Slide 1: Camtek at a glance
Camtek at a glance High - end inspection and metrology systems provider for the semiconductor manufacturing market Camtek is a key enabler of AI - driven semiconductor innovation ~ % Revenue CAGR, 2019 – 2025 >$ M Cash, Deposits and Cash Equivalent ~ $ M 2026 E revenues + Employees > Customers, incl
Slide 2: Disclaimer
Disclaimer 2 Copyright of Camtek Ltd 2026 . All rights reserved Confidentiality This presentation is confidential and may not be reproduced or distributed to others at any time without our prior written consent. Forward - Looking Statements This presentation contains forward - looking statements wit
Slide 3: Today's Presenters
Copyright of Camtek Ltd 2026 . All rights reserved 3 Executive Chairman Chief Executive Officer Chief Financial Officer President and COO Marketing Director Grand Hyatt San Francisco, Union Square | October 14 , 2026 Today ’ s Presenters
Slide 4: Breaking News – Record Revenue Levels
Copyright of Camtek Ltd 2026 . All rights reserved 4 Breaking News – Record Revenue Levels Q 3 preannouncement, Q 4 guidance and a first look at 2027 01 Q 3 2026 Preannouncing Q 3 revenues + 27 % YoY 02 Q 4 2026 Q 4 guidance + 40 % YoY Bringing FY 2026 to ~$ 595 M 03 FY 2027 2027 initial revenue out
Slide 5: Semiconductors Market Forecast
Copyright of Camtek Ltd 2026 . All rights reserved 5 Semiconductors Market Forecast The Momentum Continues Source: TechInsights 2026 forecast $ 1.7 T $ 2.3 T $ 3 T $ 1,5 T $ 1,0 T $ 0,65 T $ 0,5 T $ 0,0 T $ 2,0 T $ 2,5 T $ 3,0 T $ 3,5 T 2024 2026 F 2028 F 2030 F
Slide 6: Our Path to Double Our Revenues
2026 E 2027 E Target in ~ 3 years Our Path to Double Our Revenues Organic growth targets $ 1.2 B in annual revenue in ~ 3 years GROWTH ENGINES AI data centers & accelerated computing Compute for AI training and inference Camtek ’ s primary market Physical & edge AI Robotics, autonomous vehicles, dro
Slide 7: Advanced Packaging: Our Main Market
Advanced Packaging: Our Main Market More Volume, More Complexity Advanced packaging is scaling 01 HBM • More capacity • More memory layers • Higher complexity 02 2.5 D / 3 D Integration • 2.5 D continues to expand • More devices & interfaces • Increasing architectural complexity CoWoS, Foveros and o
Slide 8: Why Camtek Is Built to Win
Why Camtek Is Built to Win We Are Positioned at the Heart of the AI Advanced Packaging Transition • Leading capabilities in 2 D Inspection, 3 D bump Metrology and Metrology • Strong position in the most demanding Advanced Packaging applications • Breakthrough innovations in optics and AI - based def
Slide 9: Camtek Organic Growth Strategy
Copyright of Camtek Ltd 2026 . All rights reserved 9 Camtek Organic Growth Strategy
Slide 10: Advanced Packaging is an Enabler for AI
Copyright of Camtek Ltd 2026 . All rights reserved 10 Copyright of Camtek Ltd 2026 . All rights reserved 10 Advanced Packaging is an Enabler for AI Copyright of Camtek Ltd 2026 . All rights reserved 10 Compute Best - in - class computation Memory Very high memory capacity Power High power dissipatio
Slide 11: Advanced Packaging grows twice as fast
Copyright of Camtek Ltd 2026 . All rights reserved 11 Advanced Packaging grows twice as fast 0 50 100 150 2025 2026 F 2027 F 2028 F 2029 F 2030 F 2031 F Million 300 mm - equivalent wafers processed, 2025 – 2031 F Advanced packaging wafers + 13 % CAGR Total production wafers + 7 % CAGR 200 AP is our
Slide 12: High-end AP grows twice as fast as the AP market
Copyright of Camtek Ltd 2026 . All rights reserved 12 High - end AP grows twice as fast as the AP market 0 35 70 105 2025 2026 F 2027 F 2028 F 2029 F 2030 F 2031 F Advanced packaging wafer volume, million 300 mm - equivalent wafers processed, 2025 – 2031 F High - end AP ( 2.5 D, 3 D, etc) + 24 % CAG
Slide 13: Edge AI Will Demand
Copyright of Camtek Ltd 2026 . All rights reserved 13 Copyright of Camtek Ltd 2026 . All rights reserved 13 Edge AI Will Demand We are only at the beginning of the revolution 13 WHAT INDUSTRY LEADERS SAY UNITS PER YEAR TODAY AI data - center GPU Modules 10 M BY 2030 GPU Modules Humanoid robots & aut
Slide 14: Silicon Photonics Forecast – new AI growth engine
Copyright of Camtek Ltd 2026 . All rights reserved 14 Silicon Photonics Forecast – new AI growth engine Si PIC die shipments, million units, 2023 – 2030 F 3.6 M 23 M 0 30 60 90 2023 2024 2025 2026 F 2027 F 2028 F 2029 F 2030 F 2023 – 2030 Silicon photonics shipments grow by 2030 Source: Yole 2025 83
Slide 15: SiPh: Why the platform moved from promise to production
AI accelerators & memory SiPh at the Why the platform moved from promise to production NOW NEXT GEN Foundry - level maturity TSMC, Tower, GlobalFoundries and others run SiPh in mass production Copyright of Camtek Ltd 2026 . All rights reserved 15 15 Copyright of Camtek Ltd 2026 . All rights reserved
Slide 16: Silicon Photonics Potential for Camtek
Silicon Photonics Potential for Camtek ek: What it adds for Camt › New process steps › Advanced packaging › More silicon Integrating photonics with advanced packaging adds new process steps and more silicon Integration with advanced packaging Silicon photonics will be integrated with high end advanc
Slide 17: Micro-Bump Interconnect Still Growing
Micro - Bump Interconnect Still Growing Innovation to maintain market dominance MICRO - BUMP SCALING 6 µm Most advanced today 5 µm Next Possible CAMTEK BUMP METROLOGY 8 th gen. Market dominance in advanced packaging Fan - in and fan - out applications at leading OSATs worldwide 8 th + 9 th gen. Refe
Slide 18: Hybrid Bonding Penetration for HBM and 2.5D
Hybrid Bonding Penetration for HBM and 2.5 D 0 % 3 % 6 % 9 % 2026 2027 2028 2029 2030 Hybrid bonding interconnects as a share of total 2.5 D and 3 D interconnects, 2026 – 2030 Hybrid bonding share of 2.5 D + 3 D interconnects ~ 3 î by 2030 12 % HB growth provides new opportunities for Camtek Copyrig
Slide 19: Advanced Packaging is an Enabler for AI
Advanced Packaging is an Enabler for AI THE RESULT Trends leading to Compute Best - in - class computation Memory Very high memory capacity Power High power dissipation Bandwidth High data transfer AI demands drive new packaging technologies, and with them more complexity WHAT AI DEMANDS HOW PACKAGI
Slide 20: Why Complexity Accelerates Camtek's Growth
Why Complexity Accelerates Camtek ’ s Growth 01 MORE STEPS 3 → 9 RDL layers per package High - density fan - out triples the redistribution layers. Every added layer is its own inspection and metrology step. SemiEngineering, Jul 2026 02 WARPAGE FOR WAFER AND DIE 1 mm → 0.1 mm Wafer limit → package b
Slide 21: Camtek Portfolio
Camtek Portfolio Metrology family NanoProf ® Elevating Nanoscale Metrology A D V A N CE D PA CK AG IN G – Die and Wafer warp | RDL | TSV H Y B R I D B O N D IN G – Pre - bonding metrology W AF E R F A B R IC AT I O N – Post CMP metrology ADD - ON MODULE FOR EAGLE AND HAWK 360 ƒ SCAN High - resolutio
Slide 22: 2027 – Technology Roadmap
2027 – 28 Technology Roadmap: Inspection technology vectors to support the target of ~$ 1.2 B Addressing higher performance inspection and HB challenges Addressing higher performance inspection and HB challenges WHERE WE WILL GROW Markets High - end advanced packaging Hybrid bonding, supporting sens
Slide 23: 2027–28 Technology Roadmap
VIA TSV Micron - level TSV diameter, front end and advanced packaging POST - CMP Topology Post - CMP roughness wafer metrology, crucial for Hybrid Bonding POST - CMP Dishing Pre - Hybrid Bonding, post CMP copper dishing metrology PRE - BOND Warpage Pre - bond, high - throughput wafer and die warpage
Slide 24: Our Organic Growth SAM
Our Organic Growth SAM $ 1.5 B $ 500 M $ 800 M $ 3.9 B $ 1.1 B 2026 2030 E $ 2.2 B $ 5.8 B Metrology Inspection in advanced packaging Inspection in wafer manufacturing SAM growth Copyright of Camtek Ltd 2026 . All rights reserved 24 Copyright of Camtek Ltd 2026 . All rights reserved 24 24 Copyright
Slide 25: 2026 Tools Split by Inspection and Bump Metrology
2026 Tools Split by Inspection and Bump Metrology 25 Copyright of Camtek Ltd 2026 . All rights reserved Inspection 2 D inspection systems Inspection + 3 D sensor Inspection tools with 3 D bump metrology sensor Bump metrology Dedicated 3 D bump metrology systems
Slide 26: How We Reach ~$1.2B
Copyright of Camtek Ltd 2026 . All rights reserved 26 How We Reach ~$ 1.2 B STRENGTHEN Inspection Continue to strengthen our position – 2.5 D interposers, HBM and Hybrid Bonding – Expand our position in specialty wafer fabrication – Become a major player in the Si - Photonics market EXPAND Expand ou
Slide 27: How We Reach ~$1.2B (cont.)
Copyright of Camtek Ltd 2026 . All rights reserved 27 How We Reach ~$ 1.2 B (cont.) OUR CORE 3 D bump metrology Maintain our leadership and technology superiority COMPETE Compete with larger players – Our technology is competitive – Built for customer customization – Dominant position in OSATs – A p
Slide 28: Doubling Revenue in ~3 Years
Doubling Revenue in ~ 3 Years Key drivers and the path to ~$ 1.2 bn in revenue with improved financial metrics 28 Copyright of Camtek Ltd 2026 . All rights reserved
Slide 29: Q3 2026 Preannouncement and Guidance
01 Q 3 2026 Preannouncing Q 3 revenues + 27 % YoY 02 Q 4 2026 Q 4 guidance + 40 % YoY Bringing FY 2026 to ~$ 595 M 03 FY 2027 2027 initial revenue outlook > + 35 % over FY 2026 E 29 Copyright of Camtek Ltd 2026 . All rights reserved
Slide 30: Over $800M of Orders Received in 2026
Copyright of Camtek Ltd 2026 . All rights reserved 30 BY APPLICATION ~ 80 % Advanced Packaging Advanced Packaging Specialty, Photonics and other BY CUSTOMER TYPE > 50 % OSATs OSATs Foundries, IDMs and memory makers Over $ 800 M of Orders Received in 2026
Slide 31: Long Track Record of Growth and Profitability
Copyright of Camtek Ltd 2026 . All rights reserved 31 Long Track Record of Growth and Profitability 315 429 496 595 2023 2024 2025 2026 F Revenue has doubled in 4 - 5 years, with gross and operating margins expanding at the same time Revenue ($ millions) 24 % Revenue CAGR 2023 – 2026 F ~ 2 x revenue
Slide 32: Outperforming the Industry
Outperforming the Industry 0 200 100 300 500 400 600 2017 2018 2019 2020 2021 2022 2023 2024 2025 2026 E Camtek revenue Wafer fab equipment Semiconductor sales Cumulative growth, indexed to 2017 = 100 700 Camtek revenue cumulative growth, 2017 → 2026 E + 540 % Wafer fab equipment cumulative growth,
Slide 33: Driving Shareholder Value
Driving Shareholder Value 800 700 600 500 400 300 200 100 0 2024 2022 Camtek 2023 SOX semiconductor 2025 Nasdaq Composite 2026 * S&P 500 Indexed, 31 December 2022 = 100 Camtek since 31 Dec 2022 + 654 % SOX semiconductor since 31 Dec 2022 + 423 % Nasdaq Composite since 31 Dec 2022 + 160 % S&P 500 sin
Slide 34: Doubling Revenue to ~$1.2B in ~3 Years
Doubling Revenue to ~$ 1.2 B in ~ 3 years ~$ 600 M +$ 380 M +$ 120 M +$ 110 M ~$ 1.2 BN 2026 F Inspection & bump metrology systems Metrology Service & software $ 1.2 B Model Based on organic growth from three engines of growth Products growth led by Camtek ’ s next - generation tools Copyright of Ca
Slide 35: Increased Recurring Revenue Base
Copyright of Camtek Ltd 2026 . All rights reserved 35 Increased Recurring Revenue Base $ 20 M $ 28 M ~$ 140 M A growing installed base drives service and software revenue — both accretive to margin Service and software revenue ($ millions) 2024 5 % 2025 6 % @ $ 1.2 B 12 % ~ 4,000 Installed Base → $
Slide 36: Continued Focus on R&D: Maintaining Technology Leadership
Copyright of Camtek Ltd 2026 . All rights reserved 36 $ 33 M $ 43 M $ 58 M $ 120 M Continued Focus on R&D: Maintaining Technology Leadership R&D expense ($ millions, non - GAAP) % of sales +~ 80 % growth in R&D spend, 2024 → 2026 F, 2 x sales growth ~ 10 % of sales at $ 1.2 B What it funds • Continu
Slide 37: Operating Leverage
Copyright of Camtek Ltd 2026 . All rights reserved 37 Operating Leverage 30.0 % ~ + 3.4 % ~ + 2.4 % ~ - 1.3 % 34 – 36 % 2025 operating margin Gross margin, richer mix SG&A leverage R&D investment At $ 1.2 B operating margin Non - GAAP operating margin bridge (% of revenue) 37
Slide 38: Updated Financial Target Model
Updated Financial Target Model Replacing the previous $ 750 m model REVENUE ($ millions) $ 315 m 2023 ~$ 600 m 2026 F Target Model Prior Model $ 750 m GROSS MARGIN (%) 48 % 2023 51 - 52 % Current* @$ 1.2 B OPERATING MARGIN (%) 26 % 2023 27 - 28 % Current* @$ 1.2 B Copyright of Camtek Ltd 2026 . All
Slide 39: Key Takeaways
Key Takeaways ~$ 1.2 B revenue organically in ~ 3 years >$ 800 m expected in 2027 Continue the shift to Camtek ’ s new products & higher recurring revenue Improved margins and strong leverage Strong balance sheet to support M&A Copyright of Camtek Ltd 2026 . All rights reserved 38 39 Copyright of Ca
Slide 40: M&A strategy
Copyright of Camtek Ltd 2026 . All rights reserved M&A strategy 40
Slide 41: M&A Strategy
CAPABILITIES FOR OUR EXISTING CORE BUSINESS BUSINESS UNITS OUTSIDE CAMTEK'S CORE M&A Strategy Four deal types; platform and transformational deals must also meet four criteria 01 Capability acquisitions WHAT IS ACQUIRED Technology, engineering team, know - how CAPITAL RANGE Small to medium PIPELINE
Slide 42: Strategic Partnerships
Copyright of Camtek Ltd 2026 . All rights reserved 42 Copyright of Camtek Ltd 2026 . All rights reserved 42 Strategic Partnerships EXTENDS THE CORE Integrate partner ’ s technology inside our systems or Camtek's technology inside partner's OPENS NEW MARKETS Our reach and manufacturing scale carry pa
Slide 43: Visual Layer: AI performance beyond the optics
Copyright of Camtek Ltd 2026 . All rights reserved 43 Visual Layer: AI performance beyond the optics Now part of Camtek Acquired April 2026 Technology & team fully integrated Camtek AI hub, Tel Aviv WHY THIS TEAM Strong leadership Established organizational foundation Research depth Cultural and ope
Slide 44: Camtek Is Built to Scale
Copyright of Camtek Ltd 2026 . All rights reserved 44 Camtek Is Built to Scale The opportunity is in front of us. The technology is ready. The customers are engaged. A Powerful Market AI and Accelerated Computing are driving sustained growth in Advanced Packaging, HBM, 2.5 D/ 3 D integration and Pho
Slide 45: Thank you
Copyright of Camtek Ltd 2026 . All rights reserved 45 Thank you
Slide 46: Reconciliation from GAAP to Non-GAAP
Reconciliation from GAAP to Non - GAAP 46 Copyright of Camtek Ltd 2026 . All rights reserved data) expenses ( 1 ) Capital Notes ( 3 ) FY 2025 FY 2024 FY 2023 FY 2022 FY 2021 $ in millions (except per share FY 2020 $ 496.1 $ 429.2 $ 315.4 $ 320.9 $ 269.70 Revenue $ 155.90 $ 50.7 $ 118.5 $ 78.6 $ 79.9
Slide 47: Reconciliation from GAAP to Non-GAAP (cont'd)
Reconciliation from GAAP to Non - GAAP (cont ’ d) 47 Copyright of Camtek Ltd 2026 . All rights reserved FY 2025 FY 2024 FY 2023 FY 2022 FY 2021 FY 2020 $ in millions (except per share data) $ 250.0 $ 210.0 $ 147.6 $ 159.9 $ 137.3 $ 73.3 Gross profit (GAAP) 50.4 % 48.90 % 46.80 % 49.80 % 50.90 % 47.0