Asml Holding Nv · EURONEXT:ASML
Asml Holding Nv — 2010 UBS Global Technology and Services Conference
27 slides from Asml Holding Nv's conference presentation, Jun 14, 2010
Slide 1: 2010 UBS Global Technology and Services Conference
2010 UBS Global Technology and Services Conference Eric Meurice CEO New York, New York June 8, 2010
Slide 2: Safe Harbor
Safe Harbor "Safe Harbor" Statement under the US Private Securities Litigation Reform Act of 1995: the matters discussed in this document may include forward-looking statements, including statements made about our outlook, realization of backlog, IC unit demand, financial results, average selling pr
Slide 3: Agenda
Agenda ASML Overview Short Term Business overview Future trends ASML Trajectory
Slide 4: ASML Overview
ASML Overview || | Public & ASML
Slide 5: ASML: Leading supplier of lithography equipment to the semiconductor industry
ASML : Leading supplier of lithography equipment to the semiconductor industry Headquarters: Veldhoven, The Netherlands Market Cap approx € 10 B
Slide 6: ASML's historic market share growth
Source: ASML, SEMI ASML's historic market share growth 0% 10% 20% 30% 40% 50% 60% 1984 1986 1988 1990 1992 1994 1996 1998 2000 2002 2004 2006 2008 Total market: $2500 million 2009 70% Sources: VLSI, Gartner (1988-2009), SEMI (1980-2009) $ 1,000 2,000 3,000 4,000 5,000 6,000 7,000 1980 2005 2007 Worl
Slide 7: Commitment to innovation requires a strong player
Commitment to innovation requires a strong player Source: ASML worldwide investments, Zeiss SMT
Slide 8: Short Term Business overview
Short Term Business overview
Slide 9: Analyst semiconductor growth outlook for 2010 now at 23.2%
A favorable analyst's semiconductor growth outlook for 2010 now at 23.2% Sources: See chart (5/2010) Weighted average is based on age of forecast from market institute and respective level of accuracy for the last 3 years Increased forecasts mainly driven by more stable IC ASPs. IC unit growth over
Slide 10: Fab Equipment Capex in "catch up" mode
Fab Equipment Capex in "catch up" mode Sources: Gartner 0.0 1,000.0 2,000.0 3,000.0 4,000.0 5,000.0 6,000.0 7,000.0 8,000.0 9,000.0 10,000.0 1Q04 2Q04 3Q04 4Q04 1Q05 2Q05 3Q05 4Q05 1Q06 2Q06 3Q06 4Q06 1Q07 2Q07 3Q07 4Q07 1Q08 2Q08 3Q08 4Q08 1Q09 2Q09 3Q09 4Q09 Semi Wafer Fab Equipment Market ( M USD
Slide 11: Total net sales
Total net sales M€ 1,543 2,465 2,529 3,582 3,768 Numbers have been rounded for readers' convenience. 2,954 1,596 ASML *guidance for Q2 2010 * "Q2 net sales expected around Euro 1 billion. ASML on track to surpass our 2007 revenue peak of Euro 3.8 billion in 2010". Guidance from Q1 results 4/15/2010
Slide 12: Litho layer stacks per sector
NVM MPU DRAM LOGIC Litho layer stacks per sector Source: ASML Marketing (03/2010) 14 14 13 13 18 17 15 13 13 16 16 15 15 15 9 11 12 12 9 8 10 11 11 11 11 12 12 12 4 4 7 9 4 5 5 5 5 5 5 5 7 7 9 9 11 9 9 5 1 1 4 0 5 10 15 20 25 30 35 40 45 50 150 130 110 90 80 65 55 45 38 32 28 25 22 18 8F2 6-8F2 6F2
Slide 13: IC unit distribution over time; litho layers grow with each node transition
IC unit distribution over time Litho Layers grow with each node transition Source: ASML Marketing (03/2010) 0% 10% 20% 30% 40% 50% 60% 70% 80% 2007 2008 2009 2010 2011 2012 2013 2014 2015 % of Units DRAM node distribution 18nm 22nm 25nm 28nm 32nm 38nm 45nm 55nm 65nm 80nm 90nm 110nm 130nm 0% 10% 20%
Slide 14: DRAM industry wafer production capacity
Source: ASML (4/10) * Gartner DRAM bit forecast (3/10): 2009 2010 2011 Mio GB (new): 1348 2123 3129 YoY gr.: +24% +57% +47% DRAM industry wafer production capacity Shrink drives large litho Capex without significant wafer capacity additions due to increased number of litho passes DRAM WW Monthly Waf
Slide 15: NAND industry wafer production capacity
Source: ASML (4/10) * Gartner NAND bit forecast (3/10): 2009 2010 2011 Mio GB (new): 6467 10718 19680 YoY gr.: +43% +66% +84% NAND industry wafer production capacity Shrink drives litho Capex without significant wafer capacity additions due to increased number of litho passes NAND WW Monthly Wafer S
Slide 16: World-wide under-investment in advanced logic capacity requires structural catch up
World-wide under-investment in advanced logic capacity requires a structural catch up Source: ASML Marketing (4/10) LOGIC Foundries 130 nm 90 nm 65 nm 45 nm 32 nm 28/22 nm Intel Intel Intel Intel Intel Intel AMD AMD AMD AMD IBM STM IBM IBM IBM IBM STM Samsung Toshiba Toshiba Toshiba Toshiba NEC STM
Slide 17: Future trends
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Slide 18: A large technology driver until 2020
A large technology driver until 2020 Source: Morgan Stanley (12/09)
Slide 19: IC segment roadmaps - sustained aggressive pace
IC segment roadmaps - sustained aggressive pace ASML supports shrink roadmap Year of production start* Resolution/half pitch, "Shrink" [nm] 20 30 40 50 60 80 200 100 '02 '03 '04 '05 '06 '07 '08 '09 '10 '11 '12 '13 '14 '15 ARF ARFi EUV Logic *Average customer input, (1/10) NAND DRAM XT:1400 XT:1700i
Slide 20: Customer lithography roadmap by sector
Customer lithography roadmap by sector EUV Single exposure Double patterning ie.,Spacer Double patterning LELE Source: ASML Marketing (4/10) EUV INSERTION TIME FAVORED BY DESIGN LIMITATIONS, COST AND PROCESS CONTROL REQUIREMENTS OF DOUBLE PATTERNING, MAKING EUV PROCESS OF CHOICE WHEN ACHIEVING ITS C
Slide 21: Technology Leadership - Reinforced
Technology Leadership - Reinforced Source: ASML Immersion Lithography: Installed Base >160 Systems leading performance on CD imaging uniformity well below 1 nm and overlay of less than 2 nm 28 systems in backlog end Q1 '10 More than 10 NXT installed and producing EUV: - - 6 systems shipping thru mid
Slide 22: Holistic Litho: A requirement to enable next nodes
Holistic Litho: A requirement to enable next nodes Pre-production: enlarges the process window further and earlier through pattern optimization and scanner tuning Production: ensures that the process stays in the "sweet spot" of the process window maximized for the specific application at hand, incr
Slide 23: ASML Trajectory
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Slide 24: 2010 short-term outlook
2010 short-term outlook Q2 Net sales expected around € 1 billion Q2 bookings are expected at similar level as in Q1 2010 (€ 1,004 M) We expect this cycle to be sustained by the normal technology transitions of the early adopters, the subsequent technology conversions by second tier DRAM makers, the
Slide 25: ASML Strategy
ASML Strategy Continue the large R&D outlay to ensure leadership and provide customers with enabling technologies Improve profitability further by: Improving product mix towards value added software support tools Keeping fixed cost structure to a low break even point, while growing top line Improvin
Slide 26: ASML Trajectory
ASML Trajectory ASML confirms its leadership in offering lithography technology that enables the industry's shrink roadmaps and therefore makes ASML the partner of choice for all leading Semiconductor manufacturers ASML confirms that it has the appropriate size and know how to continue leading the i
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