Slide 1: Brush Engineered Materials Inc. Profile
Brush Engineered Materials Inc. Profile Publicly traded since 1956: NYSE-listed since 1972. Founded 1931 as Brush Beryllium Company. Building off earlier pioneering technical work at Brush Laboratories Initial scope was development of commercial markets With onset of WW II and post war period, signi
Slide 2: A leading manufacturer of high performance engineered materials
A leading manufacturer of high performance engineered materials Operations, service centers and major office locations in North America, Europe and Asia Serving long-term growth oriented global markets: Telecommunications and computers Automotive electronics Magnetic and optical data storage Industr
Slide 3: BEM Materials: Advancing the World's Technologies
BEM Materials are found in a wide range of critical and demanding applications requiring: - Strength - Reliability - Thermal & electrical - Miniaturization conductivity - Weight reduction - Corrosion resistance - Reflectivity Brush Engineered Materials Inc. "Advancing the World's Technologies"
Slide 4: End Uses
Brush Engineered Materials Inc. End Uses Magnetic & Optical Data Storage Industrial products Life enhancing devices Cellular phones and other wireless communications Notebook and network computers Electronic components in cars and trucks
Slide 5: Investment Highlights and Strengths
Investment Highlights and Strengths Unique Status as Fully Integrated Provider of Beryllium-Containing Products Global Sales and Distribution Network Sales Based on End User Specifications Strong Value Proposition in Served Markets Broad Metallurgical Capabilities in Precious and Non-precious Metals
Slide 6: Organized into Two Separate Reportable Segments
Metal Systems Alloy Products Beryllium Products Technical Materials, Inc. Brush Resources Inc. Microelectronics Electronic Products Williams Advanced Materials Inc. Brush Engineered Materials Inc. Organized into Two Separate Reportable Segments
Slide 7: Metal Systems Group
Metal Systems Group - 2005 YTD Second Quarter Sales: $158 million $25.3 million Engineered material systems, including clad, plated and electron beam welded metals used in demanding connector applications Combines precious and non-precious metals in strip form for use in complex electrical component
Slide 8: Metal Systems Group: Beryllium Products and Brush Resources
Metal Systems Group - 2005 YTD Second Quarter Sales: $158 million $25.8 million Pure beryllium and aluminum-beryllium composites for high-performance applications, principally for aerospace and defense applications where stiffness, strength, lightweight, dimensional stability and reflectivity are cr
Slide 9: Microelectronics Group
Microelectronics Group - 2005 YTD Second Quarter Sales: $107 million $94.0 million Precious metal and specialty alloys for high reliability applications Products include precious and non-precious metal vapor deposition targets, frame lid assemblies, clad and precious metal preforms, high-temperature
Slide 10: Fully Integrated Beryllium Producer
Fully Integrated Beryllium Producer Beryllium and beryllium alloys are critical to many high performance applications Strong Lightweight Good formability Operate the only active bertrandite ore mine in the developed world 7,500 acres in Juab County, Utah Approximately 100 years of proven reserves Be
Slide 11: Corporate Structure
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Slide 12: Significant Recent Progress in Key Financial Statistics
Significant Recent Progress in Key Financial Statistics (1) Includes in 2002, synthetic lease $in millions
Slide 13: Telecom/computer decline and market segment revenue
The decline in the telecom/computer market resulted in a 50% drop in the market segment's revenue comparing 2003 to 2000, in 2004, this segment started to grow $ in millions Change 2000 2003 2004 03-04 Telecom/Computer $277 $139 $206 $67 Automotive 62 53 59 6 Industrial 62 42 43 1 Magnetic and Optic
Slide 14: Quarterly revenue trend 2000-2005
Brush experienced a major downturn in Q2 and Q3 2001, with revenue remaining flat through 2002. 2003 was stronger than 2002 and 2004 was stronger than 2003. Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 143.9 147.2 145.5 128.2 106.2 92.4 89.6 100.8 93.5 89.6 99.5 101.8 94.2 105.6 125.9
Slide 15: Positive Market Trends
Positive Market Trends Electronic component manufacturers are being driven by end user demands to produce products that are smaller, lighter and faster Increased electronic component performance characteristics require materials that have enhanced mechanical, electrical and thermal properties Growin
Slide 16: Capacity to Support Profitable Market Growth
Capacity to Support Profitable Market Growth $140 million invested between 1996 and 2000 Operating with significant available excess capacity Significant productivity gains in recent years Capital spending in 2002, 2003 and 2004 averaged $7 million per year and the first half of 2005 was $4.9 millio
Slide 17: Financial and Operational Initiatives
Financial and Operational Initiatives Expanding and diversifying the revenue base New products New applications Improving margins through increased operating efficiency Six Sigma and Lean Manufacturing Reducing overhead costs Reducing debt Positioning for global market growth and economic recovery I
Slide 18: Expand and Diversify Revenue Base
Expand and Diversify Revenue Base New Products Alloy 390 - Telecom & Auto PM Plated Strip - Telecom & Auto Toughmet - Bushings & Bearings MoldMax XL - Plastic Molds Welded Tube - Oil & Gas Silver DVD Alloy (Silx) - DVD Visi-Lid - Telecom & Military New End Use Markets Alloy Heavy Equipment Oil & Gas
Slide 19: Improving Margins Through Increased Operating Efficiency
Improving Margins Through Increased Operating Efficiency Improved distribution inventory turns 29% Improved manufacturing inventory turns 16% Raised yields 7% Shipped 13% more pounds per manufacturing employee Reduce mill distribution operating cost by 3% Reduce strip rework by 28% Reduced unplanned
Slide 20: Reduce Debt
Reduce Debt A significant reduction in debt has occurred ($ in millions) Q2 2000 2004 2005 Balance Sheet Debt & AEP Lease $128.4 $ 72.5 $53.1 Off-balance Sheet Leases 17.9 13.1 12.4 Total $146.3 $85.6 $65.5 Debt to Debt Plus Equity 36% 26% 19%
Slide 21: Improving Margins
Improving Margins Our efforts to improve margins have succeeded, despite the fall in revenue Year Gross Margin % Sales ($M) 2000 21.0% $564 2001 14.4% 473 2002 12.9% 373 2003 18.2% 401 2004 22.4% 496 YTD Q2 2005 21.8% 265
Slide 22: Improved Margins
Improved Margins 2000 2001 2002 2003 2004 0.21 0.14 0.13 0.18 0.22 564 473 373 401 496 Margins have improved through cost reduction and productivity improvement initiatives Historical Gross Margin Trends $564 22% 21% $473 14% $373 13% $401 $496 18% Sales ($M) Margin %
Slide 23: Programs to improve profitability
Programs to improve profitability had a significant impact in 2003 and in 2004 YTD Q2 2001 2002 2003 2004 2005 Net Sales $472.6 $372.8 $401.0 $496.3 $265.0 Oper. Profit (14.1) (22.6) (8.9) 25.0 13.8 Oper. % (3.0) (6.1) (2.2) 5.0 5.2 2003 includes the impact of the $6.0 million refinancing charge. Ex
Slide 24: Segment Sales Review 2001-2003
Segment Sales Review 2001 2002 2003 $ % $ % $ % Metal Systems $303.0 64% $233.6 63% $243.7 61% Alloy 217.5 46% 151.9 41% 162.3 40% TMI 50.5 11% 44.4 12% 41.9 11% Beryllium Products 27.7 6% 31.6 8% 35.2 9% Brush Resources* 7.2 1% 5.7 2% 4.3 1% Microelectronics $169.6 36% $139.2 37% $157.3 39% WAM 135
Slide 25: Segment Sales Review 2004 and YTD Q2 2005
Segment Sales Review 2004 YTD Q2 2005 $ % $ % Metal Systems $300.7 61% $158.0 60% Alloy 202.9 41% 103.7 39% TMI 53.6 11% 25.3 10% Beryllium Products 39.5 8% 25.8 10% Brush Resources* 4.7 1% 3.2 1% Microelectronics 195.6 39% 107.0 40% WAM 165.7 33% 94.0 35% Electronic Products 29.9 6% 13.0 5% TOTAL $
Slide 26: 2004 new product and market share growth
2004 new product and market share growth was 36% of 2004 sales growth New Product Sales & Market 2003 2004 Growth Share Gain Metal Systems $239.4 $296.0 $56.6 $21.2 Alloy 162.3 202.9 40.6 10.5 Beryllium Products 35.2 39.5 4.3 7.7 TMI 41.9 53.6 11.7 3.0 Brush Resources 4.3 4.7 0.4 0.0 Microelectronic
Slide 27: Segment Earnings 2001-2005 YTD Q2
Segment Earnings 2001 - 2005 YTD Q2 2001 2002 2003 2004 2005 Metal Systems $(16.9) $(34.8) $(16.0) $4.2 $6.1 Microelectronics 4.6 3.8 12.6 18.5 8.5 Other (1.8) 8.2 (5.5) 2.3 (0.8) Total Operating Profit $(14.1) $(22.8) $(8.9) $25.0 $13.8 $ in millions
Slide 28: Brush Wellman Alloy Vision
Brush Wellman Alloy Vision Brush Wellman is the leading supplier of High Performance Copper Alloys worldwide, providing manufacturing excellence in the form of high reliability products and services to satisfy our customers' most demanding applications. We provide these services in a culture of loca
Slide 29: Alloy Products Markets
Alloy Products Markets Strip Markets (coils) Telecommunications Computers Automotive Electronics Appliance Bulk Markets (rod, bar, tube, plate) Plastic injection & blow molds Undersea/marine housings for telecom & instrumentation Aircraft bushings & bearings Oilfield well drilling, completion and pr
Slide 30: Sales Based on End User Specifications
Sales Based on End User Specifications Component Fabrication Component Manufacturing Sourcing Demand Generator Distribution Sales Marketing Brush Engineered Materials Specifications Products
Slide 31: Strip Alloy Applications
Strip Alloy Applications (strength, conductivity, spring characteristics) Current Carrying Springs and Relays Integrated Circuitry Sockets Electrical and Electronic Connectors Air Bag Sensors Pressure Responsive Devices Fire Extinguisher Sprinkler Heads
Slide 32: Alloy Products Strip Products - Strategy
Alloy Products Strip Products - Strategy Maintain focus on 4 major end-use markets Computer Telecommunications (mobile & Infrastructure) Automotive Appliance Defend leadership in traditional alloy strip, rod & wire Reduce total cost of manufacture to allow penetration of mid-range alloy applications
Slide 33: New Strip Products - 2005
New Strip Products - 2005 Launched Q1 2005 BrushFormTM 47 and BrushFormTM 65 - Electronics... numerous personal portable devices (i.e. cell phones), burn- in-test sockets, servers (further expanding property set, i.e. formability, conductivity and strength) Developed/Targeted for Q3/Q4 2005 Launch A
Slide 34: Strip Capacity Expansion
Strip Capacity Expansion Elmore and Reading Facilities $140 Million (1996 - 1998) Added casting, hot rolling, annealing and cold rolling capacity at Elmore Added light gauge strip and mill hardening capacity at Reading 50% to 100% capacity increase depending upon product depending upon product depen
Slide 35: Automotive Electronics
Automotive Electronics Definition: power and signal distribution in passenger cars and light trucks - connectors, switches and relays.
Slide 36: Automotive Applications
Automotive Applications Potential New Applications: Infotronics/telematics - in car multimedia systems and mobile communication systems, navigational, global positioning, internet based services Powertrain electronics - in vehicle networks, drive-by-wire systems, continuously variable transmission,
Slide 37: Computer
Computer Definition: Brush Wellman's high performance alloys are sold to the computer industry in strip and wire forms for connectors, contacts, and shielding. End use applications include servers, workstations, notebook and desktop computers, personal digital assistants (PDAs), data storage devices
Slide 38: Computer Applications
Computer Applications Examples of specific end-use product applications Fingerstock shielding used in servers and data storage Power connectors used in server power supplies manufactured by Sun, HP, Compaq, and Intel Microprocessor socket connectors PDA ID connector and battery contacts High speed b
Slide 39: Telecommunications
Telecommunications Definition: Brush Wellman's high performance alloys are sold to the telecommunications industry in strip and wire forms for connectors, contacts, shielding, switches and relays. End use applications include wireless base stations, cell phones, pagers, telecom switching equipment,
Slide 40: Telecommunication Applications
Telecommunication Applications Examples of specific end-use product applications Handheld and portable device battery contacts, antenna clips, I.O. connectors, board to board connectors, SIM card connectors & display connectors Category 6 modular jacks for connecting data networks Shielding gaskets
Slide 41: Cell Phone Connector Applications (Rear)
Cell Phone Connector Applications Rear of Circuit Board Rear of Circuit Board Rear of Circuit Board Rear of Circuit Board Rear of Circuit Board Battery Contacts Brush Wellman Alloy SIM Connector Brush Wellman Alloy Brush Wellman Alloy Brush Wellman Alloy Brush Wellman Alloy Brush Wellman Alloy
Slide 42: Cell Phone Connector Applications (Front)
Cell Phone Connector Applications Front of Circuit Board Front of Circuit Board Front of Circuit Board Front of Circuit Board Front of Circuit Board Front of Circuit Board Front of Circuit Board Word.Document.8 Word.Document.8 Board-to-Board Contact Brush Wellman Alloy Phone Charger Connector Brush
Slide 43: Level (PCB to PCB) Enabling Technologies
Level 3 (PCB to PCB) Enabling Technologies VHDM HSD + Move from single to differential pairs + Increased signal speeds + High pin count + Ground strips can be added between rows - - Weight - - Trace layout problems due to high density Compliant Grounds High Conductivity
Slide 44: EMI Shielding
EMI Shielding EMI Shielding
Slide 45: EMI Shielding Hi Temperature Exposure
EMI Shielding Hi Temperature Exposure P4 processor uses an EMI shield for hi-end applications Shield is located between the processor and the heat sink exposing it to elevated temperatures
Slide 46: RFI/EMI Shields
RFI/EMI Shields SFF Compliant Spring Material Ideal The higher the operating frequency is driving the need for smaller form factor shielding Large operating ranges and smaller form factors drive the need for stronger alloys EMI Shielding
Slide 47: Modular Jacks
Modular Jacks Level 6 (system to System) Enabling Technologies Cat 6 data jacks Normal force IDC height Cross talk Attenuation Impedance Return loss Round vs. rectangular Reliability 96 Port Cat 5 patch panel (SRP $396) Hi Reliability Jacks Use HPAs
Slide 48: Level Interconnects Clamshell Sockets
Level 2 Interconnects Clamshell Sockets - typically used for TSOP (thin small outline package) and QFP (quad flat package). TSOP QFP Clamshell Burn-in Socket
Slide 49: Level Interconnects LIF Sockets
Level 2 Interconnects LIF Sockets - typically used for DIP (dual in-line package) and SOJ (small outline J-Lead). SOJ Burn-in Socket DIP SOJ
Slide 50: Level Interconnects ZIF Burn-in Socket
Level 2 Interconnects ZIF Burn-in Socket Clamshell Sockets - typically used for TSOP (thin small outline package) and QFP (quad flat package). TSOP
Slide 51: Level Interconnects Contact Design Types
Level 2 Interconnects Contact Design Types: Pogo Pin Made using high performance alloys materials for the spring and contact body Cantilever Beams Made using high performance alloys where careful attention is given to stamping to get good edge quality
Slide 52: Connectors in PDAs
Connectors in PDAs Wire to Board Connector Wire to Board Connector
Slide 53: Main PCB from Back
Main PCB from Back Battery Contacts Board to Board Connector
Slide 54: Main PCB from Front
Main PCB from Front Board to Board Connector Reset Button
Slide 55: Desktop Charger
Desktop Charger USB Connector Charger I/O Connector
Slide 56: Bulk Alloy Applications
10 Bulk Alloy Applications (strength, corrosion resistance, non-galling, conductivity) Aircraft Bushings Oilfield well drilling, completion and production equipment Heavy Equipment Bearing and Wear Applications Plastic Injection & Blow Molds Power Generation Undersea/Marine Housings for Telecom & In
Slide 57: Alloy Products Bulk Products - Strategy
Alloy Products Bulk Products - Strategy Maintain focus on traditional end-use markets Aerospace Heavy Equipment/Off-Highway Oil & Gas Plastics Power Generation Resistance Welding Undersea Introduce new alloys or product forms to meet needs of targeted market opportunities. MoldMAX(r) XL ToughMet(r)
Slide 58: New Bulk Products - 2005
New Bulk Products - 2005 Developed in 2004 Launched Q1 2005 ToughMet(r) AT110 Ring Rolled Forging - Heavy Equipment Applications...larger bushing applications in heavy mining equipment & well-head control equipment Developed and Launched Q1 2005 Alloy 25 CuBe rod, tube and forged rings with improved
Slide 59: MoldMAX Alloys for the Plastics Industry
MoldMAX(r) Alloys for the Plastics Industry Value Proposition Provides molders with 20-40% increase in productivity Capital avoidance due to increased productivity Enables improved quality of molded parts ROI < 3 months Technical advantages Hardness of steel with the thermal conductivity of copper F
Slide 60: Lorain Casting Facility: Spinodal and Equacast Technology
Lorain Casting Facility Spinodal and EquacastTM Technology-Winning! Strength and hardness found in CuBe products Thermal conductivity The value proposition differentiates: No EH&S issues Corrosion resistance Superb tribological properties (low friction coefficient, excellent wear resistance) adding
Slide 61: ToughMet Outlasts Conventional Bearing Materials in Mining Truck Test
ToughMet(r) Outlasts Conventional Bearing Materials in 300-ton Mining Truck Steering Test 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180 190 200 Hardened Steel 0 0.009 0.013 0.0375 Aluminum Bronze 0 0.0075 0.009 0.01 0.011 0.011 0.0125 0.015 0.016 0.019 0.02 0.022 0.025 0.0275 0.03
Slide 62: ToughMet Industrial Components Results
ToughMet(r) Industrial Components Results:
Slide 63: Significantly Higher Durability Confirmed for ToughMet
Significantly Higher Durability has been Confirmed for ToughMet(r)
Slide 64: Brush International Inc. Global Sales, Marketing, Distribution
Brush International Inc. Global Sales, Marketing, Distribution & Tech Service Brush International Inc. S. Freeman ?-------------- Asia / Pacific ------------? ? ---------------- Europe -------------- ? ? - Emerging Markets -? BWS BWT BWC BWJ BWK BWL BWG BWG BWG EXPORTS FROM USA Singapore Taiwan Chin
Slide 65: Beryllium Products
Brush Wellman Beryllium Products Products Beryllium Metal - One of the lightest metals known - Family of vacuum hot and hot/cold isostatically pressed powder-derived metals AlBeMet? - Family of lightweight alloy composites - Extruded, rolled sheet and hot isostatically pressed powder-derived metals
Slide 66: Beryllium Products (cont.)
Brush Wellman Beryllium Products Products - Cont. E-Materials - Family of low expansion, lightweight electronic packaging materials - Composites of beryllium metal and beryllium oxide Beryllium Oxide/ Chemicals - Ceramic-grade beryllium oxide powder - Specialty beryllium-containing chemicals
Slide 67: Beryllium Products Facilities
Brush Wellman Beryllium Products Facilities Elmore, Ohio Fremont, California
Slide 68: Key Product Attributes
Key Product Attributes Be/AlBeMet(tm) Light Weight (Density) High Stiffness (Elastic Modulus) High Thermal Conductance/Capacity Low Thermal Expansion Be Transparent to X-Rays Neutron Reflector
Slide 69: Beryllium Products Primary Competition
Brush Wellman Beryllium Products Primary Competition...Alternative Materials Organic Composites (e.g. Carbon epoxy) Silicon carbide Metal Matrix Composites (e.g. Al - silicon carbide) Pyrolytic graphite Aluminum (high strength grades)
Slide 70: Major Defense/Aerospace Applications
Major Defense/Aerospace Applications for Brush Wellman Beryllium Products Optics Optical substrate and support structure for visual and infrared target acquisition systems (fighter aircraft, helicopters, unmanned aerial vehicles, tanks), surveillance systems and astronomical telescopes. Satellites S
Slide 71: Major Commercial Applications
Major Commercial Applications for Brush Wellman Beryllium Products X-ray Windows Radiographic tube components for ? medical diagnostic (x-ray, mammography, CAT-scan), ? industrial and (3) scientific equipment. Optical Scanners Mirrors for laser scanners used in reprographic and other high- performan
Slide 72: TMI - From a Customer Perspective
TMI - From a Customer Perspective WHAT TMI provides our customers the ability to demand varied performance (electrical, thermal, or mechanical) from a metal surface area or section. WHO We provide this "service" to the telecommunication, automotive, computer, semiconductor and other industries. HOW
Slide 73: Sales Growth
Sales Growth 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 2002 2003 2004 Sales 22.8 28 33.8 43 47 51.5 50.45 63 83.5 50 45 42 52 Millions
Slide 74: Our Major Markets
Our Major Markets Automotive Telecommunications Computer Jewelry Semiconductor Appliances Medical Aircraft Automotive Telecom Computer Misc. 40 20 25 15 Misc. Telecom Computer Automotive
Slide 75: Our Major Applications
Our Major Applications Capacitors Coins and Tokens Connectors Contact Probes Fuses Leadframes Micro Motor Microwave Potentiometers Relays Sensors Solder Clips Switches Air Bag Sensor Leadframe Connectors
Slide 76: Electroplating
Electroplating Precious and non-precious metals Overall and selective stripe capabilities Combination with current TMI technologies
Slide 77: Stripe Plating Application
Stripe Plating Application Cellular Phone Battery Contact Base Material: BeCu Overall Ni plating Selective Au (one side) Selective SnPb (both sides) Base Material
Slide 78: Competitive Advantage
Competitive Advantage Quality QS 9000 / ISO 9002 / ISO 14001 State-of-the-art equipment Vision Systems / PLC Systems for consistent quality Design Support Technical knowledge Engineering expertise Overall Capabilities Slitting and leveling Inlay / Electron-Beam Welding / Solder / Milling / Skiving /
Slide 79: Strategic Concept
Strategic Concept Total capability under one roof Make it easy for our customers to get what they need to satisfy their customers' requirements Make our customers competitive with reliable products Solve problems for our customers with engineered strip metal solutions Explore and develop new markets
Slide 80: Growth in Electroplating
Growth in Electroplating Precious and non-precious metals Overall and selective stripe plating capabilities Combination with other TMI technologies Proprietary closed contact plating technology Building additional lines to further increase capacity
Slide 81: Summary
Summary From 1992-2000 TMI sales more than quadrupled. 2001 and 2003 proved to be extremely difficult years due to major served markets being severely depressed; however, TMI remained profitable all three years. 2004 has seen a marked increase in sales, but product mix has impacted overall profitabi
Slide 82: Focus on wireless and fiber-optic telecom materials and packaging
Our focus is on materials, circuitry, subassemblies and packaging for the wireless and fiber-optic telecom market, military, medical and automotive applications Signal amplifiers transmit signals through air (wireless) or optical fiber media by boosting signal strength while maintaining integrity. T
Slide 83: Our Overall Strategy
Our Overall Strategy Vertically integrate materials to subsystem assembly, providing customized solutions Meet the Customer's needs Materials or subassemblies Fast Flexible Manufacturing Systems Responsive to market needs
Slide 84: Business Groups
Business Groups Packaging Electronic Packaging Products Circuitry Circuits Processing Technology Materials Brush Ceramic Products
Slide 85: Electronic Packaging Products
Electronic Packaging Products Located in Newburyport, Massachusetts Products RF Power Packages for base stations in cellular phone & wireless data networks, for cellular handsets, for military radar applications and for digital TV Automotive Components for ignition systems in cars and trucks Power C
Slide 86: Circuits Processing Technology (CPT)
Circuits Processing Technology (CPT) Located in Oceanside, California Products High Frequency Military and Aerospace Circuitry used in military radar and missile guidance High Frequency Wireless circuitry for satellite communications, flight hardware and other telecom applications Fiber Optic Packag
Slide 87: Brush Ceramic Products
Brush Ceramic Products Located in Tucson, Arizona Products Ceramic substrates used in commercial and military packaging applications Ceramic laser bores for gas lasers used in medical and industrial applications Machined ceramic components used in military, oil and gas, semiconductor and microwave a
Slide 88: Williams Advanced Materials Overview
Williams Advanced Materials Overview Williams is a supplier of high-purity, specialty metals serving the wireless, photonics, data storage, high temperature joining, traditional microelectronics and performance film markets. Established 1918. Subsidiary of Brush Engineered Materials Business Groups
Slide 89: WAM Headquarters Buffalo, NY
WAM Headquarters Buffalo, NY USA - Manufacturing Facility 100,000 sq. ft. overall, 6,500 sq. ft. of cleanroom, state-of-the-art machining/ milling/rolling/stamping/ cladding centers, hydrostatic wire extrusion, high purity refining/recycling, metals casting, automated plating, full analytical capabi
Slide 90: Far East Operations Singapore
Far East Operations Singapore - WAM Far East Pte. Ltd. 5,000 sq. ft., 2,500 sq. ft. of cleanroom, automated assembly operations, hydrostatic wire process, product development. PVD bonding operation.
Slide 91: Far East Operations Subic Bay, Philippines
Far East Operations Subic Bay, Philippines Combo-Lid(r), low-cost lids and preform - assembly, inspection and packaging
Slide 92: Far East Operations Taiwan
Far East Operations Taiwan Target bonding services. Low cost production capabilities.
Slide 93: Specialty Alloys Operations
Specialty Alloys Operations Wheatfield, NY USA- Williams Specialty Alloys 30,000 sq. ft. with volume vacuum casting, rolling, annealing, powder atomizing and machining. 10 acres for expansion
Slide 94: WAM Thin Film Products Operations
WAM Thin Film Products Operations Brewster, NY USA - WAM TFP 35,000 sq. ft. with vacuum melting, hot-pressing, milling, Hot & cold rolling automated machining and target bonding capabilities. Acreage to more than double our facility as needed.
Slide 95: Target Bonding Centers
Target Bonding Centers Buffalo, NY Brewster, NY Santa Clara, CA Limerick, Ireland Singapore Taiwan
Slide 96: Williams Advanced Materials Service and Support
Williams Advanced Materials Service and Support Regional Offices (Sales and Applications Engineering support) Santa Clara, CA Manila, Philippines London, England Buffalo, NY Singapore Tucson , AZ Taipei, Taiwan Seoul, Korea Brewster, NY Dallas, TX Worldwide Representatives Florida France Israel Indi
Slide 97: Packaging Material Products
Solder preforms and clad materials Hybrid Microelectronic Device Williams Advanced Materials Packaging Material Products Products Markets Wireless, Photonics and Hybrid/ Traditional Microelectronic Devices Typical End-uses Cell phones, LEDs, fiber-optic networks, PC's, military electronics, avionics
Slide 98: Specialty Alloy Products
Electron Tube WAMBRAZETM Materials Williams Advanced Materials Specialty Alloy Products Products Markets Braze materials Powder, ribbon and preform Structural Alloys Monel Cupronickel Nickel Tunsten Markets Electron Tube, Photonics, Aerospace, microelectronic packaging Typical End-uses Cellular base
Slide 99: Physical Vapor Deposition (PVD) Products
Cellular Phone (wireless) Sputtering Targets Williams Advanced Materials Physical Vapor Deposition(PVD) Products Products Precious Metal Sputtering Targets and Evaporation Materials Precious Metal Refining Services Non-precious Metal Sputtering Targets and Evaporation Materials Markets Wireless ICs,
Slide 100: Williams Strategic Leverage
Williams Strategic Leverage Ensuring Distinctive Abilities Translate to Maximum Returns Over 80 years of metal management and fabrication experience Ability to efficiently manage precious metals critical to customers One-stop Shopping Comprehensive product offering Allows customer to reduce supplier
Slide 101: Beryllium Health and Safety
Beryllium Health and Safety Improved worker protection programs in place Rates of sensitization down among new workers Strong focus on regulations related to beryllium exposure Brush has continued to make progress on issues related to beryllium health and safety
Slide 102: Litigation
Litigation Total Plaintiffs Total Cases Pending (including spouses) 12/31/02 33 70 12/31/03 15 33 12/31/04 12 56 07/01/05 16 61
Slide 103: Litigation
Litigation In Q-2 2005, one additional case was filed, and a second case was voluntarily dismissed by the plaintiff. There was no change in the number of plaintiffs corresponding to these cases in the quarter. - - Our caseload and number of plaintiffs will vary from quarter to quarter depending on n