phase 3 Phase 4 Training Scale Up Inference at Scale Cognitive Leap Agentic Economy Foundation Simple Deep Autonomous Building Reasoning Reasoning Work 13 KLA Non-Confidential | Unrestricted
Slide 14: Semiconductor Enablers of AI Evolution
Semiconductor Enablers of AI Evolution AI Drives Growth in All Device Segments CPU GPU HBM DRAM Flash Orchestration AI Compute Weights Conversations Conversation Key-Value (KV) Cache History Logic Memory 14 KLA Non-Confidential | Unrestricted
Slide 15: AI Accelerates Semiconductor Innovation
AI Accelerates Semiconductor Innovation Multiple, Leading-Edge Chips Are Assembled to Form a Complete System AI Accelerator for Server Leading-edge logic GPUs Multiple HBM modules, 8 to 12 chip stacks Large, complex package using 2.5D/3D heterogeneous integration and ~100 chips 15 KLA Non-Confidenti
Slide 16: AI-Driven Inflections Accelerate Challenges for Our Customers
AI-Driven Inflections Accelerate Challenges for Our Customers Advanced Logic Memory Advanced Packaging ▪ More logic, less pattern ▪ Smaller pattern dimensions ▪ Chip stacking redundancy ▪ Larger chip size ▪ Larger chip size ▪ Rising package value ▪ 3D transistor architectures ▪ EUV ▪ Interconnect sc
Slide 17: Critical Defect Monitoring and Variability Control for Advanced Logic
Critical Defect Monitoring and Increased Variability Control Logic Inflections are Required for Advanced Logic Manufacturing Smaller Pattern Dimensions Larger Chip Sizes ▪ Variability is inversely proportional to printed feature size ▪ Steep yield erosion on larger chip sizes 600 chips per wafer 1%
Slide 18: Complex Transistor Architectures Increase Demand for Defect and Variability Control
Complex Transistor Architectures Increase Demand for Logic Inflections Defect and Variability Control Inspection 3D Transistor Inflections Metrology find critical defects measure critical parameters Increase Yield Increase Performance Buried defectivity Work function metal and HKMG F thickness a. Sp
Slide 19: KLA's Products Deliver Solutions for Critical Logic Challenges
KLA’s Products Deliver Solutions for Critical Logic Challenges Collaboration Patterned Wafer Inspection ▪ Comprehensive BBP and e-beam inspection portfolio provides capture Print Check (EUV) Electrical 30% of all critical defect types at Buried | Subsurface Increase in Number of Inspection Layers op
Slide 20: DRAM and HBM Memory Chip Designs Drive High Yield Requirements
DRAM and HBM Memory Chip Designs Drive High Yield and Memory Inflections Reliability Requirements Higher Performing EUV Large Less Circuit Logic Circuitry Lithography Chips Redundancy Better logic Patterning More logic, more Percentage of cell area Technology performance is advancement for DRAM tran
Slide 21: DRAM and HBM Memory: EUV Adoption in DRAM
DRAM and HBM Memory Chip Designs Drive High Yield and Memory Inflections Reliability Requirements Memory Production Trends EUV Adoption: DRAM EUV Reticle Requal More process control is required to mitigate rising variability and the increased severity of defects associated with: ▪ Smaller pattern fe
Slide 22: DRAM and HBM Memory: Less Redundancy, Larger Chip Size
DRAM and HBM Memory Chip Designs Drive High Yield and Memory Inflections Reliability Requirements Memory Production Trends Less Redundancy, Larger Chip Size: HBM Percentage of Chip Area That is: More process control is required to mitigate Non-Memory rising variability and the increased severity of
Slide 23: KLA's Products Deliver Solutions for Critical Memory Challenges
KLA’s Products Deliver Solutions for Critical Memory Challenges Collaboration Increasing DRAM Intensity (% of Wafer Equipment) ▪ BBP optical and e-beam inspection synergy enables fast production ramp 1.4x $450M ▪ New Gen4 and Gen5 BBP optical inspection KLA Incremental Intensity platforms provide se
Slide 24: Advanced Packaging Compounds Integration Complexity and Yield Loss
Advanced Packaging Compounds Integration Complexity and Packaging Inflections Potential Yield Loss 3D Stacking GPU logic 2 Yield HBM Wafer-Level 2.5D Assembly DRAM memory 1 Chip Yield Logic, Memory, Interposer 3 Yield CoWoS, SoIC, … INTERPOSER High Chip Content = $$$ >100 chips per package 24 KLA No
Slide 25: KLA's Products Deliver Solutions for Advanced Packaging Ramp
KLA’s Products Deliver Solutions for Advanced Packaging Ramp Packaging Inflections Patterned Inspection 2008 wafer, frame Kronos Puma Voyager® 29xx High Throughput High Sensitivity ▪ Technology and Continued platform experience from evolution and ICOS front end process Surfscan® CIRCL -AP eDR7380 Mi
Slide 26: Interconnect Scaling in Advanced Packaging Drives Process Control Intensity
Interconnect Scaling in Advanced Packaging Drives Packaging Inflections Process Control Intensity Microbump Hybrid Bond Interconnect Scaling Bump Pitch (µm) 20 – 50 <10 ▪ Smaller 2D and 3D pattern dimensions and Bump Height (µm) 10 – 25 -0.010* – 0 pitch require more sensitive inspection and more ac
Slide 27: KLA's Products Deliver Solutions for Advanced Packaging Ramp
KLA’s Products Deliver Solutions for Advanced Packaging Ramp Close Customer Partnerships Resulted in ~4x Increase in Market Share in Four Years 50% ~$950M Process Control Market Share (%) 40% KLA Advanced Packaging Revenue in 2025 30% 20% #1 Market 10% Share in Process Control 0% in 2025 2020 2021 2
Slide 28: The KLA Operating Model Drives Semi PC Success: High-Volume Manufacturing
The KLA Operating Model Drives Semi PC Success Customer Collaboration High-Volume Manufacturing Production Variability and Increased Design Starts Require More Intensive Process Control 28 KLA Non-Confidential | Unrestricted
Slide 29: Relentless Challenges Faced by a High-Volume Manufacturing Fab
Relentless Challenges Faced by a High-Volume Manufacturing Fab Control 100s of process Maintain yield and Fabricate complex tools that execute quality for production device structures with >1,000 process steps to of multiple designs nanoscale precision produce functional chips at 100,000 WSPM featur
Slide 30: Increased Sampling is Needed to Find and Monitor Yield Challenges
Increased Sampling is Needed to Find and Monitor Yield Challenges More Sampling Leads to Higher Adoption of Process Control What Process % of Lots? Wafers per Lot? % of Wafer? Sensitivity? Layers? Layer 1 Layer 2 50nm 25nm >1500 10nm Inflections HVM Variability HVM Variability Smaller Pixels, Multi-
Slide 31: KLA's Products Deliver Solutions for Leading-Edge High-Volume Manufacturing
KLA’s Products Deliver Solutions for Leading-Edge High-Volume Manufacturing Deep Collaboration | Process Control Expertise | Portfolio ▪ One process loop shown 1 2 3 4 5 6 7 Process Steps ▪ Many process loops make up >1,000 process steps 1. Process ▪ Determine defectivity Mapping level in loop 2. De
Slide 32: Process Control Improves Productivity, Predictability and Profitability of a Fab
Process Control Improves the Productivity, Predictability and Profitability of a Fab Throughout the Manufacturing Lifecycle Random Defect Types | Sources Detect Random: uncorrelated, non-predictable Stochastic ▪ Process particles Measure and Model ▪ Equipment wear-out (bearings, seals, valves) ▪ Spo
Slide 33: KLA's Products Deliver Solutions for High-Volume Manufacturing
KLA’s Products Deliver Solutions for High-Volume Manufacturing Process Control Spend Grows with Capacity at Smaller Design Nodes High-Volume Manufacturing Investment Profile $4X N Process Control Spend ($M) $3X N-1 $2X N-2 $X Capacity (K) 33 KLA Non-Confidential | Unrestricted Source: KLA internal a
Slide 34: Enabling Customer Success Drives Our Success
Enabling Customer Success Drives Our Success Semi PC Market Baseline Semi PC Relative Outperformance from 2018 – 2025 $8.5B Revenue ($B) Process Control Intensity and Share Drivers ▪ Architectural complexity and scaling in logic, memory and advanced packaging ▪ Variability control in HVM 2018 2019 2
Slide 35: The KLA Operating Model Drives Semi PC Success: Product Innovation
The KLA Operating Model Drives Semi PC Success Product Innovation Point Product Differentiation Core technologies and AI produce world-class products 35 KLA Non-Confidential | Unrestricted
Slide 36: Our Products Require Best-in-Class Signal Coupled with Fast Data Processing
Our Products Require Best-in-Class Signal Coupled with Fast, Accurate Processing of Large Data Sets Optical inspectors find critical defects with full wafer coverage Collection Processing Results scan full wafer real time image analysis report defects images 36 KLA Non-Confidential | Unrestricted
Slide 37: KLA's Core Technologies and Expertise
KLA’s Core Technologies and Expertise Optical Inspection Architecture light optics sensors pixels algorithms k factors 37 KLA Non-Confidential | Unrestricted
Slide 38: Gen5 BBP Optical Inspection Unique Technologies
Gen5 BBP Optical Inspection Unique Technologies Light Optics Sensor DUV broadband source 300kg catadioptric Massively parallel data that is >2x the brightness objective with CaF2 collection equivalent to of the surface of the sun crystal >2,000 smartphones simultaneously taking a photo every second
Slide 39: Best-in-Class Signal Required to Find Nanoscale Defects
Best-in-Class Signal Required to Find Nanoscale Defects / Variations Advancements in Core Technologies Improve Resolution and Contrast, and Reduce Noise contrast resolution contrast Pure Signal 39 KLA Non-Confidential | Unrestricted
Slide 40: Broadband Optical Inspection Delivers Unique Value
Broadband Optical Inspection Delivers Unique Value Gen4 and Gen5 provide the widest wavelength Full wafer inspection is critically important Sensitivity range to find all defect types and sizes Coverage as defects can occur anywhere Yield-impacting defects can occur anywhere on the wafer Yield-Criti
Slide 41: Framework for Extending System Performance
Framework for Extending System Performance Visible UV DUV Next Year 1990 1995 21xx 2000 2005 23xx 2010 28xx 2015 LEVERAGE CORE TECHNOLOGIES 2020 29xx 39xx 2025 Gen4 Gen5 2030 2035 Gen6 41 KLA Non-Confidential | Unrestricted
Slide 42: Fast, Accurate Processing of Data Required for Wafer Coverage
Fast, Accurate Processing of Data Required for Wafer Coverage An optical inspector collects 78 trillion pixels contained in 65 million frames per wafer One BBP tool generates: using ~125 TB/hour 40 GPPS image sensors ~1 PB in an 8 hour shift and GPU-based image 60 GB/s computers running AI-based alg
Slide 43: AI at KLA: Five Layers Form a Differentiated Solution
AI at KLA: Five Layers Form a Differentiated Solution 5 Applications Workflows for fab-wide process control 4 AI Models Models trained in optics, design and context 3 Software Infrastructure to manage high- volume, high data rate information in a production environment 2 High-Performance Compute GPU
Slide 44: KLA's AI Stack: Layer 2
KLA’s AI Stack: Layer 2 High-Performance Compute with CPU/GPU Infrastructure Optimizes System Performance and Cost Big Data Infrastructure High-Performance Compute Architecture Improved Inspection Sensitivity is Achieved through Smaller Pixels, Lead Compute Worker Cluster Storage Node Rack Enabling
Slide 45: KLA's AI Stack: Layer 4
KLA’s AI Stack: Layer 4 Models Trained in Optics, Design and Context Optics | Design Info Pixel-Level Learning Context Mapping DL-Based Detection ▪ Sub-pixel aligned optics ▪ Learn features at every pixel ▪ Learned segmentation from ▪ Enhanced defect capture and ▪ Design and e-beam images design nui
Slide 46: The KLA Operating Model Drives Semi PC Success: Co-Intelligent Solutions
The KLA Operating Model Drives Semi PC Success Product Innovation Co-Intelligent Solutions Connected portfolio accelerates customer yield 46 KLA Non-Confidential | Unrestricted
Slide 47: Reticle Quality is Critical; Inspection Challenges are Many
Reticle Quality is Critical; Inspection Challenges are Many 100% Capture of Defects is Required Large Chip Size Reticle defect Repeater defect in every chip on the wafer: Unique reference catastrophic to yield needed for inspection EUV Prints Smaller Patterns, Smaller Defects Many Different Defect T
Slide 48: Reticle Quality is Critical in Both the Mask Shop and IC Fab
Reticle Quality is Critical in Both the Mask Shop and IC Fab Mask Shop – where reticles are made IC Fab – where reticles are used to make chips reticle blank patterned reticle patterned wafer IN OUT OUT clean etch implant wafer processing reticle processing litho dep dep resist, e-beam write, develo
Slide 49: Reticle Portfolio Inspection Strategy
Number and Mix of Reticles Used in Chip Production Drive the Need for a Reticle Portfolio Inspection Strategy Number of Reticles Lithography 193 | 193i EUV Technology 50+ Reticles 20+ Reticles = Advanced Number of Designs Logic Inspection DUV High Sensitivity x Technology 65+ Reticles 3-5 Reticles N
Slide 50: KLA's Reticle Product Portfolio Has Evolved
KLA’s Reticle Product Portfolio has Evolved to Support Reticle Inspection Challenges Litho Wavelength Use Case Release Date Optical Teron 610/630/640 193/193i >70 nm 2009 Mask Shop Teron 640e/eS/eS2 EUV >3x nm 2017 TeraBeam® 8xx EUV 1x nm - 3x nm 2026 2x nm – 3x nm* Actinic 7xx EUV *Requires NA Chan
Slide 51: TeraBeam 8xx: High Resolution Reticle Pattern Inspection
TeraBeam® 8xx: High Resolution Reticle Pattern Inspection Critical for Finding the Smallest Defects Written on Reticle TeraBeam® 8xx Complex, Differentiated, Multi-Column e-Beam Technology Captures Critical Defects on Advanced Reticles 51 KLA Non-Confidential | Unrestricted
Slide 52: TeraBeam 8xx: High Resolution Reticle Pattern Inspection
TeraBeam® 8xx: High Resolution Reticle Pattern Inspection e-Beam: Ultimate Resolution for the Smallest Critical Defects Source: “High-resolution multi-column electron beam inspection for EUV reticle development and 52 KLA Non-Confidential | Unrestricted production,” SPIE Advanced Lithography + Patte
Slide 53: High-Volume Manufacturing Reticle Requalification Requires Co-Intelligent Solutions
High-Volume Manufacturing Reticle Requalification Requires Co-Intelligent Solutions No Escape Risk at Optimized Cost Significant Adoption Across Logic and DRAM Cumulative Units for Reticle Requal in IC Fab Defense 1 DUV Reticle Requal and Gen5 Wafer Print Check 1 inspection for every ~100-200 wafers
Slide 54: KLA's e-Beam Portfolio: Point Product Differentiation
KLA’s e-Beam Portfolio: Point Product Differentiation Supports Co-Intelligent Solutions 1 If you can detect with optical, you always use optical 1nm Range of Defect Sizes Covered by High Sensitivity Inspection 50nm 2 GAA Transistor Architecture 3 Co-Intelligent Solution: Optical and e-Beam ▪ New sub
Slide 55: KLA's e-Beam Portfolio: Point Product Differentiation
KLA’s e-Beam Portfolio: Point Product Differentiation Supports Co-Intelligent Solutions eSi50 eSV100 eDRX1 eM200 single beam inspection multi-beam inspection review metrology Discover Critical Defects Identify and Classify Measure Critical Defects Parameters Differentiated e-Beam Portfolio Supports
Slide 56: BBP and e-Beam Co-Intelligent Solution: Fast Cycles, Higher Yield
BBP and e-Beam Co-Intelligent Solution: Fast Cycles | Higher Yield eSi50 single beam Gen4 | Gen5 BBP optical inspection eDRX1 review BBP Test Image e-beam inspection wafer-level monitoring e-beam baseline validation BBP Difference Image eSV100 multi-beam AI Compute eM200 metrology AI and e-Beam Syne
Slide 57: BBP Optical Inspection Success
BBP Optical Inspection Success ~$8.5B ~30% >600 >180 BBP Optical Inspection BBP Optical Inspection Gen4 Systems Gen5 Systems Revenue CAGR Shipped Shipped CY22 – CY25 CY19 – CY25 release to end of CY25 release to end of CY25 Gen4 Gen5 R90x | 29xx 39xx BBP Optical Inspection is Required for Yield, Rel
Slide 58: 2030 Systems Target Model
2030 Systems Target Model 58 KLA Non-Confidential | Unrestricted
Slide 59: Strategy Drives Outperformance
Strategy Drives Outperformance Strategy: Provide leading technologies, differentiated solutions and superior customer experiences by leveraging our operating model Collaborate Innovate Logic Memory Advanced High-Volume BBP Optical Reticle e-Beam Portfolio Inflections Demand Packaging Manufacturing I
Slide 60: KLA Systems 2030 Target Model
KLA Systems 2030 Target Model $3.1B $20.5B $7.6B 11% - 13% CAGR Market 15% - 17% CAGR $9.8B Systems Revenue Semi PC CAGR ~4.5% > Market CAGR CY25 Market Baseline Market Outperformance CY30E Achieving Our CY30 Targets through Continued Product Differentiation and Portfolio Solutions for R&D and HVM 6