Canon Inc. · TSE:7751
Canon — Investor Day (September 2024)
18 slides from Canon's investor day presentation, Sep 10, 2024
Slide 1: Industrial Group Business Strategy Conference
Industrial Group Business Strategy Conference Hiroaki Takeishi Head of Industrial Group September 10, 2024
Slide 2: Canon Group Businesses
Canon Group Businesses Industrial Printing 2023 Net Sales 4,181 Billion yen Medical Imaging 2
Slide 3: Industrial Group
Industrial Industrial Group Group Optical Products Operations (Utsunomiya, Ami) Canon Tokki (Niigata Pref.) Industrial Canon ANELVA (Kanagawa Pref) Canon Machinery (Shiga Pref.) Other related companies and divisions Core Products Semiconductor Lithography Equip. Semiconductor Mfg. Equip. FPD Lithogr
Slide 4: Optical Products Operations W/W Sites
Optical Products Operations W/W Sites CSEK CENV CIE Canon Inc. CUSA、CNT CSET CSPL CUSA :Canon USA CNT :Canon Nanotechnologies CENV :Canon Europa N.V CIE :Canon Optical Industrial Equipment (Shanghai) Inc. CSET :Canon Semiconductor Equipment Taiwan Inc. CSEK :Canon Semiconductor Engineering Korea CSP
Slide 5: Sites in Japan and Major Products being Produced
Optical Products Operations Sites in Japan and Major Products being Produced ① Lithography equip. production 【KrF】【NIL】【FPD】 ② Processing ＆ assembly of units 【Customer Support】 ③ Industrial equip. & Mirror processing for astrology Semiconductor equip. FE sites Yokkaichi, Mie 【Admin.】【Production】【R&D
Slide 6: Optical Products Operations - Products
Optical Products Operations - Products Products i-line Lithography Equip. KrF Lithography Equip. Nanoimprint Lithography Semiconductor Lithography Equipment FPA-5520iV-LF FPA-5550iZ2 FPA-3030i5a FPA-6300ES6a FPA-6300ESW FPA-3030EX6 FPA-1200NZ2C G6 Lithography Equip. G8 Lithography Equip. Display Man
Slide 7: Semiconductor Business Industrial Group Products
Semiconductor Business Industrial Group Products Semiconductor device manufacturing process (Abstract) Wafer Expose Expose Deposit Coat Develop Etch Cut Bond Inspect (Front-end) (Back-end) Semiconductor device Canon ANELVA Optical Products Operations Optical Products Canon ANELVA Canon Machinery Can
Slide 8: Semiconductor Lithography Equip. Production Process
Semiconductor Lithography Equip. Production Process Lithography Equip. Production Process ① Parts processing ② Unit assembly ③ Body assembly ④ Packing & Shipping ⑤ Installation 8
Slide 9: Semiconductor Lithography Equip. Composition
Semiconductor Lithography Equip. Composition Reticle stage The circuit pattern drawn on the original reticle is reduced through a projection lens and exposed to the target position on the wafer without error (an ultra-precise and huge camera) Illumination optics system Projection optical system Ligh
Slide 10: Semiconductor Lithography Equip. Product Lineup
Semiconductor Lithography Equip. Product Lineup Data centers/AI chips Vehicles/Industrial equip. Autonomous vehicles/AI chips Smartphones/PCs Memory Logic CPU Image Sensor RF/MEMS Power/LED Packaging GPU Diversity (Front-end to back-end processes) i-Line Fine Pattern FPA-5550iZ2 FPA-5550iX FPA-3030i
Slide 11: Enhance Production Capacity, Constructing New Facility
Enhance Production Capacity, Constructing New Facility Semiconductor Lithography Equip. Unit Sales New factory image Site area： Approx. 70,000㎡ 244 187 176 140 122 New factory (Concept) 84 Automation On-site logistics, skilled work Optimization Centralized management of production information Enviro
Slide 12: Diversity i-Line Lithography Equip. (Front-end and Back-end Processes)
Diversity i-Line Lithography Equip. (Front-end and Back-end Processes)
Slide 13: Diversity in plates: From 2 in. to 500mm
Diversity in plates: From 2 in. to 500mm 515x510mm glass plates AI Chip Power Devices/ Devices used in Communication Power Devices Analog/ Vehicles Devices Vehicle Sensors LEDs 12 in. 12 in. FOWLP Silicon Si interposer SSDs for servers DRAM、HBM AI Chip 8 in. 8 in. SiC Silicon Lasers 6 in. Headlights
Slide 14: i-Line Lithography Equip. – Responding to Diverse Needs
i-Line Lithography Equip. – Responding to Diverse Needs Specifications Product Diverse Needs Characteristics Resolution Exposure area Plate size Front-end process, • High resolution & overlay High resolution 0.35um 26x33mm 12inch Memory accuracy (NA0.57, 1/4x) CIS • High productivity – 250 or more 5
Slide 15: Device (GPU) for Generative AI
Device (GPU) for Generative AI FPA-5520iV LF Multiple silicon chips • Exposure area: 52×68mm connected by wiring on an 52mm adapter plate • Resolution: 1μｍ Memory Memory Memory Processor Memory Memory Processor Memory Memory 68mm Processor Memory Memory Memory Memory Memory Processor Memory Memory A
Slide 16: Fine Pattern NIL: Nanoimprint Lithography
Fine Pattern NIL：Nanoimprint Lithography
Slide 17: Nanoimprint Lithography (NIL)
Nanoimprint Lithography (NIL) ✓ Circuit patterns formed using stamp principle (Shown below) ✓ World’s first practical application for advanced semiconductor processes FPA-1200NZ2C ✓ Simple manufacturing process (Low cost via low power consumption) ✓ Applicable to fine optical elements other than sem
Slide 18: Application of NIL to Diverse Production Processes
Application of NIL to Diverse Production Processes Optical Elements 3D-NAND Logic DRAM 3D-NAND DRAM Logic Meta Lens Hole/Dual damascene Hole/ForkChop BEOL ✓ Utilizing strengths & characteristics of NIL, promote application in various production processes Note: SEM images are supplied by Canon and co