ASML Holding NV · EURONEXT:ASML

ASML Holding NV — Barclays Capital Global Technology Conference 2009

25 slides from ASML Holding NV's conference presentation, Dec 9, 2009

  1. Slide 1: Barclays Capital Global Technology Conference

    Barclays Capital Global Technology Conference San Francisco, CA December 2009 / Slide 1

  2. Slide 2: Safe Harbor

    Safe Harbor “Safe Harbor” Statement under the U.S. Private Securities Litigation Reform Act of 1995: the matters discussed in this document may include forward-looking statements that are subject to risks and uncertainties including, but not limited to: economic conditions, product demand and semico

  3. Slide 3: ASML overview - The world's leading provider of lithography systems

    ASML overview - The world’s leading provider of lithography systems for the semiconductor industry Key facts Ranked in the top 3 for Established: 1984 customer satisfaction for the 6th consecutive year Headquarters: Veldhoven, the Netherlands Market cap ~ €9 B Employees ~ 6,500 Customers: Serving 17

  4. Slide 4: Market Update

    Market Update & WS ¥° ASML / Slide 4

  5. Slide 5: 2009 WW GDP growth forecast is stable at -1.0%

    2009 WW GDP growth forecast is stable at -1.0%, 2010’s remains at +3.7% but mainly driven by governments’ rescue packages 2009 Regional GDP forecast over time 2010 Regional GDP forecast over time 12% 12% 10% 10% 8% 8% 6% GPD growth [%] 6% Global GPD growth [%] 4% 4% US 2% 2% EU 0% 0% Japan Jun-08 Ju

  6. Slide 6: Consumer confidence still remains at low levels

    Although increasing, consumer confidence still remains at low levels compared to historical values Consumer Confidence of Main Regions 120 110 100 US 90 Japan China 80 9/11 Europe Average end .com Hurricanes 70 bubble Katrina & Rita 60 Gulf war 2 Credit Crunch + Record oil prices 50 Jan-00 Jan-01 Ja

  7. Slide 7: 2009 semiconductor revenue growth forecast

    Average 2009 semiconductor revenue growth now forecast at -11.6% as most analysts increased their 2009 outlook 2009 Semiconductor revenue growth forecast over time 15% YoY Semiconductor revenue growth 10% Future Horizons SIA 5% Semico Dataquest 0% IDC May-08 May-09 Jan-08 Mar-08 Jun-08 Nov-08 Jan-09

  8. Slide 8: 2010 semiconductor revenue growth forecast

    2010 Semiconductor revenue growth forecast of 3rd- party analysts is now at +13.3%, indicating bullish sentiment 2010 Semiconductor revenue growth forecast over time 25% YoY Semiconductor revenue growth Future Horizons 20% SIA Semico Dataquest 15% IC Insights [%] WSTS 10% iSupply VLSI Research 5% AV

  9. Slide 9: Days of IC inventory down in September

    Days of IC inventory down to 33 in September as OEMs are buying significantly in anticipation of strong Christmas demand 3mma IC unit sales, inventory and inventory days monthly IC inventory based on 3mma IC ASPs 25 3mma IC unit sale 100 3mma IC unit sales / Inventory [Bio. Units] 3mma IC unit sales

  10. Slide 10: DDR2 and DDR3 spot prices kept increasing due to shortages

    DDR2 and DDR3 spot prices kept increasing due to shortages All DRAM manufacturers are now cash-profitable MAIN DRAM SPOT & CONTRACT PRICES (01/2008 - 2009YTD) 2.7 1Gb DDR2 667 SPOT PRICE 1Gb DDR2 667 CONTRACT PRICE 2.4 1Gb DDR3 1066 SPOT PRICE 1Gb DDR3 1066 CONTRACT PRICE 2.1 300 mm cash-costs for 7

  11. Slide 11: Market Update - Summary

    Market Update - Summary 2009 WW GDP forecast stable in negative territory - 2010 forecasted to grow Consumer confidence remains low 2009 semi forecasts keep increasing, indicating improved end- consumer electronics demand As of September 09, absolute inventory levels decreased faster than IC sales r

  12. Slide 12: Litho Technology

    Litho Technology & WS ¥° ASML / Slide 12

  13. Slide 13: Customer Roadmaps drive Lithograph tool development

    Customer Roadmaps drive Lithograph tool development 200 Half Pitch status : Logic = 40~45nm DRAM = 45~55nm NAND = 35~45nm 100 Half Pitch (nm) Logic 80 60 DRAM 40 NAND Flash Jan-00 Jan-02 Jan-04 Jan-06 Jan-08 Jan-10 Jan-12 / Slide 13

  14. Slide 14: ASML 300mm Product Roadmap

    ASML 300mm Product Roadmap λ Res. NA 300 mm 22nm 0.32 NEXT EUV 13 nm 27nm 0.25 NXE:3100 40nm 0.25 ADT NXT:1950i 38nm 1.35 XT:1950Hi ArF 40nm XT:1900Gi 193 nm 45nm 1.20 XT:1700Fi 57nm 0.93 XT:1450G H ` 80nm 0.93 XT:1000H KrF 248 nm 110nm 0.80 XT:8x0G H 120nm XT:800G H i-Line 220nm XT:450G H 0.65 365

  15. Slide 15: ASML roadmap enables shrink for Logic, DRAM, and NAND flash

    ASML roadmap enables shrink for Logic, DRAM, and NAND flash at time required 200 Resolution/half pitch “Shrink” [nm] k1=0.4 Logic Litho technology DRAM will allow Logic to shrink 100 AT:850 NAND 80 AT:1200 k1=0.27 XT:1400 To enable 60 continued R&D XT:1700i shrink for memory: EUV is XT:1900i 40 need

  16. Slide 16: Double patterning will bridge the gap between immersion and EUV

    Double patterning will bridge the gap between single exposure immersion and EUV 200 NAND Flash DRAM Resolution, "Shrink" (nm) 100 Logic 80 Double 60 50 Immersion patterning technology 40 30 EUV 20 ’02 ’03 ’04 ’05 ’06 ’07 ’08 ’09 ’10 ’11 ’12 ’13 ’14 / Slide 16

  17. Slide 17: Multiple TWINSCAN NXT:1950i shipped

    Multiple TWINSCAN NXT:1950i shipped • For double patterning 30 nm and smaller • Productivity more than 175 wafers per hour • Overlay less than 3 nm / Slide 17

  18. Slide 18: EUV for 22nm and beyond - systems to ship in 2010

    EUV for 22nm and beyond – 5 systems to ship in 2010 Machine design changes ● Mirror optics and wafers in vacuum ● Moving stages in vacuum ● New type of light source / Slide 18

  19. Slide 19: Technology in Time helps grow market share

    Technology in Time helps grow market share ASML market share (revenue) – Nearly tripled in 10 years 6” & early i-line 8” & i-line KrF & Step & Scan 12” & ArF ArFi 60% 50% 40% 30% 20% 10% 0% 1984 1986 1988 1990 1992 1994 1996 1998 2000 2002 2004 2006 2008 2008 Canon 11% Nikon ASML 24% 65% Total marke

  20. Slide 20: Lithography System costs will continue to rise

    Lithography System costs will continue to rise 100 150mm 200mm Wafer Wafer Size Size 300mm Relative List Price Dual Stage 1.35 1.2 0.93 Step & Scan 10 Platform Platform 0.8 0.7 Stepper 0.5 Aperture 0.6 Aperture Wavelength Wavelength 0.4 i-line KrF ArF ArFi EUV? 1 1985 1990 1995 2000 2005 2010 Year /

  21. Slide 21: Average Selling Price (ASP) grows

    Average Selling Price (ASP) grows ASML ASP new systems ArF volume & ArFi 25 300mm & ArF 20 KrF & Step & Scan million Euro 15 10 5 0 1997 1999 2001 2003 2005 2007 2009 YTD / Slide 21

  22. Slide 22: Single exposure lithography enables cost effective shrink

    Single exposure lithography enables cost effective shrink >3000X cost reduction per function over 25 years Productivity increases die Cost output per f Cost per function Tool cost/DPH unct Double patterning io n our erh p i es Productivity & D design rule shrink enable cost per ol cost Technology fu

  23. Slide 23: 25 years of cost effective innovation

    25 years of cost effective innovation Productivity and resolution enable cost reduction per function over 25 years Model: 2500/40 5500/100 5500/550B AT:1150C XT:1900i NXT:1950i* EUV Introduction: 1987 1994 1999 2003 2007 2011 2012 Wavelength: 365nm 365nm 248nm 193nm 193nm 193nm 13.5nm Max NA: 0.4 0.

  24. Slide 24: Summary

    Summary The Semiconductor industry is in a transition phase due to the current severe worldwide financial crisis Shrinking design rules have been the economical driver of the IC industry. Lithography remains the key enabler Shrinking design rules require increasingly more sophisticated litho systems

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