Phoenix Silicon International Corp. · TWSE:8028
Phoenix Silicon International — Non-Deal Roadshow (March 2024)
26 slides from Phoenix Silicon International's roadshow presentation, Mar 5, 2024
Slide 1: PSI Roadshow in Q1, 2024
PSI Roadshow in Q1,2024 5 Mar. 2024
Slide 2: Safe Harbor Notice
Safe Harbor Notice • Psi’s statements of its current expectations are forward-looking statements subject to significant risks and uncertainties and actual results may differ materially from those contained in the forward-looking statements. • Information as to those factors that could cause actual r
Slide 3: Agenda
Agenda • Semi industry trending • PSI strategies update • ESG subject update • Key takeaways Phoenix Silicon International Corporation Confidential 2
Slide 4: Semi Outlook
Semi Outlook
Slide 5: Inventory Show Improvement - Except Power Semi
Inventory Show Improvement - Except Power Semi TSMC QUALCOMM INFINEON 105 180 161 200 178 148 150 153 99 160 180 100 132 149 153 96 96 160 139 145 95 140 134 93 108 140 122 121 95 120 90 93 120 88 100 82 90 100 85 80 80 85 60 60 80 8 Qtrs Avg 40 40 20 20 75 0 0 2 2 Q1 2 2 Q2 2 2 Q3 2 2 Q4 2 3 Q1 2 3
Slide 6: Semi Industry FCST
Semi Industry FCST 1 Trillion USD M 1,000 Revenue 6.1% 15.5% 765 721 27.1% 0.2% 16.8% 624 598 600 -10.9% 535 2021 2022 2023 2024E 2025E 2026E 2030E Source: Gartner, PSI estimate Phoenix Silicon International Corporation Confidential 5
Slide 7: Semiconductor Major Drivers
Semiconductor Major Drivers Adv. Nodes Adv. Packaging AI Semiconductor Conv. Nodes Electrification & Energy transition SiC/GaN Phoenix Silicon International Corporation Confidential 6
Slide 8: PSI Part Of AI Supply Chain
PSI Part Of AI Supply Chain Foundry CoWoS Reclaim, Carrier Interposer GPU/ ASIC Foundry/ GPU GPU Sever house Adv. packaging Module baseboard assembly MEOL Ultra thin Power MOSFET Phoenix Silicon International Corporation Confidential 7
Slide 9: PSI Part Of EV Supply Chain
PSI Part Of EV Supply Chain ATV Grade Si/ SiC Power MOSFET thinning process FEOL MEOL BEOL Semiconductor Tier2 Tier 1 OEM IDM/ Fabless System manufacturing Parts Phoenix Silicon International Corporation Confidential 8
Slide 10: PSI Key Strategy
PSI Key Strategy • Leading Tech in Ultra clean reclaim wafer • Tailor made TEST/ CARRIER wafer • WW No.1 Wafering capacity • Focus on AI, high power application • Enabling 8” SiC thinning business • WW No.1 Thinning Capacity Phoenix Silicon International Corporation Confidential 9
Slide 11: Wafering Business Line
Wafering Business Line Reclaim demand up driven by Advanced node Test wafer for carrier wafers emerging in Advanced packaging
Slide 12: Requiring More Advanced Process
Requiring More Advanced Process N2 N2 BPD N3P N3E Logic density N4 N5 ~100 N6 masks 40-50 N7 N10 masks N16 N22 N28 2010 2012 2014 2016 2018 2020 2022 2024 2026 Planner FinFET Nanosheet Source: Company data, PSI Phoenix Silicon International Corporation Confidential 11
Slide 13: Permanent Bonding With Carrier Wafer
Permanent Bonding With Carrier Wafer BPD 2nm/18A Source: imec Phoenix Silicon International Corporation Confidential 12
Slide 14: Consuming More high-Grade Reclaim Wafer
Consuming More high-Grade Reclaim Wafer 2013 2015 2017 2018 2020 2022 2025 High Grade > 25% 55 Sensitivity(nm) 37 32 26 19 19 15 Particle size Process node 40nm 28/22nm 16/14nm 12/10nm 8/7nm 5nm 3nm 2nm 20 20 16 16 10 10 77 55 33 22 G1 G2 G3 G4 G5 G6 Source: KLA, PSI Phoenix Silicon International Co
Slide 15: WW No.1 Lights out Wafering Fab
WW No.1 Lights out Wafering Fab 100 40 15 5 2021 2023 2025 2027 Picture: PSI Phoenix Silicon International Corporation Confidential 14
Slide 16: WW No.1 Wafering House Capacity
WW No.1 Wafering House Capacity 12 20 30 +60 2023 2025 2027 Tbd building 2 Picture: PSI Phoenix Silicon International Corporation Confidential 15
Slide 17: Strategic Expansion in Customers and MFG
Strategic Expansion in Customers and MFG • Phase1: TW site support • Phase2: local site supply • TW site support New customers Customers’ oversea site Phoenix Silicon International Corporation Confidential 16
Slide 18: Thinning Business Line
Thinning Business Line Focus on AI Centric Next generation focus on SiC and 12”
Slide 19: AI Require More Efficient Thermal Solution
AI Require More Efficient Thermal Solution Increased ~3.5 X Thermal Design Power Increased ~4 X Source: E.Sun Security, company data, PSI Phoenix Silicon International Corporation Confidential 18
Slide 20: Power Discrete Must Do Thin Wafer Process
Power Discrete Must Do Thin Wafer Process Source: M. Das, “Market Dynamics of the Automotive SiC Revolution for Electrification,” PowerUP Expo 2023 Phoenix Silicon International Corporation Confidential 19
Slide 21: Advantage Of Large Diameter SiC Wafer
Advantage Of Large Diameter SiC Wafer Source: Wolfspeed Picture: PSI Phoenix Silicon International Corporation Confidential 20
Slide 22: Thinning Bu Roadmap
Thinning Bu Roadmap Thickness (um) • Silicon base: 8” focus on AI sever 12” Major for Adv. packaging 12” 200 SiC Silicon • SiC base: focus on 8” thinning 100 50 37.5 2010 2015 2020 2025 Picture: Psi Source: PSI Phoenix Silicon International Corporation Confidential 21
Slide 23: WW No.1 Thinning House Capacity
WW No.1 Thinning House Capacity FSM BGBM Test Picture: PSI Phoenix Silicon International Corporation Confidential 22
Slide 24: Key Takeaways
Key Takeaways
Slide 25: Key Takeaways
Key Takeaways • The global semiconductor industry is poised to become a trillion-dollar industry by 2030. Major growth is driven by AI and Smart electric vehicles. • For PSI, 2024 marks a transitional year, heralding significant growth leading into 2025. The year 2025 is poised to witness substantia
Slide 26: Thank you
Thank you
Phoenix Silicon International — Non-Deal Roadshow (March 2024) on 6ix