ASML Holding NV · EURONEXT:ASML
ASML Holding NV — 2010 UBS Global Technology and Services Conference
27 slides from ASML Holding NV's conference presentation, Jun 8, 2010
Slide 1: 2010 UBS Global Technology and Services Conference
2010 UBS Global Technology and Services Conference Eric Meurice CEO New York, New York June 8, 2010 / Slide 1 Public
Slide 2: Safe Harbor
Safe Harbor "Safe Harbor" Statement under the US Private Securities Litigation Reform Act of 1995: the matters discussed in this document may include forward-looking statements, including statements made about our outlook, realization of backlog, IC unit demand, financial results, average selling pr
Slide 3: Agenda
Agenda ASML Overview Short Term Business overview Future trends ASML Trajectory / Slide 3 Public
Slide 4: ASML Overview
ASML Overview / Slide 4 Public
Slide 5: ASML: Leading supplier of lithography equipment to the semiconductor industry
ASML : Leading supplier of lithography equipment to the semiconductor industry Headquarters: Veldhoven, The Netherlands Market Cap approx € 10 B / Slide 5 Public
Slide 6: ASML's historic market share growth
ASML’s historic market share growth 7,000 70% 70% WW M$ 6,000 60% ASML Revenue Market Share [%] ASML market share World Wide Market [M USD] 60% 5,000 50% 50% 4,000 40% 40% 3,000 30% 30% 2,000 20% 20% 1,000 10% 10% 0 0% 0% 1990 2000 1991 1994 1995 1998 1999 2002 2003 1980 1981 1982 1983 1984 1985 198
Slide 7: Commitment to innovation requires a strong player
Commitment to innovation requires a strong player Source: ASML worldwide investments, Zeiss SMT / Slide 7 Public
Slide 8: Short Term Business overview
Short Term Business overview / Slide 8 Public
Slide 9: Favorable analyst semiconductor growth outlook for 2010
A favorable analyst’s semiconductor growth outlook for 2010 now at 23.2% 2010 Semiconductor revenue growth forecast over time 35% YoY Semiconductor revenue growth Increased forecasts mainly driven by Future Horizons 30% more stable IC ASPs. IC unit growth over 15% questionable, due to limited SIA ca
Slide 10: Fab Equipment Capex in catch up mode
Fab Equipment Capex in “catch up” mode 10,000.0 30% DQ W FE 9,000.0 Litho % of W F E Semi Wafer Fab Equipment Market ( M USD) A S M L% of W F E 25% 8,000.0 7,000.0 20% 6,000.0 % of WFE 5,000.0 15% 4,000.0 10% 3,000.0 2,000.0 5% 1,000.0 0.0 0% 1Q 4 4Q 6 1Q 7 3Q 8 4Q 9 2Q 4 3Q 4 4Q 4 2Q 5 3Q 5 4Q 5 1Q
Slide 11: Net sales
Total net sales M€ ASML *guidance Analysts Estimates 2010 for Q2 2010 4500 3,768 3,970 4000 3,582 3500 2,954 2,529 955 3000 2,465 1053 494 Q4 Net sales 2500 1,596 Q3 1,543 934 548 785 697 2000 958 Q2 533 1500 Q1 611 930 844 526 581 1000 763 942 1000 370 616 555 500 329 949 919 685 629 277 742 318 45
Slide 12: Litho layer stacks per sector
Litho layer stacks per sector DRAM NVM I-line KrF ArF ArFi EUVL I-line KrF ArF ArFi EUVL 50 40 45 35 5 40 1 1 1 1 1 4 30 5 9 11 9 9 7 7 Exposures 35 4 4 6 6 6 6 5 3 Exposures 7 7 9 25 4 4 3 6 7 2 2 3 3 3 3 3 3 3 30 9 5 5 5 5 5 11 12 25 4 4 4 5 5 20 10 9 13 13 13 8 11 11 12 12 12 15 12 13 13 13 13 13
Slide 13: IC unit distribution over time
IC unit distribution over time Litho Layers grow with each node transition DRAM node distribution NAND - FG/ReRAM node distribution 80% 70% 70% 60% 60% 18nm 19nm ReRAM 22nm 50% 12nm FG 50% 25nm 15nm FG % of Units 28nm 40% % of Units 18nm FG 40% 32nm 20nm FG 38nm 22nm FG 45nm 30% 30% 28nm FG 55nm 35n
Slide 14: DRAM industry wafer production capacity
DRAM industry wafer production capacity Shrink drives large litho Capex without significant wafer capacity additions due to increased number of litho passes DRAM WW Monthly Wafer Production Split by Node 2000 1XX nm -200mm 9x nm -200 mm 8x nm -200 mm 9x nm 8x nm 1800 6x nm 5x nm 4x nm 3x nm 2x nm Wa
Slide 15: NAND industry wafer production capacity
NAND industry wafer production capacity Shrink drives litho Capex without significant wafer capacity additions due to increased number of litho passes NAND WW Monthly Wafer Starts Split by Node and Utilization 1400 7x-200 mm 6x-200 mm 5x-200 mm 7x nm 6x nm 5x nm 4x nm 3x nm 2x nm 1x nm Wafer Starts
Slide 16: Under-investment in advanced logic capacity requires structural catch up
LOGIC World-wide under-investment in advanced logic capacity requires a structural catch up Logic (including Micro) & Analog IDMs: overview of INTERNAL manufacturing capability by technology node 130 nm 90 nm 65 nm 45 nm 32 nm 28/22 nm Intel Intel Intel Intel Intel Intel AMD AMD AMD AMD IBM STM IBM
Slide 17: Future trends
Future trends / Slide 17 Public
Slide 18: A large technology driver until 2020
A large technology driver until 2020 Source: Morgan Stanley (12/09) / Slide 18 Public
Slide 19: IC segment roadmaps – sustained aggressive pace
IC segment roadmaps – sustained aggressive pace ASML supports shrink roadmap 200 Logic DRAM NAND Resolution/half pitch, "Shrink" [nm] 100 80 ARF 2 years/node AT:1200 60 XT:1400 50 XT:1700i 40 ARFi 1 year/node XT:1900i 30 NXT:1950i 18 months/node NXE:3100 20 EUV NXE:3300 ’02 ’03 ’04 ’05 ’06 ’07 ’08 ’
Slide 20: Customer lithography roadmap by sector
Customer lithography roadmap by sector DRAM NAND MPU LOGIC Node Node Node = HP [nm ] Node = HP [nm ] YEAR / HP [nm ] / HP [nm ] 2007 65 55 45 / 80 2008 55 42 45 / 70 2009 52 35 32 / 60 40 / 70 2010 45 28 32 / 50 2011 38 22 22 / 40 28 / 50 2012 32 20 2013 28 18 15 / 30 22 / 35 DPT 2014 25 15 2015 22
Slide 21: Technology Leadership - Reinforced
Technology Leadership - Reinforced Immersion Lithography: - Installed Base >160 Systems - leading performance on CD imaging uniformity well below 1 nm and overlay of less than 2 nm - 28 systems in backlog end Q1 ’10 - More than 10 NXT installed and producing NXT:1950i EUV: - 6 systems shipping thru
Slide 22: Holistic Litho: A requirement to enable next nodes
Holistic Litho: A requirement to enable next nodes Process Window Process Control Pre-production: enlarges the process window further and earlier through pattern optimization and scanner tuning Production: ensures that the process stays in the “sweet spot” of the process window maximized for the spe
Slide 23: Summary
Summary / Slide 23 Public
Slide 24: 2010 short-term outlook
2010 short-term outlook Q2 Net sales expected around € 1 billion Q2 bookings are expected at similar level as in Q1 2010 (€ 1,004 M) We expect this cycle to be sustained by the normal technology transitions of the early adopters, the subsequent technology conversions by second tier DRAM makers, the
Slide 25: ASML Strategy
ASML Strategy Continue the large R&D outlay to ensure leadership and provide customers with enabling technologies Improve profitability further by: Improving product mix towards value added software support tools Keeping fixed cost structure to a low break even point, while growing top line Improvin
Slide 26: ASML Trajectory
ASML Trajectory ASML confirms its leadership in offering lithography technology that enables the industry's shrink roadmaps and therefore makes ASML the partner of choice for all leading Semiconductor manufacturers ASML confirms that it has the appropriate size and know how to continue leading the i
Slide 27: Public
/ Slide 27 Public
ASML — 2010 UBS Global Technology and Services Conference on 6ix