Formfactor, Inc. · NASDAQ:FORM
Formfactor — Technical Presentation
15 slides from Formfactor's technical presentation
Slide 1: International Technology Roadmap for Semiconductors
International Technology Roadmap for Semiconductors Dave Armstrong – Advantest Ira Feldman – Feldman Engineering Marc Loranger - FormFactor
Slide 2: Overview
Overview • Who are we? • Why a roadmap? • What is the purpose? • Example Trends • How can you help? • Summary Armstrong- Feldman- Loranger
Slide 3: ITRS Team
ITRS Team • Large ITRS Team – More than a 1,000 professionals – Over 100 companies – 16 Working Groups • Test Working Group – More than 70 professionals – More than 45 companies • Three of us are presenting today – Dave (Advantest) – Test TWG Chairman – Marc (FormFactor) - Probing Team Leader – Ira
Slide 4: Why a Roadmap?
Why a Roadmap? • The ITRS is generated each year to report on the technological fundamentals of our industry. • In addition, by extrapolating on the trends inherent in today’s semiconductor technology we identify disconnects and discuss possible approach to overcome these challenges. • Through this
Slide 5: What Is and What Isn't the ITRS
What Is and What Isn’t the ITRS What Is the ITRS What Isn’t the ITRS – The combined expert – It doesn’t implement or opinion by this team. define Moore’s Law – it – The results of many just tries to predict how different technology things will likely trend. models. – A commitment from the – A “best
Slide 6: ITRS Process
ITRS Process Entire Team Publishes a New Sub-Team Roadmap Yearly Analyzes Implications Working Group Discusses Challenges Implications Discussed with Other Working Groups Sub-Team Reconciles Feedback from Other Groups Armstrong- Feldman- Loranger
Slide 7: Test Complexity Drivers
Test Complexity Drivers • Device trends – Increasing device interface bandwidth – Increasing device integration (SoC, SiP, MCP, 3D packaging) • Homogenous & heterogeneous dies functional disaggregation – Integration of emerging and non-digital CMOS technologies – Complex package electrical and mec
Slide 8: Date = When in Production
Date = When in Production ITRS 2013 Overview: Figure 1a A Typical Technology Production “Ramp” Curve (within an established wafer generation) Armstrong- Feldman- Loranger
Slide 9: Wafer Probe Requirements
Wafer Probe Requirements Parameter MPU & DRAM NAND RF & LCD CIS ASIC AMS Drivers Wirebond – inline pad pitch X X X X X X Wirebond – stagger pad pitch X X X Bump – array pitch X X I/O Pad Size X X X X X Wafer Test Frequency X X X X High Speed I/O Frequency X X X Wirebond - Probe Tip Diameter X X X X
Slide 10: Parallelism Trend
Parallelism Trend Armstrong- Feldman- Loranger
Slide 11: SoC (MPU) Bump Pitch Trend
SoC (MPU) Bump Pitch Trend • Technology shift in 2012 Armstrong- Feldman- Loranger
Slide 12: Prober accuracy vs. Pad size
Prober accuracy vs. Pad size • Prober roadmap is not tracking with decreasing pad sizes • An especially difficult issue for Full Wafer Contactor probe cards Armstrong- Feldman- Loranger
Slide 13: Next Challenges for Probe Cards
Next Challenges for Probe Cards • Decreasing pad / bump sizes and pitch • Increasing parallelism SoC and Memory • Increased use of die for MCP, 2.5D and 3D integration will drive more wafer sort • 2 sided probing • Testing stacked devices (e.g. HBM) • MEMS and sensor sort test • Cost of test as a dr
Slide 14: Opportunities for Involvement!
Opportunities for Involvement! • Download ITRS data at: http://www.itrs.net/Links/2013ITRS/Home2013.htm • Provide feedback on test data at: http://j.mp/ITRSTestSurvey • Sign up: dave.armstrong@advantest.com Armstrong- Feldman- Loranger
Slide 15: Summary
Summary • Great Tool – Well accepted independent industry wide reference • Challenges – Requires broad-based inputs – Track potential disruptive technology • Help Us – Get Involved! Armstrong- Feldman- Loranger