Micron Technology, Inc. · NASDAQ:MU
Micron Technology — Flash Memory Summit 2007
25 slides from Micron Technology's conference presentation, August 2007
Slide 1: Overcoming (or Embracing) the Dreaded Single-Source Dilemma
Overcoming (or Embracing) the Dreaded Single-Source Dilemma Michael Abraham (mabraham@micron.com) Applications Engineering Manager Micron Technology, Inc. Santa Clara, CA USA August 2007 1
Slide 2: Agenda
Agenda An introduction to NAND Flash How to multisource Why single source? Alternatives to single sourcing Santa Clara, CA USA August 2007 2
Slide 3: An Introduction to NAND Flash
An Introduction to NAND Flash NAND Flash is made for data storage • High density: 128MB–16GB per package • Low cost per bit • Low power • Nonvolatile Santa Clara, CA USA August 2007 3
Slide 4: NAND Structure
NAND Structure NAND array is page- and block-centric • Page is the smallest programmable and readable unit in the NAND array composed of bytes or words • Block is the smallest erasable unit composed of many pages NAND interface • Sequential data input and output preferred • Commands, addresses,
Slide 5: Lots of Density Growth
Lots of Density Growth NAND Flash is perfect for density scaling • Cell layout perfect for process shrinks • Fixed pin count leads to consistent packaging options • Multiple die stack within a package • Multi-level cell (MLC) stores more bits of data per cell Result each year • Twice the density
Slide 6: Market Segments
Market Segments Entering many market segments • Automotive: Car stereo and navigation • Computing: SSD, HHD, and caching • Consumer: Cards, DSC, GPS, MP3, and video • Wireless: Mobile phones • More… Santa Clara, CA USA August 2007 6
Slide 7: Many NAND Suppliers
Many NAND Suppliers Suppliers include • Hynix • Intel • Micron • Samsung • STMicroelectronics • Toshiba With many suppliers, NAND is easy to second source, right? Santa Clara, CA USA August 2007 7
Slide 8: NAND Configuration Options
NAND Configuration Options Vcc ECC • 3.3V • 1 bit • 1.8V • 4 bits • 8+ bits I/O width • x8 Number of partial page programs • x16 (NOP) • SLC: 4, 8 Page size • MLC: 1 • 2,112 bytes • 4,224 bytes Endurance • 4,314 bytes • SLC: 100,000 cycles • More coming… • MLC: ≤10,000 cycles Number of
Slide 9: Most Common Configurations
Most Common Configurations For 3.3V: x8 SLC/MLC, commercial temp, TSOP • Most widely available configuration • SLC for performance and endurance • MLC for density and lowest cost per bit For 1.8V: x16 SLC, commercial temp, BGA/MCP • Common for wireless/embedded applications • Typically SLC only,
Slide 10: The Multisource Dilemma
The Multisource Dilemma Even when picking a common configuration, differences exist in NAND Flash parts • Protocol • Array addressing • Features • ECC requirements • Page size • More… Having a multisource is not impossible, it just requires more upfront work Santa Clara, CA USA August 2007 10
Slide 11: Step #1: Pick the Right NAND Controller
Step #1: Pick the Right NAND Controller Does it have enough ECC for the future? • For SLC: Recommend 4-bit RS or BCH • For MLC: Recommend 8+ bits BCH Can it support NOP = 1? • For SLC: Improves endurance • For MLC: Already required Does it support x8 and/or x16? Does it support single- and m
Slide 12: Step #1: Pick the Right NAND Controller (continued)
Step #1: Pick the Right NAND Controller (continued) Does it need to support MLC NAND? • Typically, once MLC is supported, SLC is also supported Does it have a good firmware/software SDK? • Command protocol • Advanced features (cache operations, unique ID, etc.) • Addressing • Page size • Block m
Slide 13: Step #2: Select the NAND Flash
Step #2: Select the NAND Flash Plan upfront to support multiple vendors Determine whether your application can support MLC NAND Flash Compare data sheets to look for differences in: • Op codes and command sequences • Page size – 2,000 or 4,000? – How many spare area bytes? 16 per each 512 byte
Slide 14: Typical Development Cycle for NAND-Based Products
Typical Development Cycle for NAND-Based Products Qualification Time Software/ NAND Select NAND NAND driver Product-level firmware Ship product for product testing testing updates NAND development process can be time consuming Each new device, even from the same vendor, requires some kind of fir
Slide 15: How Does ONFI Fit In?
How Does ONFI Fit In? ONFI provides consistency across participating NAND vendors • Command set • Protocol • Array addressing • Package definition • Timing parameters • Defect mapping Santa Clara, CA USA August 2007 15
Slide 16: Parameter Page Describes Device Capabilities to the Controller
Parameter Page Describes Device Capabilities to the Controller Once ONFI is supported in the controller, it reduces qualification time for new ONFI parts Supplier ONFI samples new Product-level Ship product NAND testing NAND Firmware may need to be modified for optional features if not already s
Slide 17: The NAND Trade-Off
The NAND Trade-Off Long development times • Can be shortened by ONFI support, but not all vendors support ONFI The controller is required to provide • ECC • Block management • Wear leveling Result: Lowest cost-per-bit memory • Saves the most money, particularly for high-volume products Santa C
Slide 18: Why Single Source?
Why Single Source? Time to market is critical Small budget for development Low volume A “must have” feature not found commonly on other NAND devices • High-performance throughput requirement • Needed density is not yet widely available • OTP • Block lock Santa Clara, CA USA August 2007 18
Slide 19: Why Is Single Sourcing Risky?
Why Is Single Sourcing Risky? May inadvertently lock into niche feature(s), making future firmware/software updates more difficult • OTP • Block lock • PRE Component price goes up Part allocation EOL Santa Clara, CA USA August 2007 19
Slide 20: Alternatives to Single Sourcing
Alternatives to Single Sourcing Use software/firmware vendor for file system, flash translation layer, and/or low-level driver support • Performs block management and wear leveling • Supports multiple NAND vendors • Works with variety of controllers • Supports variety of operating systems Select
Slide 21: Embedded Memories
Embedded Memories Pros Cons • Most handle ECC, block • Cost more per bit than management, and wear NAND leveling • May require new controller • eMMC, SD, OneNAND, and to support the particular DOC have multiple vendor interface sources • Some solutions are vendor • eMMC, SD, and BA NAND propriet
Slide 22: eMMC Example
eMMC Example Interface and packaging eMMC vendors standardized by MMCA and • Micron (Managed NAND) JEDEC • Samsung (MoviNAND) • Toshiba (eMMC NAND) MMC interface found already on many wireless controllers today Santa Clara, CA USA August 2007 22
Slide 23: Conclusion
Conclusion NAND Flash market is growing significantly for storage With upfront planning and some development cost, it is possible to multisource NAND Flash and keep volume price down ONFI simplifies the multisourcing by reducing design and qualification effort for additional NAND products Th
Slide 24: References
References Memory vendors Flash file system vendors • Hynix: http://www.hynix.com/ • CMX Systems: http://www.cmx.com/ • Intel: http://www.intel.com/ • Datalight: http://www.datalight.com/ • Micron: http://www.micron.com/nand/ • Samsung: http://www.samsung.com/ • SanDisk: http://www.sandisk.com/
Slide 25: About Michael Abraham
About Michael Abraham Manager of Micron’s NAND Flash Applications Engineering group BS in Computer Engineering from Brigham Young University Micron’s representative on the ONFI technical committee Key role in defining and standardizing the new high- speed NAND interface within Micron and at