Inspire Semiconductor Hldgs Inc. · OTC:INSSF
Inspire Semiconductor Hldgs — Inspire Semiconductor Holdings — Investor Presentation (November 2023)
20 slides from Inspire Semiconductor Hldgs's investor presentation, November 2023
Slide 1: Disruptive Next Generation Accelerated Computing Platform
Disruptive Next Generation Accelerated Computing Platform Blistering speed, versatility, energy efficiency and affordability for HPC, AI, graph analytics, & blockchain applications Investor Overview Q4 2023 TSXV: INSP © Inspire Semiconductor, Inc. – All Rights Reserved © InspireSemi | TSXV: INSP
Slide 2: Disclaimer
Disclaimer This presentation contains statements which constitute “forward-looking information” within the meaning of applicable securities laws, including statements regarding the plans, intentions, beliefs and current expectations of InspireSemi with respect to future business activities and opera
Slide 3: InspireSemi Addresses $168B Datacenter Accelerator Market
InspireSemi Addresses $168B Datacenter Accelerator Market Growing at 25.6% CAGR Initial focus on HPC market • Large HPC market segment • $5-10B TAM of early tech adopters • Fast-growing 25.6% CAGR, 2X in 3 years • High value, high margin • Highly compute-intensive • Leverage open-source software • I
Slide 4: Company Overview
Company Overview Product Offering • High performance compute accelerator chips+board Year Founded • Easy-to-deploy PCIe server add-in card form factor 2020 • >6,000 high performance 64-bit CPU cores • Innovative high speed interconnect fabric provides Headquartered high bandwidth and low latency bet
Slide 5: Investment Opportunity in Breakthrough High Performance Computing (HPC)
Investment Opportunity in Breakthrough High Performance Computing (HPC) Attractive Addresses underserved portion of high margin $168B data center accelerated computing market with 25.6% CAGR Market AI acceleration alone does not solve this problem Leading Accelerated computing solution with >6,000 h
Slide 6: The Third Wave of Accelerated Computing is Here
The Third Wave of Accelerated Computing is Here Thunderbird for HPC, AI, Graph Analytics 1980 2007 2023+ Math Coprocessor GPU, FPGA Thunderbird • Purpose-built widely applicable • Limited applications benefit • Built for HPC • Open software ecosystem • Proprietary software model • Versatile & ope
Slide 7: Addressing the Need to Accelerate All HPC & AI Software
Addressing the Need to Accelerate All HPC & AI Software What customers always wanted…Not “yet another GPU” Financial simulations Datacenter GPUs Geology: Seismic Financial Trading & Graph Analytics Energy: Reservoir Modeling & Sim InspireSemi Genomics, Pharma, Thunderbird Life Sciences CAE/Computati
Slide 8: What is Thunderbird and Why is it Better?
What is Thunderbird and Why is it Better ? • Unprecedented performance for HPC applications • RAW horsepower per chip • Greater effective processing power due to 5x better use of "nameplate" rating • Enables platform of 4 chips on standard format server add- Best in card Widest Market Performance /
Slide 9: More Applications, High Utilization, and Low Latency
More Applications, High Utilization, and Low Latency • Thunderbird designed to deliver real world application benefits • Software friendly, all CPU architecture (double precision FP64 RISC-V cores) will work with all HPC & AI software • High speed, low latency core-to-core communications for predict
Slide 10: Thunderbird for Real-Time, Real-Safe Computing
Thunderbird for Real-Time, Real-Safe Computing Reproducibility Determinism/Predictability • Results verification • Safety and component functions • Performance optimization • Efficiency optimization • Troubleshooting • Known timing behavior • Quality assurance • Quality assurance Thunderbird support
Slide 11: Thunderbird Addresses ALL HPC & AI Customer Needs
Thunderbird Addresses ALL HPC & AI Customer Needs InspireSemi CPU GPU FPGA AI Accelerators Thunderbird Architecture Many programs, Few programs, Few programs, Programmable Single program, many data streams few data streams many data streams logic elements many data streams Performance High for broad
Slide 12: Open Software Ecosystem Solves Customer Porting Challenges
Open Software Ecosystem Solves Customer Porting Challenges • Leverages established RISC-V software ecosystem • Eliminates need for proprietary software stacks • Uses standard CPU-style programming models • No need for CUDA, ROCM, SYCL, etc. that GPUs require • No need for disruptive software algorit
Slide 13: World Class Supply Chain Partners
World Class Supply Chain Partners • TSMC - Wafer fab • World’s largest semiconductor foundry • Developing the most advanced process nodes • ASE – Chip package & test • Worlds largest and highest quality OSAT (Outsourced Semiconductor Assembly and Test) • Leading edge package design • Imec: Value Cha
Slide 14: Fundamental Capabilities Proven with TSMC 5nm Test Chip
Fundamental Capabilities Proven with TSMC 5nm Test Chip • De-risks plan for follow-on 4nm Thunderbird 2 • Validated team’s ability to deliver designs on leading-edge TSMC process node • Worked first time, met performance and power targets • Including full-custom layout optimized at every level • Som
Slide 15: Robust HPC & AI Roadmap
Robust HPC & AI Roadmap Chip Tapeout Customer Shipment Thunderbird FPGA Prototype First Chips from Fab Ramp Production 12nm 2023 2024 2025 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Thunderbird • Addresses complex HPC applications • e.g.- CAE/CFD, energy/reservoir modeling & sim, weather, life sciences/genomics, finan
Slide 16: Robust HPC & AI Roadmap: Thunderbird 2
Robust HPC & AI Roadmap Chip Tapeout Customer Shipment Thunderbird FPGA Prototype First Chips from Fab Ramp Production 12nm 2023 2024 2025 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Thunderbird 2 Customer Receive & Analyze Design Start TSMC 4nm Shuttle Chip Tapeout Shipment 4nm 5nm Test chip First Chips from Fab Thund
Slide 17: Early Adopter Program Signals Strong Market Traction
Early Adopter Program Signals Strong Market Traction Decision Maker Responses: 4 Committed Contracts Already "Consider us your go-to-market partner. Tell all prospects you talk to." “With the momentum of AI and the convergence of AI and HPC, it is time to look outside the status quo and leverage a n
Slide 18: Accomplished Leadership Team
Accomplished Leadership Team Ron Van Dell, CEO Thomas Fedorko, COO • 40 years experience and an exceptional track record of success • 35+ years hands-on technical and business leadership in and proven leadership skills in early-stage, turn-around and semiconductor operations in both large IDM and st
Slide 19: Investment Opportunity in Breakthrough High Performance Computing (HPC)
Investment Opportunity in Breakthrough High Performance Computing (HPC) Attractive Addresses underserved portion of high margin $168B data center accelerated computing market with 25.6% CAGR Market AI acceleration alone does not solve this problem Leading Accelerated computing solution with >6,000 h
Slide 20: Thank you!
Disruptive Next Generation Accelerated Computing Platform Blistering speed, versatility, energy efficiency and affordability for HPC, AI, graph analytics, & blockchain applications Thank you! Information Contacts: Inspire Semiconductor Holdings Inc. KCSA Strategic Communication John Kennedy Investor
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