Asml Holding Nv · EURONEXT:ASML
Asml Holding Nv — Barclays Capital Global Technology Conference 2009
25 slides from Asml Holding Nv's conference presentation, Dec 9, 2009
Slide 1: Barclays Capital Global Technology Conference, December 2009
Barclays Capital Global Technology Conference San Francisco, CA December 2009
Slide 2: Safe Harbor
Safe Harbor "Safe Harbor" Statement under the U.S. Private Securities Litigation Reform Act of 1995: the matters discussed in this document may include forward-looking statements that are subject to risks and uncertainties including, but not limited to: economic conditions, product demand and semico
Slide 3: ASML overview - The world's leading provider of lithography systems
ASML overview - The world's leading provider of lithography systems for the semiconductor industry Established: 1984 Headquarters: Veldhoven, the Netherlands Market cap ~ €9 B Employees ~ 6,500 Customers: Serving 17 of the top 20 semi mfg. Equity Listing: Nasdaq and Euronext Key facts Key financials
Slide 4: Market Update
Market Update 1 ide 4
Slide 5: 2009 WW GDP growth forecast is stable at -1.0%
2009 WW GDP growth forecast is stable at -1.0%, 2010's remains at +3.7% but mainly driven by governments' rescue packages Source: Wachovia, November 2009
Slide 6: Consumer confidence still remains at low levels
Although increasing, consumer confidence still remains at low levels compared to historical values
Slide 7: Average 2009 semiconductor revenue growth forecast
Average 2009 semiconductor revenue growth now forecast at - -11.6% as most analysts increased their 2009 outlook Sources: See chart (11/2009) Weighted average is based on age of forecast from market institute and respective level of accuracy for the last 3 years
Slide 8: 2010 semiconductor revenue growth forecast of analysts
2010 Semiconductor revenue growth forecast of 3rd- party analysts is now at +13.3%, indicating bullish sentiment Sources: See chart (11/2009) Weighted average is based on age of forecast from market institute and respective level of accuracy for the last 3 years
Slide 9: Days of IC inventory down in September
Days of IC inventory down to 33 in September as OEMs are buying significantly in anticipation of strong Christmas demand Source: VLSI Research, WSTS, ASML Last data point: September 2009
Slide 10: DDR2 and DDR3 spot prices kept increasing
Source: DRAM Exchange (6/11/2009) DDR2 and DDR3 spot prices kept increasing due to shortages All DRAM manufacturers are now cash-profitable 300 mm cash-costs for 5x nm 1 Gb DRAM between 0.8 & 0.9 USD 300 mm cash-costs for 7x nm 1 Gb DRAM between 1.4 & 1.6 USD 300 mm cash-costs for 6x nm 1 Gb DRAM be
Slide 11: Market Update - Summary
Market Update - Summary 2009 WW GDP forecast stable in negative territory - 2010 forecasted to grow Consumer confidence remains low 2009 semi forecasts keep increasing, indicating improved end- consumer electronics demand As of September 09, absolute inventory levels decreased faster than IC sales r
Slide 12: Litho Technology
Litho Technology 1 ide 12
Slide 13: NAND Flash Customer Roadmaps drive Lithography tool development
NAND Flash Customer Roadmaps drive Lithograph tool development Jan-00 Jan-02 Jan-04 Jan-06 Jan-08 Jan-10 Jan-12 Half Pitch (nm) 200 100 80 60 40 Logic DRAM Half Pitch status : Logic = 40~45nm DRAM = 45~55nm NAND = 35~45nm
Slide 14: ASML 300mm Product Roadmap
ASML 300mm Product Roadmap l Res. NA 300 mm 22nm 0.32 27nm 0.25 40nm 0.25 40nm 45nm 1.20 57nm 0.93 H ' 80nm 0.93 110nm H 120nm H ASML Product Roadmap, April 2009 XT:1950Hi NXE:3100 NEXT XT:1450G 38nm EUV 13 nm ADT H ArF 193 nm 1.35 XT:1900Gi XT:1700Fi H KrF 248 nm XT:1000H 0.80 XT:8x0G XT:800G i-Lin
Slide 15: ASML roadmap enables shrink for Logic, DRAM, and NAND flash
ASML roadmap enables shrink for Logic, DRAM, and NAND flash at time required Source: Various customers, dates determine production start/qualification 10 12 200 100 80 60 40 11 07 09 08 04 06 05 01 03 02 00 Resolution/half pitch "Shrink" [nm] Year ASML Product Introduction XT:1400 XT:1700i AT:1200 A
Slide 16: Double patterning will bridge the gap between immersion and EUV
Double patterning will bridge the gap between single exposure immersion and EUV '02 '03 '04 '05 '06 '07 '08 '09 '10 '11 '12 '13 '14 Resolution, "Shrink" (nm) 100 80 60 40 Logic NAND Flash DRAM 30 20 50 200 Immersion technology Double patterning EUV
Slide 17: TWINSCAN NXT:1950i for double patterning
For double patterning 30 nm and smaller Productivity more than 175 wafers per hour Overlay less than 3 nm Multiple TWINSCAN NXT:1950i shipped
Slide 18: EUV for 22nm and beyond - systems to ship in 2010
EUV for 22nm and beyond - 5 systems to ship in 2010 Machine design changes Mirror optics and wafers in vacuum Moving stages in vacuum New type of light source
Slide 19: Technology in time helps grow market share
Source: ASML, SEMI Source: ASML, SEMI 0% 10% 20% 30% 40% 50% 60% 1984 1986 1988 1990 1992 1994 1996 1998 2000 2002 2004 2006 2008 2008 8" & i-line 6" & early i-line KrF & Step & Scan 12" & ArF ArFi Technology in Time helps grow market share ASML market share (revenue) - Nearly tripled in 10 years
Slide 20: Lithography system costs will continue to rise
1 10 100 1985 1990 1995 2000 2005 2010 Year Lithography System costs will continue to rise Relative List Price i-line 300mm 200mm 150mm KrF ArF ArFi EUV? Wafer Size Wavelength Stepper Platform Step & Scan Dual Stage 0.4 0.5 0.6 0.7 0.8 0.93 1.2 1.35 Aperture
Slide 21: Average Selling Price (ASP) grows
Average Selling Price (ASP) grows 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 YTD 3.59 4.38 5.4 5.9 6.8 8.92 9.46 9.28 13.54 14.01 14 20.03 22.75 MSGraph.Chart.8 MSGraph.Chart.8 ASML ASP new systems KrF & Step & Scan 300mm & ArF 300mm & ArF ArF volume & ArFi
Slide 22: Single exposure lithography enables cost effective shrink
Single exposure lithography enables cost effective shrink >3000X cost reduction per function over 25 years Time Tool cost/DPH Double patterning I-line KrF ArF ArFi EUV Tool cost Dies per hour Cost per function Cost per function
Slide 23: 25 years of cost effective innovation
Model: 2500/40 5500/100 5500/550B AT:1150C XT:1900i NXT:1950i* EUV Introduction: 1987 1994 1999 2003 2007 2011 2012 Wavelength: 365nm 365nm 248nm 193nm 193nm 193nm 13.5nm Max NA: 0.4 0.6 0.63 0.75 1.35 1.35 0.32 Resolution: 0.7µm 0.35µm 0.18µm 90nm 40nm 32nm 18nm Field Size: 14x14mm 22x22mm 26x33mm
Slide 24: Summary
Summary The Semiconductor industry is in a transition phase due to the current severe worldwide financial crisis Shrinking design rules have been the economical driver of the IC industry. Lithography remains the key enabler Shrinking design rules require increasingly more sophisticated litho systems
Slide 25: =~ o § \S & Oo
=~ o § \S & 8 Oo
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