Lightwave Logic, Inc. · NASDAQ:LWLG

Lightwave Logic — Investor Presentation (August 2026)

32 slides from Lightwave Logic's investor presentation, August 2026

  1. Slide 1: Lightwave Logic, Inc. Investor Presentation

    INVESTOR PRESENTATION · August 2026 Lightwave Logic, Inc. NASDAQ:LWLG Enabling the utilization of electro-optics polymers for high speed, low power AI and Data Center applications

  2. Slide 2: Forward Looking Statements

    Forward Looking Statements This slide presentation contains “forward-looking statements” and “forward-looking information” within the meaning of the Private Securities Litigation Reform Act of 1995. This information and these statements, which can be identified by the fact that they do not relate st

  3. Slide 3: Imagine a flashlight turning on and off 100 billion times per second

    Imagine a flashlight turning on and off 100 billion times per second… © Lightwave Logic 2026. All Rights Reserved. 3

  4. Slide 4: Unlocking the Power of Silicon Photonics with Electro-Optic Polymers

    Unlocking the Power of Silicon Photonics with Electro-Optic Polymers Perkinamine® The Fastest Way to Convert Electrical Signals to Optical Signals AI infrastructure depends on high-bandwidth optical connectivity Silicon photonics enables optical connections at CMOS scale, but performance is limited

  5. Slide 5: Investment Highlights

    Investment Highlights Large and Attractive End Markets – Data Center/AI capacity growth supercycle and Telecom present $54B 1 modulator TAM, $2-4B SAM; future opportunities include Aerospace & Defense, Quantum Computing and Consumer Electronics Mission Critical Technology to AI scaling – Existing in

  6. Slide 6: Lightwave Logic At a Glance

    Lightwave Logic At a Glance Leveraging proprietary electro-optic polymers to enable high-speed optical modulators for AI scaling and data communications Englewood, CO LWLG ~50 67 >$100M $96 Global HQ NASDAQ Listed Employees1 Granted Patents R&D Investment Cash Balance2 Proven Technology Fully Domest

  7. Slide 7: Addressable Markets in Long-Term Secular Growth

    Addressable Markets in Long-Term Secular Growth AI Data Center (non-AI) Telecom/Scale Across Future Opportunities $37 billion TAM $10 billion TAM $7 billion TAM 45M units of 1.6Tb/s and 3.2Tb/s 16M units of high-speed transceivers 3.5M units of coherent/DWDM Quantum Computing transceivers/CPO (200Gb

  8. Slide 8: AI Infrastructure is Hitting Physical Limits to Scale

    AI Infrastructure is Hitting Physical Limits to Scale Power Power Usage and Power Density us Reaching Critical Limits Heat limit rack AI Clusters Are Scaling Faster Than • AI racks require exponentially more power density, total Infrastructure Can Support • Heat dissipation with rack is becoming a b

  9. Slide 9: Silicon Photonics & the Perkinamine Advantage

    Silicon Photonics & the Perkinamine® Advantage Perkinamine® doesn’t replace silicon photonics — it completes it What is Silicon Photonics? Silicon photonics transmits data using light instead of electrical current, encoding information onto laser beams guided through microscopic waveguides etched on

  10. Slide 10: AI Cluster Opportunity (Scale X)

    AI Cluster Opportunity (Scale X) Scale Up Scale Out Scale Across Within the Rack Across Racks Between Data Centers EO Polymer Advantage Increase bandwidth shoreline Reduce I/O power and Deliver ultra-high-speed optical density and power efficiency for enable high-density bandwidth for distributed, c

  11. Slide 11: Silicon Photonics is Winning

    Silicon Photonics is Winning Silicon photonics is winning the integration platform battle for hyperscale and AI networking Total Optical Transceiver Market1 (by technology) Optical transceiver market expected to grow $70.4B to $70 billion by 2030 (22% CAGR ‘25-’30) SiPho expected to be dominant tech

  12. Slide 12: Competitively Advantaged Material

    Competitively Advantaged Material LWLG EO polymers have inherently high performance and are fully Si-foundry compatible Thin Film Lithium Silicon Organic Silicon Photonics Niobate Hybrids (SiPh) (TFLN) (SiPh + EOP) Mach-Zehnder Modulator Type Ring MZ MZ or Ring (MZ) Speed Power Consumption Size Cost

  13. Slide 13: Reliability Performance Exceeds Industry Standard

    Reliability Performance Exceeds Industry Standard Material Reliability Challenges Addressed Device Reliability In Progress Temperature = 85 °C Humidity = 85%rh Data demonstrates LWLG EO polymer is Loss of Poling very stable at high temperatures (>>100yr projected lifetime at 85°C) Chromophore Data s

  14. Slide 14: The Product Design Process

    The Product Design Process 1 Perkinamine 2 3 4 Datacenter or AI Silicon Photonics PIC Integrated Optical EO Polymer (Photonics Integrated Circuit) Module Factory Representative Companies: © Lightwave Logic 2026. All Rights Reserved. 14

  15. Slide 15: Path to Commercialization & How We Scale

    Path to Commercialization & How We Scale Two Go-to-Market Channels Tailored Engagement Iterative Processes Commercial Revenue Model Chip Designers / Engagement with Chip Scalable, Asset- 1 Qualification 1 Material Sales Revenue Light Model Module Companies Designers ~20 Programs in Process Design an

  16. Slide 16: Market Reception & Customer Momentum Growing

    Market Reception & Customer Momentum Growing Now Five customers in Prototype Stage 3 Technology Prototype to Production Ramp to Product Design Selection Final Product High Volume Duration 3 – 6 months 3 – 6 months 12 – 18 months Total: 18 – 24 months Engagements ~20 in Early Stages of Pipeline 5 in

  17. Slide 17: Foundry Ecosystem is Broadening

    Foundry Ecosystem is Broadening Foundries are key enablers to integration and scaled production as well as IP licensing strategy 4 Foundry PDK Integrations Additional Projects + One unnamed partner Polymer platform integrated in foundry ecosystem; processes and designs are ready for 400Gb/s device d

  18. Slide 18: EO Polymer SOH MZI Slot Modulator Structure

    EO Polymer SOH MZI Slot Modulator Structure Polymer-coated regions MMI Splitter L Electrical signal Optical signal The SOH (Silicon-Organic Hybrid) Advantage: - Combines the maturity of Silicon Photonics with the strong EO response of polymers - Offers significant promise for scalable deployment in

  19. Slide 19: Silicon Slot Waveguide Cross Sections

    Silicon Slot Waveguide Cross Sections Collaborating with foundries to produce consistent slot waveguides for optimal performance 100 µm 500 nm 100 nm Clean, sharp and smooth Si slots for polymer deposition and encapsulation © Lightwave Logic 2026. All Rights Reserved. 19

  20. Slide 20: Strong Patent Portfolio

    Strong Patent Portfolio Patent protection on new, innovative EO chromophores and Materials molecular architectures to meet application needs such as high electro-optic activity and stability 67 granted; 80+ pending U.S. and international patents1 Patented device designs to engineered approaches to O

  21. Slide 21: Strong Management Team

    Strong Management Team Broad Operational and Research Expertise Across Photonics Ecosystem Dr. Aref Chowdhury Yves LeMaitre Fred Graffam Dr. Robert Blum Dr. Lance Thompson Chief Technology Officer & CEO & President Chief Financial Officer SVP, Sales & Marketing VP of Engineering Head of Strategy © L

  22. Slide 22: 2026 YTD Financials

    2026 YTD Financials YTD TOTAL REVENUE NET LOSS NET LOSS PER SHARE ($ thousands) ($ millions) ($) 2026 $62 $12.9 $0.09 +28% YoY +34% YoY +7% YoY FINANCIAL vs. $49 prior year vs. a loss of $9.7M prior year vs. a loss of $0.08 prior year RESULTS Added two Fortune Global 500 companies to Prototype Stage

  23. Slide 23: Outlook and Priorities for 2026

    Outlook and Priorities for 2026 1 Advance Stage 3 programs toward qualification milestones and Stage 4 2 Convert technical engagements into structured commercial agreements 3 Broaden and strengthen the EO polymer-ready silicon foundry ecosystem 4 Continue performance optimization at 200G, 400G per l

  24. Slide 24: Critical Inflection Point

    Critical Inflection Point Substantial investment in technology and production capabilities now intersecting with opportune entry point for electro-optic polymers as AI scaling reaches a critical bottleneck DURABLE DEMAND DRIVING SEMICONDUCTORS TAKING OPERATIONS READY TO SECULAR GROWTH OVER OPTICS EF

  25. Slide 25: Investment Highlights

    Investment Highlights Large and Attractive End Markets – Data Center/AI capacity growth supercycle and Telecom present $54B 1 modulator TAM, $2-4B SAM; future opportunities include Aerospace & Defense, Quantum Computing and Consumer Electronics Mission Critical Technology to AI scaling – Existing in

  26. Slide 26: Technical Support

    Technical Support © Lightwave Logic 2026. All Rights Reserved.

  27. Slide 27: Electro-Optic (EO) Polymer: Mechanism of Operation

    Electro-Optic (EO) Polymer: Mechanism of Operation Pockels Effect: General chromophore structure - Linear electro-optic effect with THz response frequency - Refractive index change directly proportional to applied electric field - Occurs in non-centrosymmetric materials Donor Bridge Acceptor Excited

  28. Slide 28: LWLG EO Polymers: Characteristics → Benefits

    LWLG EO Polymers: Characteristics → Benefits High electro-optic coefficient (r33 > 200 pm/V) → Low Vpp (low 𝑉𝜋 · L < 1 V mm) → Small, highly integratable devices (< 1mm) Easy integration with SiPh device fabrication → Leverages SiPh device eco-system → Low cost Intrinsic modulation speed in the…

  29. Slide 29: Key Modulator Technologies: Implementation Trends

    Key Modulator Technologies: Implementation Trends Relative Size of Modulators Expected Relative Cost SOH* $ 1X SOH1 1X + CW Laser3 SiPho $ $ $ $ 4X+ + EML Laser4 SiPho 2X+ TFLN $ $ $ $ $ $ 6X+ + EML Laser InP2 8X+ InP $ $ $ $ $ $ 12X+ + EML Laser TFLN 20X SiPho or TFLN ← Smaller footprint enables de

  30. Slide 30: Eye Diagram: Demonstration Results 1550nm

    Eye Diagram: Demonstration Results 1550nm In Pulse Amplitude Modulation 4-level (PAM4) signaling, an "open eye" refers to a clear, distinguishable eye diagram where signal transitions do not overlap, meaning data can be accurately read 100 Gbaud, 200 Gbit/s, Vpp = 0.8 V 120 Gbaud, 240 Gbit/s, Vpp =

  31. Slide 31: CMOS Compatible Process Flow

    CMOS Compatible Process Flow LWLG Backend/Encapsulation Process: Finished device ready Receive bare SiPho EOP coating and Encapsulation Poling for characterization wafer from foundry patterning and packaging 1 2 3 4 5 LWLG IP © Lightwave Logic 2026. All Rights Reserved. 31

  32. Slide 32: Thank you

    Thank you www.lightwavelogic.com Contact IR: Ross Collins or Nick Teves investor.relations@lightwavelogic.com +1 (312) 445-2870 © Lightwave Logic 2026. All Rights Reserved.

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