Nano Dimension Ltd · NASDAQ:NNDM

Nano Dimension — Investor Presentation (October 2020)

62 slides from Nano Dimension's investor presentation, Oct 20, 2020

  1. Slide 1: 3D-Printed Electronics: Additively Manufactured Electronics Corporate Presentation

    3D-PRINTED ELECTRONICS ADDITIVELY MANUFACTURED ELECTRONICS (AME) Corporate Presentation I Nasdaq: NNDM Intelligent Machines, Consumable Conductive & Dielectric Ink Materials NASDAQ : NNDM 1

  2. Slide 2: Forward Looking Statements

    PRINTED ELECTRONICS (PE) / A D D I T I V E LY M A N U FA C T U R E D E L E C T R O N I C S ( A M E ) Forward Looking Statements This presentation of Nano Dimension Ltd. (the “Company”) contains “forward-looking statements” within the meaning of the Private Securities Litigation Reform Act and other

  3. Slide 3: Table of Contents

    TA B L E O F C O N T E N T S • Executive Summary • Business Model • Technology • Market • Business in times of Corona • Strategy & Tactics • Appendix Nasdaq: NNDM I www.nano-di.com | © 2020 Nano Dimension. All rights reserved. 3

  4. Slide 4: Nano Dimension: AME Industry Leader

    NANO DIMENSION • Additive Manufacturing Electronics (AME) Industry Leader • Patent Protected and Proven Technology • First-to-Market Advantage • The only technology that converts digitally electronics circuits and functional device • Approx. 60 Systems sold Worldwide • Increasing Recurring Revenue o

  5. Slide 5: Vision: Bridging the Gap

    VISION: BRIDGING THE GAP DragonFly LDM & Ink Materials AME TECHNOLOGY Design → Proof of Concepts → Prototype & Early Fabrication of HiPEDs™(High Performance Electronic Devices) TRADITIONAL TRADITIONAL PRINTED INTEGRATED CIRCUITS CIRCUIT BOARDS (PCB) (IC, Chips, CPU, ASICs) Nasdaq: NNDM I www.nano-di

  6. Slide 6: Our Mission: HiPEDs

    OUR MISSION Our DragonFly™ AME Machines (controlled by AI algorithms) produce electronic devices by simultaneous 3D-injection of dielectric and conductive materials to fabricate, within hours: High Performance Electronic Devices: HiPEDs™ Sensors, Antennas, Capacitators, Convertors for unique geometr

  7. Slide 7: Nano Dimension Customers

    N A N O D I M E N S I O N : A P P R O X . 6 0 S Y S T E M S G L O B A L LY Nano Dimension Customers: • 3 Multi-Billion US$ defense manufacturers • 2 European defense companies and multiple secret services • 1 Multi-Billion US$ valued technology conglomerate • Multiple leading research institutions a

  8. Slide 8: Fail-Safe BioTech-Like Investment Model

    FA I L S A F E “ B I O T E C H - L I K E ” I N V E S T M E N T M O D E L Upside like BioTech, but, contrary to BioTech Downside in case of failure at any stage is protected as a sale of the existing business at improving multiples (as per stages I-V below, is a valid and doable financial exit throug

  9. Slide 9: DragonFly LDM: A Digital Factory in a Box

    D R A G O N F LY L D M : A D I G I TA L FA C T O R Y I N A B O X ALL OF THIS … …REPLACED WITH THIS! Nasdaq: NNDM I www.nano-di.com | © 2020 Nano Dimension. All rights reserved. 9

  10. Slide 10: Nano Dimension's Fabrication Services: NaNoS

    N A N O D I M E N S I O N ’ S 3 D FA B R I C AT I O N S E R V I C E S : N a N o S • Nano Services (NaNoS) is an offering for customers who need to get their hands-on complex, multilayered high- performance electronics with a quick turnaround time. • Provide services to customers around the globe wit

  11. Slide 11: How Does It Work?

    HOW DOES IT WORK ? 110 Just one manufacturing step: No need for etching, pressing, electroplating! TWO PRINTHEADS INKJET BOTH THE OBJECT IS BUILT UP, LAYER BY MATERIALS SIMULTANEOUSLY: LAYER, THROUGH FULL STACK THICKNESS: ○ Both conductor & insulator substrate are printed ○ Conductive layers & Diele

  12. Slide 12: Certifications

    C E R T I F I C AT I O N S In-house DragonFly system In-house nano ink manufacturing Top quality certified manufacturing – ISO14001 and OHSAS18001 FCC, CE, UL, CSA, EAC capacity to meet future demand ISO 45001 and RoHS Nasdaq: NNDM I www.nano-di.com | © 2020 Nano Dimension. All rights reserved. 12

  13. Slide 13: Why Additive Manufacturing for Electronics?

    W H Y A D D I T I V E M A N U FA C T U R I N G F O R E L E C T R O N I C S ? ADVANCED PRODUCTS: RAPID PROTOTYPING DIGITAL INVENTORY HiPED FABRICATION Benefits: Shorten your Time-to- Benefits: Produce better, lighter, Benefits: The future will allow Market, reduce cost and increase cost-effective pro

  14. Slide 14: Our Customers Are Innovators in Leading Markets

    O U R C U S T O M E R S A R E I N N O VAT O R S I N L E A D I N G M A R K E T S AUTOMOTIVE & RESEARCH AEROSPACE DEFENSE MEDICAL INDUSTRIAL The DragonFly LDM AME Technology Keep your IP in your lab Reduce time to market AME optimizes System enables you to enables you to reduce with the DragonFly LDM

  15. Slide 15: Nano Dimension: Case Studies

    NANO DIMENSION: CASE STUDIES I. Research Institutes: CBN-IIT II. Aerospace: HARRIS III. Defense: HENSOLDT IV. Medical: PIEZOSKIN V. Automotive: REHAU Nasdaq: NNDM I www.nano-di.com | © 2020 Nano Dimension. All rights reserved. 15

  16. Slide 16: Customer Case I: CBN-IIT

    CUSTOMER CASE I: CBN-IIT The suitability of the DragonFly system to rapidly and affordably manufacture functional prototypes, combined with the broad ecosystem of applications for health and energy harvesting, makes it an ideal choice for our team to achieve higher performance, quick development and

  17. Slide 17: Customer Case II: Harris

    CUSTOMER CASE II: HARRIS The ability to manu- facture RF systems in- house offers an exciting new means for rapid and affordable prototyping and volume manufacturing. The results of the study provide substantial motivation to develop this technology further. Dr. Arthur Paolella, Senior Scientist, Sp

  18. Slide 18: Customer Case III: Hensoldt

    CUSTOMER CASE III: HENSOLDT Military sensor solutions require performance and reliability levels far above those of commercial HENSOLDT and Nano components. To have Dimension Achieve high-density components Breakthrough in quickly available with Electronics 3D Printing reduced effort by means HENSOL

  19. Slide 19: Customer Case IV: Piezoskin

    C U S TO M E R C A S E I V: P I E Z O S K I N Nano Dimension’s AME technology helped us to achieve an original product prototype, in which wires and connectors were eliminated and the package was minimized, to obtain an optimal user experience. It simplified the manufacturing process, as compared to

  20. Slide 20: Customer Case V: REHAU

    C U S TO M E R C A S E V: R E H A U With the DragonFly LDM Smartification is no longer we will drive forward just a vision for us. REHAU’s “Electronics into REHAU is developing Polymers” strategy to improved products for the speed up in-house smart home and IoT electronics development environment, a

  21. Slide 21: New Manufacturing Possibilities with the DragonFly LDM

    N E W M A N U FA C T U R I N G P O S S I B I L I T I E S W I T H T H E D R A G O N F LY L D M High Performance Electronic Devices: HiPEDs RF AMPLIFIER FOR SPACE PRINTED CAPACITORS ○ Light weight ○ High Accuracy Capacitors ○ Integrated design Integrated in the board ○ < 1db gain difference ○ 50 layer

  22. Slide 22: Produce Complex PCB and HiPEDs

    PRODUCE COMPLEX PCB AND HIPEDS HiPEDs ➢ Fast prototyping, HIGH hours vs weeks AME CIRC IT IOT WI I ACCESS POI T AME with AME CIRC Side IT WITH ERTICALL STAC ED PERFORMANCE AME Circuit WITH with I TE RATED IOT Access SIDEMounted MO TED A D Vertically I TE RATED Stacked CIRC ITS ELECTRONIC CTIO AL CAP

  23. Slide 23: Additive Manufacturing of Electronics: AME HiPED

    A D D I T I V E M A N U FA C T U R I N G O F 3 D E L E C T R O N I C S Electronics integration (MEMS, Real 3D Embedded Electronics for Sensors, Transistors, ICs, Opto, Piezo, Heterogenous Integration Chem-Electro, Magnetics, Motion) 3D Printed Electronics Components AME HiPED Multi Stacking ICs, Pac

  24. Slide 24: Nano Dimension: Financial Data

    N A N O D I M E N S I O N : F I N A N C I A L D ATA NASDAQ Shares Outstanding: YEAR-OVER-YEAR GROWTH NNDM ~*54.5M ADS ratio: 1:1 $7,070,000 *As of October 20th , 2020 $5,100,000 8000000 6000000 $80M invested mostly in R&D, over 5 years As of September 30th, 2020: 4000000 $800,000 Cash: $45.7M* 20000

  25. Slide 25: Business Model: Recurring Revenue Model That Scales

    B U S I N E S S M O D E L : R E C U R R I N G R E V E N U E M O D E L T H AT S C A L E S Razor-Razorblade Model: • As the installed base of systems CONSUMABLE REVENUE grows, the recurring revenues GROWTH from consumables increases. • Positive trend of increased ink consumption by customers is a vali

  26. Slide 26: Nano Dimension's Fabrication Services: NaNoS

    N A N O D I M E N S I O N ’ S 3 D FA B R I C AT I O N S E R V I C E S : N a N o S • Nano Services (NaNoS) is an offering for customers who need to get their hands-on complex, multilayered high- performance electronics with a quick turnaround time. • Provide services to customers around the globe wit

  27. Slide 27: Nano Dimension Evolution

    NANO DIMENSION EVOLUTION • 24/7 Print in a Compact System DragonFly™ LDM “The Secret Sauce” Competitive Edge & Barriers to • Integrated AI Software Entry Functional Unique Electronics DragonFly™ Pro Materials & Process DragonFly Early Adopters: Fast Prototyping & Low Volume Industrial Production Q2

  28. Slide 28: Why Additive Manufacturing for Electronics

    W H Y A D D I T I V E M A N U FA C T U R I N G F O R E L E C T R O N I C S ACCELERATE PROTECT time to market IP INCREASE IMPROVE design possibilities efficiency Nasdaq: NNDM I www.nano-di.com | © 2020 Nano Dimension. All rights reserved. 28

  29. Slide 29: AME 3D Printed Electronics Market

    AME 3D PRINTED ELECTRONICS MARKET IDTechEX (2019) • The total market for 3D printed electronics will be worth $2.3bn by $M 3D PRINTED ELECTRONICS MARKET 2029 and will be dominated by the professional PCB prototyping 4500 market segment. The educational and industrial production market segments will

  30. Slide 30: Nano Dimension: Revenue Drivers

    NANO DIMENSION: REVENUE DRIVERS Emerging Technologies HiPEDs Necessitate • Communication 5G/RF • Fast time-to-market • IP safety → in-house rapid prototyping and production • Heterogeneous Integrations • Interactive development • Aerospace (i.e. micro-satelites) • Device performance gains • Defense

  31. Slide 31: Nano Dimension: New Corporate and US Management

    N A N O D I M E N S I O N – N E W C O R P O R AT E A N D U S M A N A G E M E N T • Yoav Stern – President & CEO (Joined 01/2020) – Investor and Chairman Cyber, Fintech and Mobile/Visual Tech (USA). President & CEO DVTEL Inc. (Sold to FLIR Systems) (NJ, London, Tel Aviv, New Delhi, Adelaide, Singapor

  32. Slide 32: Nano Dimension: New Corporate and US Management

    N A N O D I M E N S I O N – N E W C O R P O R AT E A N D U S M A N A G E M E N T • Dr. Jaim Nulman – EVP Products & CTO (Joined 2018) – VP of Applied Materials, where he commercialized the Endura PVD system, the most successful semiconductor manufacturing product reaching market share from 0 to over

  33. Slide 33: Corona Is Affecting Businesses in 2020

    THERE IS AN ELEPHANT IN THE ROOM CORONA IS AFFECTING BUSINESSES IN 2020 W O R K I N G A S S U M P T I O N : AT L E A S T U N T I L Q 3 / 2 0 2 1 All present customers were out-of-office until July 2020. Some until now. (Mostly USA) • Chinese companies returned on 5/2020 but still delaying all purcha

  34. Slide 34: Present Investment Thesis Is New: Plan for 2021

    PRESENT INVESTMENT THESIS IS NEW PLAN FOR 2021: RIDING THE ELEPHANT • Started a Prototyping/Fabrication Services Business: NaNoS (Nano Services) • Expand NaNoS as revenue generator, but mainly as a route for DragonFly purchases once CapEx are released post Corona • M&A search directed at targets tha

  35. Slide 35: Plan for 2021-22: Fail-Safe BioTech Investment Model

    PRESENT INVESTMENT THESIS IS NEW PLAN FOR 2021-22: RIDING THE ELEPHANT “ ail-safe-BioTech Investment Model” – Stages I>>II>>III>>IV>>V For all HiPED printed by DragonFly 3D Electronic 3D-Printing Machines: Stage I DragonFly PIK – (Performance Improvement Kit) Stage II DragonFly MARK (Manufacturing A

  36. Slide 36: Product & Roadmap

    PRODUCT & ROADMAP DRAGONFLY ○ 24/7 production system LDM SYSTEM (Lights-Out Digital ○ Compatible with Gerber and STL files Manufacturing) ○ Real multi-layer additive manufacturing system for electronics DragonFly to support Military Standards for Low Volume Production in the future MATERIALS DEVELOP

  37. Slide 37: Traditional PCBs: Prototyping

    TRADITIONAL PCBs: PROTOTYPING Designs Prototypes are often created by sending digital designs (typically from the US or Europe to China) and waiting 7 to 21 days to receive a PCB back. PCBs This is slow, costly and puts core intellectual property at risk. Nasdaq: NNDM I www.nano-di.com | © 2020 Nano

  38. Slide 38: Post Corona World: Moving Supply Chain In-House

    P O S T C O R O N A W O R L D : M O V I N G S U P P LY C H A I N ‘ I N H O U S E ’ “Even as China comes back online, we are beginning to wonder if Covid-19 will impact other supply-oriented geographies… …While China is improving, the supply chain for the electronics industry may yet see substantial

  39. Slide 39: Post Corona World: Moving Supply Chain In-House

    P O S T C O R O N A W O R L D : M O V I N G S U P P LY C H A I N ‘ I N H O U S E ’ • "The global supply chain right now is disrupted; we are seeing disruptions across the board... the high-tech industry is heavily reliant on China and parts of Asia." (Bloomberg)² • “ ...heat from the Trump administr

  40. Slide 40: Post Corona World: Moving Supply Chain In-House

    P O S T C O R O N A W O R L D : M O V I N G S U P P LY C H A I N ‘ I N H O U S E ’ OCTOBER 12th, 2020: The American Dream: Bringing Factories Back to the U.S.(1) A report from the McKinsey Global Institute found “180 products across value chains for which one country accounts for 70% or more of expo

  41. Slide 41: Nano Dimension: Leading the AME Revolution

    NANO DIMENSION: LEADING THE AME REVOLUTION Additive Manufacturing (Metal & Polymers) Additive Manufacturing of Electronics (AME) $12,000 $10,000 $8,000 24% CAGR $6,000 24% CAGR $4,000 $2,000 $0 18 20 22 24 26 28 30 32 34 36 Market Growth – Additive Manufacturing Market Growth – Additive Manufacturin

  42. Slide 42: Key Highlights

    KEY HIGHLIGHTS: New Investment Thesis: Accelerate Product development through I,II,III,IV,V stages. Growth company with significant technology and first mover advantage. Expected to reach inflection point upon conversion from prototyping to short production runs. Blue-chip customer base worldwide. N

  43. Slide 43: Appendix: Additive Manufacturing for Electronics

    Appendix Additive Manufacturing for Electronics NASDAQ : NNDM 43

  44. Slide 44: Traditional PCBs: History

    TRADITIONAL PCBs: HISTORY Pre-PCB electronic circuit with rat's nest wiring. Before the 1950s, electronic circuits were assembled using individual wires to connect each of the components (Pic 1). The components were then mounted on what were known as tag strips and sockets. The first circuit boards

  45. Slide 45: Traditional PCBs: Mounting Components

    TRADITIONAL PCBs: MOUNTING COMPONENTS Through-Hole Electronics Surface Mount Electronics The vast majority of electronic circuits are now made using Printed Circuit Boards (PCBs). These are copper-clad fiberglass or epoxy boards that have the copper selectively etched away to leave conductive traces

  46. Slide 46: Traditional PCBs: Geography

    TRADITIONAL PCBs: GEOGRAPHY 1% Around 90% of all PCBs are 1% 1% 2% • China manufactured in the APAC region. • Vietnam 2% China are the largest producer with • South Korea around 43% market share followed by • Taiwan 5% Japan and South Korea with 15% and 13%, respectively. Singapore 13% Philippines I

  47. Slide 47: Nano Dimension: PCB vs AME

    NANO DIMENSION: PCB VS AME • Single-sided PCBs are very limiting in terms of connection topology. With single-sided PCBs, most circuits require the ability to join two conductive tracks using a wire. • Double-sided PCBs alleviate this problem by allowing connections through holes from one side of Do

  48. Slide 48: Traditional PCBs: Layers

    T R A D I T I O N A L P C B s : L AY E R S World PCB production by type 5% 16% Single sided 2-6 layers 8-16 layers 15% 37% 18+ layers Microvia Substrate Flex & R-Flex 12% Many PCB designs, particularly analog or high- frequency digital circuits, employ a ground Source: TTMTechnologies 13% plane. Thi

  49. Slide 49: Traditional PCBs: Layers

    T R A D I T I O N A L P C B s : L AY E R S Traditional PCBs are a mature technology, and their limitations are well understood. High-end multilayer PCB manufacture is tricky and expensive, and prototypes are usually made externally and often off-shore. Traditional PCBs are both rigid and flat. This

  50. Slide 50: Traditional PCBs: Mechanics

    TRADITIONAL PCBs: MECHANICS The physical strength of fiberglass board makes it possible to use a traditional PCB as a mechanical component in a device as well as an electrical one. This is a crude form of structural electronics. Rigid PCBs can be connected together The CrazyFlie quadcopter using fle

  51. Slide 51: Traditional PCBs: Heat

    T R A D I T I O N A L P C B s : H E AT Components such as power semiconductors can generate a lot of heat thatmust be dissipated in order to keep the device running within temperature tolerances. Temperature is responsible for 55% of all electronic circuit failures. Specifically, the failure rate of

  52. Slide 52: Traditional PCBs: SWOT Analysis

    T R A D I T I O N A L P C B s : S W O T A N A LY S I S Strengths Weaknesses • Established technology: ~$60bn industry. • Either expensive to prototype locally or slow to prototype • Physically strong. remotely (7 to 21 day turnaround from China). • High electrical conductivity (σ =5.96×107S/m) from

  53. Slide 53: 3D-Printed HiPEDs

    3D-Printed HiPEDs NASDAQ : NNDM 53 Nano Dimension® Confidential and Proprietary

  54. Slide 54: Nano Dimension: 3D-Printed HiPEDs

    NANO DIMENSION: 3D-PRINTED HIPEDS Example of HiPEDs : • LOW PASS FILTER (LPF) • VERTICALLY STACKED INTEGRATED CIRCUITS (ICS) • RF ANTENNAS & AMPLIFIERS UP TO 6GHZ • FUNCTIONAL CAPACITORS BY ADDITIVE MANUFACTURING • IN PCB PLANAR DC-DC UP CONVERTER TRANSFORMER • BUILT IN POWER TRANSFORMERS NASDAQ: NN

  55. Slide 55: Example of HiPEDs: Vertically Stacked Integrated Circuits

    E X A M P L E O F H i P E D S : V E R T I C A L LY S TA C K E D I N T E G R AT E D CIRCUITS (ICS) Stacked ICs have a higher circuitry density than traditional PCBs by allowing ICs to be mounted and interconnected on top of each other. Nasdaq: NNDM I www.nano-di.com | © 2020 Nano Dimension. All right

  56. Slide 56: Example of HiPEDs: Low Pass Filter

    E X A M P L E O F H i P E D S : L O W PA S S F I LT E R ( L P F ) LPF uses AME capacitors fabricated simultaneously inside the AME board together with strip lines. The AME capacitor and the strip line can be placed on any AME layer or on different layers in the AME board With Commercial Capacitors -

  57. Slide 57: Example of HiPEDs: RF Antennas & Amplifiers up to 6GHz

    EXAMPLE OF HiPEDS : RF ANTENNAS & AMPLIFIERS UP TO 6GHZ NANO DIMENSION CAN DO IT Our capability to print UHF & SHF RF signal transmission line and antennas. RF antennas & amplifier applications with up to 6GHz frequency. Nasdaq: NNDM I www.nano-di.com | © 2020 Nano Dimension. All rights reserved. 57

  58. Slide 58: Example of HiPEDs: Functional Capacitors by Additive Manufacturing

    E X A M P L E O F H i P E D S : F U N C T I O N A L C A PA C I T O R S B Y A D D I T I V E M A N U FA C T U R I N G • Produced simultaneously during the additive manufacturing of PCBs • Reduce the total size of the PCB • Freeing surface area for mounting other PCB components Design Actual Nasdaq: NN

  59. Slide 59: Example of HiPEDs: In PCB Planar DC-DC Up Converter Transformer

    EXAMPLE OF HiPEDS: IN PCB PLANAR DC-DC UP CONVERTER TRANSFORMER • The most common DC-DC Up Converters are units mounted on a PCB • By producing the device as an integrated part of the PCB, surface area usage, assembly time, and other overhead costs are reduced. Nasdaq: NNDM I www.nano-di.com | © 202

  60. Slide 60: Example of HiPEDs: Side Mount/Contact and Inserted Components

    E X A M P L E O F H i P E D S : S I D E M O U N T / C O N TA C T A N D I N S E R T E D COMPONENTS • Enables the use of an area not common for PCB components • Enables the creation of customized small PCBs that can be inserted into a socket a) b) Figure 1 X-ray view of a) inserted, and b) side mounte

  61. Slide 61: Example of HiPEDs: Built in Power Transformers

    E X A M P L E O F H i P E D S : B U I LT I N P O W E R T R A N S F O R M E R S In Board Power DC–DC Up AC-AC Voltage Converter AC-AC Up Transformer with Converter (x10) ferrite core Nasdaq: NNDM I www.nano-di.com | © 2020 Nano Dimension. All rights reserved. 61

  62. Slide 62: Thank You

    THANK YOU NASDAQ: NNDM Follow us: @nanodimensiontech @3Dpcb www.nano-di.com NASDAQ : NNDM 62Copyright © 2020 Nano Dimension Ltd. Nano Dimension, DragonFly, AgCite and the DragonFly logo are trademarks of Nano Dimension.www.nano-di.com Nano Dimension® Printed October | © 2020 Nano2020 DragonFly™ Dime

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