Kla Corporation · NASDAQ:KLAC
Kla — Nasdaq Investor Conference in Partnership with Jefferies 2024
27 slides from Kla's conference presentation, Jun 11, 2024
Slide 1: Advanced Packaging: A New Growth Engine for KLA
Advanced Packaging A New Growth Engine for KLA Oreste Donzella Executive Vice President, EPC Group KLA Corporation June 11, 2024
Slide 2: Forward Looking Statements
Forward Looking Statements Statem ents in this pr ese ntation othe r than historical facts, such as state ments per taining to: (i) futur e industry demand for se miconductors and WFE; (ii) our m ar ket position for the futur e and timing for the r esum ption of gr owth in de mand for our pr oducts;
Slide 3: KLA is a Diversified Leader and Critical Technology Enabler
KLA is a Diversified Leader and Critical Technology Enabler KLA at a Glance 1 (NASDAQ: KLAC) Global Technology Leader ~14,700 >65% PhD/Master ’s among Employees professional roles Global Market Share $9.7B 61.7% / 39.5% >4x CY23 Revenue Industry Leading Gross/Operating Nearest Competitor 2 -8% Y/Y G
Slide 4: KLA's Role in the Electronics Ecosystem
KLA’s Role in the Electronics Ecosystem WAFER-LEVEL PRINTED CIRCUIT CHIPS COMPONENTS PACKAGING BOARDS L o gi c | F o und r y M em or y S peci a l t y | Le ga cy CHEMICALS | WAFERS RETICLES SEMI OEMs IC SUBSTRATES MATERIALS END MARKETS Ar tificial Data Center 5 G Infr astr uctur e Mobile Automotive P
Slide 5: KLA Organizational Structure
KLA Organizational Structure Rick Wallace President and Chief Executive Officer E l e c t ro n i c s , Pa c ka gi n g S e m i co n du c to r K LA S e r vi c e s & C o m p o n e n ts ( E P C ) P ro c e s s Co nt ro l Oreste Donzella Ahmad Khan Brian Lorig Executive Vice President, President Executive
Slide 6: Semiconductor Key Market Drivers
Semiconductor Key Market Drivers
Slide 7: Semiconductor End Demand has Become More Diversified
Semiconductor End Demand has Become More Diversified 1,000 Semiconductor Revenue $B 750 AI Data 500 5G PCs PC + Mobile 250 0 2007 2016 2020 7 K L A N o n - C o n f i d e n ti a l | U n r e s t r i c t e d Sources: KLA Analysis, TechInsights Sept 2023
Slide 8: AI: The New Driver of the Semiconductor Industry
AI: The New Driver of the Semiconductor Industry M40 B100 GPU Package 2 reticle-sized chips CoWoS package 12 x 1 GB 192 GB: 8x24 GB GDDR5 chips HBM3e chips Image source: Nvidia K40 M40 P100 V100 A100 H100 B100 Year 2013 2015 2016 2017 2020 2022 2024 Area (mm 2) 551 601 610 815 826 814 ~2x800 Transis
Slide 9: AI: Driving Industry Momentum | Semiconductor Content
AI: Driving Industry Momentum | Semiconductor Content AI Drives End Markets AI Requires Advanced Process Control GPU Leading-edge logic: ≤3nm design nodes and advanced transistor architectures Large die size: ≥800mm 2 Increased design starts HPC Memory Multiple HBM chips / GPU ~2.2x more m
Slide 10: Semiconductor Technology Roadmap
Semiconductor Technology Roadmap
Slide 11: Semiconductor Technology has Been Scaling for 50+ Years
Semiconductor Technology has Been Scaling for 50+ Years 1980 1990 2000 2010 2020 g-line (436nm) i-line (365nm) KrF (248nm) ArF (193nm) ArF Immersion (193i) EUV (13.5nm) 3nm 5nm 7nm 10nm 16nm 32nm 65nm 130nm 500nm 250nm 1μm 11 K L A N o n - C o n f i d e n ti a l | U n r e s t r i c t e d
Slide 12: Scaling is Now Evolving Through Diversified Technology Innovations
Scaling is Now Evolving Through Diversified Technology Innovations Pa c ka g i n g L i t h o g ra p hy Tra n s i sto r Po we r D i st r i b u t i o n H ete ro ge n e o us S ca l i n g A rc hi te c tu re D e s i g ns Inte gra t i o n Tra d i t i o n a l a re a s o f “ M o o re ’s L aw ” i nn o va t i
Slide 13: Transition to High-NA EUV Requires Tighter Qualification and Control
Transition to High-NA EUV Requires Tighter Qualification and Control ArF Immersion (193i) EUV (13.5nm) Ke y a dva nt a ge s fo r hi gh- N A E U V E ve n s m a l l e r fe a t u r e s a n d h i g h e r density I n c r e a s e d p a t t e r n u n i fo r m i t y EUV High-NA EUV I m p r o ve d p r
Slide 14: Shift to GAA Brings Defectivity and Variability Challenges
Shift to GAA Brings Defectivity and Variability Challenges Ke y a dva nt a g e s fo r G A A (G a te -A l l -A ro u n d ) Lower leakage current H i g h e r t ra n s i s t o r d e n s i t y GAA FinFET I n c r e a s e d e f fe c t i ve c h a n n e l a r e a R e d u c e t r a n s i s t o r va r
Slide 15: Backside Distribution Network Saves Space and Increases Performance
Backside Distribution Network Saves Space and Increases Performance Power via Frontside BEOL Fa c e -d o w n w afe r Via reveal, backside formation in FEOL (co nventio nal ) bonding then thinning BEOL and bumping Challenges Challenges Challenges Challenges Power via alignment Bonding film quality Lo
Slide 16: Advanced Packaging Shifting to Heterogeneous Integration
Advanced Packaging Shifting to Heterogeneous Integration Ke y a dva nt a ge s fo r h ete ro ge n e o us i nte gra t i o n H i g h e r p e r fo r m a n c e AMD Instinct MI300 NVidia H100 Tensor GPU Accelerators Core GPU Lower latency Source: AMD Source: NVidia Lower power L o w e r c o st Mon
Slide 17: Heterogenous Integration at the Package Level
Heterogenous Integration at the Package Level Lo w B a n dw i d t h W i d e I/ O H i g h Ba n dw i d t h U l t ra - H i g h B a n dw i d t h 2.5D 2D Fan-out RDL 3D Stacking (Interposer or ( Wa fe r o r P a n e l ) ( mB u m p o r H y b r i d B o n d i n g ) Bridge) CPU/GPU Mobile CPU/GPU ASIC CPU/GPU
Slide 18: Key Trends in 2.5D Packaging (e.g., CoWoS)
Key Trends in 2.5D Packaging (e.g., CoWoS) Silicon interposer 0.4µm 0.2µm Late ra l I nte rco nn e c t Li n e / S pa c e RDL 2µm Die to interposer 25µm 15µm Ve r ti ca l I nte rco n ne c t P i tc he s I n t e r p o s e r t o s u b st r a t e 90µm 70µm I n t e r p o s e r s i ze 45mm 90mm Int
Slide 19: Key Trends in 3D Packaging (e.g., Foveros Direct, SoIC)
Key Trends in 3D Packaging (e.g., Foveros Direct, SoIC) D2W hybrid bonding 9µm 3µm B o n di n g Inte rco n n e c t s µBump 25µm 10-15µm Silicon TSV 9µm 3µm Chiplet 1 Chiplet 2 Chiplet 3 Ve r ti ca l Inte rco n n e c t s TDV 100µm 50µm Chiplet A Chiplet B Gap fill 20-40µm 70-80µm IC Substra
Slide 20: 2.5D and 3D Packaging Challenges
2.5D and 3D Packaging Challenges S i l i con Chiplet 1 Chiplet 2 Chiplet 3 Chiplet A Chiplet B IC Su bstrate 2 . 5 D Ch a l l e n ge s 3 D Ch a l l e n ge s Wa fe r t h i n n i n g Wa fe r a n d d i e t h i n n i n g UBM contact resistance O x i d e ga p f i l l P ro c e s s RDL barrier se
Slide 21: IC Substrates Roadmap is Essential to Heterogenous Integration
IC Substrates Roadmap is Essential to Heterogenous Integration Shrinking feature sizes Increase in number of layers Large r packa ge size Thinne r laminates glass New materials 21 K L A N o n - C o n f i d e n ti a l | U n r e s t r i c t e d
Slide 22: KLA in Packaging
AL/ i KLA in Packaging
Slide 23: Differentiated and Diversified Product Portfolio
Differentiated and Diversified Product Portfolio Process packaging plasma etch, plasma dicing, PECVD direct imaging, automated optical front end and PVD for wafers shaping for IC substrates semiconductor Inspection IC su b st rates inspection solutions and analytics for wafer-level packaging, compon
Slide 24: Data Automation and Analytics Solutions
Data Automation and Analytics Solutions Data Sources Metrology Inspection Process Tools Connected Data Centralization and Applications Bringing data analytical capabilities from front end to 5D Analyzer® Klarity® 3D packaging is critical for yield m etr ology modeling & contr ol defect & yield manag
Slide 25: Advanced Packaging: A New Growth Engine for KLA
Advanced Packaging: A New Growth Engine for KLA ~25% ~5x >50 >50 KLA Packaging System KLA Wafer Packaging System New Product Projects With Top 5 Revenue CAGR1 Revenue in 2 Years Penetration2 Semi Customers3 KLA Packaging Revenue including IC Substrate Semi PC $450 - 500M EPC M&A (ICOS | SPTS | Orbot
Slide 26: Summary: Key Points
Summary : 5 Key Points 1. The semiconductor technology roadmap is evolving with innovation beyond traditional geometrical scaling 2. Heterogeneous integration is key to ena bling overall system performa nce at lower costs 3. Many packaging technolog ies are emerging to support higher interconnect de
Slide 27: Growth Inflections R&D Competition
Growth Inflections R&D Competition 27 K L A N o n - C o n f i d e n ti a l | U n r e s t r i c t e d
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