Aem Holdings Ltd. · SGX:AWX
Aem — H1 2024 Earnings Presentation
9 slides from Aem's earnings presentation, August 2024
Slide 1: AEM Investor Update 1H 2024
AEM Investor Update 1H 2024 AEM | 1H 2024 Investor Update
Slide 2: Disclaimer
Disclaimer This is a presentation of general information relating of financing. Accordingly, such statements are not and to the current activities of AEM Holdings Ltd. (“AEM”). should not be construed as a representation as to the It is given in summary form and does not purport to future of AEM, an
Slide 3: 1H2024 Highlights
1H2024 Highlights Group meets 1H2024 revenue guidance, and sees significant new business growth in 4Q2024 • Ms. Amy Leong was appointed CEO effective 1 July 2024 to drive business growth in semiconductor test and technology leadership in the AI/HPC and advanced packaging segments. • The Group report
Slide 4: Key Financial Highlights
Key Financial Highlights Revenue came within 1H2024 guidance, and the Group maintained a Debt / Equity ratio of 0.2x Revenue As at Jun’24 Dec’23 S$M S$M S$173.6M -37% vs 1H2023 Cash 79.0 101.8 Inventories 327.8 328.6 Trade and other receivables 67.1 58.8 Trade and other receivables (+S$8.3M) PBT (ex
Slide 5: Consumables Remained Resilient at 51% of Test Cell Solutions Revenue
Consumables Remained Resilient at 51% of Test Cell Solutions Revenue Despite revenue decline in both Contract Manufacturing and Test Cell Solutions Total Revenue Mix (S$M) Test Cell Solutions Revenue Mix (S$M) 275.2 172.5 98.7 36% 50.6 29% 173.6 4.0 1% 99.8 70.3 41% 80.7 47% 34.9 35% 3.4 2% 172.5 63
Slide 6: Customer-Focused R&D Investment and Leadership in Core Competencies
Customer-Focused R&D Investment and Leadership in 3 Core Competencies Improve Test Quality Reduce Test Time By Thermal Increase Throughput Lower Cost of Test By By Automation Application-Optimized ATE AEM | 1H 2024 Investor Update 6
Slide 7: Thermal Technology is Critical to AI & Advanced Packaging
Thermal Technology is Critical to AI & Advanced Packaging AI chips demand more power, and with power comes thermal challenges and exceptionally longer test times Sample AI Chip Roadmap* HBM SoC Interposer 2024 2027 Substrate 1.0kW Power 3.0+kW Power > 80mm package >150 mm package Increasing power de
Slide 8: New Business Revenue On Track to Double in 2024
New Business Revenue On Track to Double in 2024 Continued progress with System-Level-Test (SLT), Burn-in (BI), and Final Test (FT) Customer Engagements Industry First Production Burn-in System for AI/HPC 2024 GDDR SLT Memory Production High-throughput High- voltage Stress Testing Production xPU SLT
Slide 9: Thank You
Thank You Investor Relations Contact Samir MOWLA samir.mowla@aem.com.sg Financial PR Pte Ltd Kamal SAMUEL / Shivam SARAF Tel: 6438 2990 / Fax: 6438 0064 kamal@financialpr.com.sg shivam@financialpr.com.sg AEM | 1H 2024 Investor Update