Rennova Health, Inc. · OTC:RNVA
Rennova Health — Tegal — Merger or Acquisition (September 2008)
13 slides from Rennova Health's merger presentation, Sep 2, 2008
Slide 1: Tegal and Alcatel Micro Machining Systems (AMMS) Conference Call
ETCH PVD NLD Tegal and Alcatel Micro Machining Systems (AMMS) Conference Call Materials Tuesday, Sept. 2,
Slide 2: Safe Harbor Statement on Forward-Looking Statements
Safe Harbor Statement on Forward-Looking Statements All statements included or incorporated by reference in this presentation, other than statements or characterizations of historical fact, are forward-looking statements. These forward-looking statements are based on AMMS’ and Tegal’s respective cur
Slide 3: Alcatel Micro Machining Systems (AMMS)
At the beginning of 2008, AMMS had a worldwide installed base of more than 200 systems in the United States, Europe and Asia. Alcatel Vacuum Technology France (AVTF) Alcatel Micro Machining Systems (AMMS) Alcatel Micro Machining Systems (AMMS) • An industry leader in Deep Reactive-Ion Etching (DRIE)
Slide 4: Tegal - AMMS Agreement Key Elements
Tegal - - AMMS Agreement … Key Elements US$5 million deal value $4 million Tegal common stock $1 million cash ALU will own approx 14% of Tegal (post-money) Restriction on resale for 1 - 3 years, proportionate Stock must remain within Alcatel Group until restrictions expire AMMS Transition Team for 6
Slide 5: Acquisition Benefits to Tegal
• Acquisition of leading technology, product line and process capability in large, high growth market segments • Complimentary and synergistic with current Tegal products and strengths • Market wants production-worthy solutions - a Tegal strength • Opportunity to grow revenues with only incremental
Slide 6: AMMS Market Position
AMMS Market Position Source: Yole Developpement
Slide 7: AMMS Current Products
AMS Deep Silicon Etch SiO2 and Glass Low Temperature PECVD AMS AMS 3200 Cluster AMS 4200 Cluster AMMS Current Products
Slide 8: What is Deep Reactive-Ion Etching (DRIE)?
MEMS - - inkjet head, pressure sensors, accelerometers, gyro- scopes, microphones, microactuators, micro- fluidic devices. Power Devices - - widely used in the industrial, electrical, telecom and transportation markets. 3D ICs & Through Silicon Vias (TSVs) - - interconnects for 3D MEMS, memory stack
Slide 9: Growth in DRIE Market
2008-12 CAGR = 31% Source: Yole Developpement Growth in DRIE Market
Slide 10: Markets and Technologies: MEMS
Markets and Technologies … MEMS BioMEMS Inkjet Heads Inertial Sensors Silicon Microphones Pressure Sensors Rf MEMS • MEMS market is moving from niche markets to the mainstream, with standard processes and significantly higher production volumes.
Slide 11: Markets and Technologies: Power Devices and Components
Power Devices: • Trench isolation • Power MOS, IGBTs, Super junction … Glass Etch Markets and Technologies … Components High Aspect Ratio Silicon Etch Passive Integration : • High density capacitors • Inductors
Slide 12: Markets and Technologies: 3D Packaging
TSV for Redistribution : • Image Sensors • Interposers Silicon Via Etch TSV for Device Stacking : • Memories (Flash and DRAM) • Memories, CPU, MEMS… LT PECVD <150° SiO2 Contact Opening Markets and Technologies … 3D Packaging • 3D or wafer-level packaging is being driven by consumer applications, req
Slide 13: Summary and Conclusion: Benefits to Tegal
• Synergistic products • High growth markets • Leading technology and market position • Opportunity to grow business with only incremental increases in operating expenses • Unified product and corporate strategy Benefits to Tegal … Summary and Conclusion