Slide 1: Williams Advanced Materials
Williams ADVANCED MATERIALS,
Slide 2: WAM Vision
WAM Vision Globally Recognized High Quality/Technology Supplier of Products and Services for "State Of The Art", Emerging and Leading Edge Markets and Industries. Williams will Create a "Unique" Business Model with its Central Focus being to Relentlessly Strive for Product Differentiation through a
Slide 3: What We Do
What We Do Williams Advanced Materials develops, manufactures and markets materials and services of unique value for the Magnetic and Optical Data Storage, Wireless, Photonics, Semiconductor, Optics, Security, Hybrid Microelectronics and Performance Coating industries. We also support emerging techn
Slide 4: Sales History
Sales History 1990 1994 1999 2004 2005 2006 2007 East 38 72 110 168 218 344 YTD Q2 $267.4 M
Slide 5: Product Mix
Product Mix Thin Film Materials Electronic Packaging Materials Shield Cleaning Services Refining Thin Film Deposition Services Rod 65 20 6 5 5 Q2 - 2007
Slide 6: Thin Film Products
Thin Film Products PVD Materials Precious Metal Target Materials Non-Precious Metal, Cermets, Ceramics Vacuum Induction Melting Hot Pressing Hot Isostatic Pressing EVAPro(tm) Evaporation Materials Localized Target Bonding Chamber Services Shield Cleaning and Conditioning PM Refining and Upgrading Lo
Slide 7: Packaging Materials
Packaging Materials FLA/Combo-Lid(r) Seam Seal/Microlid(tm) Preforms Clad Materials Braze Materials Ni Alloys Dental Coating, Patterning and Visi-Lid(tm) (TFT) Packages (Zentrix) Buffalo Singapore Wheatfield Buellton WAM Taiwan WAM Philippines
Slide 8: WAM Corporate Business Structure Today and Evolving
WAM Corporate Thin Film Products (Brewster) Electronic Packaging Products (Buffalo) - ---- Fab Services Business Structure Today and Evolving Thin Film Services (Buellton) Fab Services Ireland Czech Specialty Inorganic Materials (Milwaukee) Sales & Marketing Legal & IP Admin. & Finance Zentrix WAM F
Slide 9: WAM Headquarters Buffalo, NY USA
WAM Headquarters Buffalo, NY USA - Manufacturing Facility 100,000 Sq. Ft. overall, 6,500 Sq. Ft. of cleanroom, state-of-the-art machining/milling/rolling/stamping/cladding centers, target bonding, hydrostatic wire extrusion, high purity refining/recycling, metals casting, automated plating, full ana
Slide 10: Specialty Alloys Operations
Specialty Alloys Operations Wheatfield, NY USA - Williams Specialty Alloys 35,000 Sq. ft. with volume vacuum casting, rolling, annealing, powder atomizing, machining, and chamber services. 10 acres for expansion.
Slide 11: Williams Thin Film Products Operations
Williams-Thin Film Products Operations Brewster, NY USA - 35,000 Sq. Ft. with vacuum melting, hot-pressing, milling, hot & cold rolling automated machining and target bonding capabilities. 35,000 Sq. ft. expansion completed April 2007.
Slide 12: Thin Film Technology (TFT)
Thin Film Technology (TFT) Buellton, CA Thin film coating and substrate patterning. Visi-Lid(tm) supply chain management. Capabilities: Electron Beam Evaporation, DC/RF Magnetron Sputtering, Photolithography (Substrate Patterning), Dicing, Tooling design, In-House Machine shop.
Slide 13: CERAC Milwaukee, WI
CERAC Milwaukee, WI Subsidiary of WAM Physical Vapor Deposition (PVD) materials for opthalmic, optic and performance applications Specialty Inorganic Materials Unique technologies in chemical and powder processing
Slide 14: European Operations - Limerick, Ireland
Limerick, Ireland - OMC Scientific, Ltd. Subsidiary of WAM Provides precision parts cleaning and reconditioning services for film Physical Vapor Deposition (PVD) customers in Europe. Unique technology applied to opportunities in North America and Asia. Efforts focused in the semiconductor, magnetic
Slide 15: Czech Republic Operations
Czech Republic Operations Czech Republic Operations Louny, Czech Republic - OMC Scientific, Ltd. 20,000 Sq ft. Provides precision parts cleaning and reconditioning services for film Physical Vapor Deposition (PVD) customers in central and eastern Europe State-of-the-art cleaning, stripping and packa
Slide 16: Far East Operations
Far East Operations Singapore - WAM Far East Pte.Ltd. Administrative Hdqtr, Target bonding, bonding wire production, Combo-Lids(r). assembly Taoyuan County, Taiwan - WAM Taiwan Target bonding, evaporation materials & bonding wire Subic Bay, Philippines Combo-Lids(r), low-cost lids and preform - asse
Slide 17: Suzhou - China
Suzhou - China Suzhou, China 20,000 Sq ft. Target & Evaporation materials manufacturing, Target bonding services, Distribution, Warehousing, Sourcing, MgF manufacturing and packaging. Located near Shanghai Airport and close to many technology centers located in Eastern China. Markets Serve: Semicond
Slide 18: International/Domestic Revenue - 2007
International/Domestic Revenue - 2007 Intl. U.S. 28 72
Slide 19: Global Service and Support
Global Service and Support Regional Offices (Sales and Applications Engineering support) Buffalo, NY Tokyo, Japan Brewster, NY Taoyuan, Taiwan Boston, MA Singapore Tucson, AZ Manila, Philippines Santa Clara, CA London, England Buellton, CA Seoul, Korea Milwaukee, WI Limerick, Ireland Dallas, Texas S
Slide 20: 2007 Key Initiatives
2007 Key Initiatives China - Subsidiary Geographic Expansion, Building, Licenses, Permits, etc. Czech Republic Chamber Services / Manufacturing / Subsidiary Warehousing WAM - Brewster Successful Facility Expansion/Media Materials Wheatfield Successful completion of Chamber Services Expansion move an
Slide 21: Key Markets - Magnetic Head and Media
Thin film materials for both the read/write head and disc platter. Chamber Services complement materials offering. Applications growing into many commercial and mobile electronic products. Key Markets - Magnetic Head and Media
Slide 22: Key Markets - Semiconductor Packaging
Key Markets - Semiconductor Packaging High reliability semiconductor packaging materials. Applications focused in space, military and satellite market segments.
Slide 23: Key Markets - Semiconductor Wafer Fabrication
Key Markets - Semiconductor Wafer Fabrication Thin film materials and chamber services for silicon wafer and UBM (Under Bump Metallization) technologies. Numerous commercial and military microelectronic applications.
Slide 24: Key Markets - Wireless and Photonics
Key Markets - Wireless and Photonics Thin Film and Packaging materials for varied wireless and photonic applications including RF Power Amplifiers, HBT's, SAW Devices, Light Emitting Diodes (LEDs), Laser Recorders and Micro Electro Mechanical Systems (MEMS)
Slide 25: TFT Capabilities & Markets
TFT Capabilities & Markets Production Capability Thermal Evap. & E-Beam Evaporation IBD EBeam Evap. DC/RF Sputtring Comb. Evap/Sputter TF Hybrid Substrates Photolithography Specialty Coatings Dicing / Singulation Electroplating Markets Served Optics A/R Infrared Long & Mid Telecom Defense Medical Mi
Slide 26: Optics Markets
Optics Markets Security ZnS, MgF2, SiO2 Laser optics ThF4, YF3, SiO2, Ge Communications SiO2, Ta2O5, Nb2O5, LaB6 Cathodes Ophthalmics SiO2, Al2O3, Ti3O5, Cr-SiO
Slide 27: Opto-Electronic Markets
Opto-Electronic Markets Resistor material for hybrid circuits Cr-Si, W-Ti Projection Display Products HfO2, Cr, SiO2, MgF2 Clear conductive coatings ZnO Data Storage Photovoltaics (Solar) CdS, CdTe, Cu-In-Ga-Se
Slide 28: Specialty Inorganics Markets
Specialty Inorganics Markets Protective coatings for aerospace applications TiB2, B4Si Defense Applications Semiconductor gas precursors Zn3As2 Data Storage Medical devices V2O5 Specialty Batteries Li2O, CoS2
Slide 29: Chamber Services Value Package
Chamber Services Value Package SHIELD CLEANING SERVICE DESCRIPTION STRIPPING SURFACE TEXTURIZING FINAL CLEAN AND CLEAN ROOM PACKAGING Ultrasonic cleaning with particle count monitoring Drying a.k.a. baking a.k.a. outgassing Clean room packaging These steps must take place in a class 100 clean room (
Slide 30: Chamber Services/Refine
Chamber Services/Refine Chamber Services/Refine
Slide 31: Customer Service Value Packaging
Customer Service Value "Packaging" Niche Exploitation Flexible Manufacturing Cost Model Product Breadth Global Presence Reputation Distinctive Competencies Wireless/Photonics Semiconductor Fab MEMS Optical Media Photovoltaics Nanotechnology UBM / FCCL Semiconductor Pck. Magnetic Data Storage Memory