Slide 1: Q3 2023 Results Presentation
Q3 2023 Results Presentation 25 October 2023
Slide 2: Disclaimer
Disclaimer The information contained in this presentation is provided for These forward-looking statements reflect the Company’s current informational purpose only and should not be relied upon for the expectations, beliefs, hopes, intentions or strategies regarding the purpose of making any investm
Slide 3: Agenda
Agenda 01 │ Key Highlights 02 │ Financial Performance 03 │ Q4 2023 Revenue Guidance 04 │ Q&A 3
Slide 4: Key Highlights
Key Highlights Private and confidential
Slide 5: Advanced Packaging: Strong Foundations for Long-Term Growth
Advanced Packaging Strong Foundations for Long-Term Growth Thermo-Compression Bonding (“TCB”): Hybrid Bonding (“HB”): Secured second order from another • Highest contribution to AP bookings & revenue customer • Logic: Orders from leading foundry & OSAT customers (generative AI) and leading logic IDM
Slide 6: Advanced Packaging: Examples of Solutions Benefitting from Generative AI & HPC
Advanced Packaging Examples of Solutions Benefitting from Generative AI & HPC High-End HPC Device in Data Centre Data Centre Silicon Photonics Transceivers FIREBIRD (TCB) LITHOBOLT (HB) Efficiently process high-speed optical Memory stacking Chiplet integration to Active data in Data Centre Interpose
Slide 7: Financial Performance
Financial Performance Private and confidential
Slide 8: Q3 2023 Key Financials
Q3 2023 Key Financials Revenue Bookings Backlog US$444M US$379M US$922M (-23.8% YoY)1 (-18.3% YoY)1 (-28.3% YoY)1 (-10.9% QoQ)1 (-1.8% QoQ)1 (-7.2% QoQ)1 Gross Margin Operating Margin 34.2% 1.9% (-670 bps YoY) (-1,254 bps YoY) (-594 bps QoQ) (-802 bps QoQ) Adjusted Net Profit 2 Adjusted EPS 2 HK$45M
Slide 9: Q3 2023 Group Financial Results
Q3 2023 Group Financial Results 581 497 462 444 384 379 Revenue USD’M • Declined QoQ and YoY due to prevailing industry weakness Q3 2022 Q2 2023 Q3 2023 Bookings Bookings Revenue • Excluding an isolated order cancellation, would have increased ~6% QoQ Gross Margin 40.9% 40.1% 34.2% • Declined YoY du
Slide 10: Q3 2023 Semiconductor Solutions Segment Performance
Q3 2023 Semiconductor Solutions Segment Performance 281 211 201 189 169 162 Revenue USD’M • IC/Discrete: Highest contribution from TCB (AP); followed by Molding and Sintering tools (Automotive) • Optoelectronics: Grew QoQ, mainly from wire bonders Q3 2022 Q2 2023 Q3 2023 for Conventional Displays Bo
Slide 11: Q3 2023 SMT Solutions Segment Performance
Q3 2023 SMT Solutions Segment Performance 300 286 272 243 223 209 USD’M Revenue • Lower revenue from high-end placement and printing Q3 2022 Q2 2023 Q3 2023 tools, partially offset by growth from AP tools Bookings Revenue • Automotive and Industrial contributed ~50% of revenue Gross Margin 37.4% 38.
Slide 12: Q4 2023 Revenue Guidance
Q4 2023 Revenue Guidance Private and confidential
Slide 13: Q4 2023 Revenue Guidance: US$390m to US$460m
Q4 2023 Revenue Guidance Short-term: Weak economy and end-market electronics demand will continue to prolong the industry inventory adjustment and constrain the capital spending of our customer base. Considering near-term and seasonality effects, the Group expects Q4 2023 revenue to be: US$390m to U
Slide 14: Q&A
Q&A Private and confidential
Slide 15: Thank You!
Thank You! For enquiries, please contact: Mr. Romil Singh / romil.singh@asmpt.com Mr. Leonard Lee / leonard.lee@asmpt.com asmpt.com Private and confidential
Slide 16: Appendix
Appendix Private and confidential
Slide 17: Reconciliation to Non-HKFRS Measures
Reconciliation to Non-HKFRS Measures The below tables highlights the reconciliations of the Group’s’ financial measures prepared in accordance with Hong Kong Financial Reporting Standards (“HKFRS”) for Q3 2023 to the non-HKFRS measures: Q3 2023 Non-HKFRS adjustments Restructuring Income tax Group As