Acm Research, Inc. · NASDAQ:ACMR

Acm Research — Investor Presentation (August 2022)

20 slides from Acm Research's investor presentation, August 2022

  1. Slide 1: Advanced Production Tools for Leading Edge IC Fabs

    ADVANCED PRODUCTION TOOLS FOR LEADING EDGE IC FABS Industry’s most advanced wafer cleaning technologies Aug 2022 1

  2. Slide 2: Disclosures

    DISCLOSURES Forward-Looking Statements. Information presented below under “Production Facilities” with respect to expected timing of production commencement, “Innovative Product Introductions Expanding SAM” with respect to estimates regarding ACM Research’s serviceable available market (SAM),“ “Inte

  3. Slide 3: ACM Research at a Glance

    ACM Research at a Glance • Best-in-class multi-product semiconductor capital Cleaning equipment supplier to leading global semiconductor Flagship (SAPS, TEBO, Tahoe) Semi-Critical manufacturers • Differentiated technology improves customer production processes with better yields and reduced chemical

  4. Slide 4: Financial Highlights

    Financial Highlights Total Revenue Product Mix Cleaning ECP, Furnace & Other Advanced Packaging & Other +63% CAGR 14% 8% 13% 8% 9% 7% 84% 84% 73% FY17 FY18 FY19 FY20 FY21 FY19 FY20 FY21 $108M $157M $260M 1. Cleaning: Single wafer cleaning, Tahoe and semi-critical cleaning equipment 2. ECP, Furnace &

  5. Slide 5: History of Innovation and Customer Design Wins

    History of Innovation and Customer Design Wins 4 evaluation Dr. Wang SK Hynix Opens 2nd Launches SFP, agreements with establishes SK Hynix places first production facility Ships Tahoe & furnace and major industry ACM Research SAPs major YMTC, SMIC, and Ships TEBO in Chuansha, ECP eval tools semi-cri

  6. Slide 6: Global Semiconductor Capital Equipment Supplier

    Global Semiconductor Capital Equipment Supplier ACM Shanghai ACM Research R&D and Manufacturing Center Headquarters NASDAQ: ACMR Shanghai R&D Center (Zhangjiang) Shanghai Asia-Pacific Manufacturing ACM South Korea Center >200,000 ft2 (Chuansha) Research Institute & Manufacturing Center Planned >1.4

  7. Slide 7: Tier 1 Customer Base

    Tier 1 Customer Base Front-End Customers Back-End Customers • Major new entrant into NAND flash and • Leading advanced foundry in China • Global market leader in memory (DRAM & • Largest bumping house in China and DRAM industry • Manages first fully automated 300mm NAND) semiconductor products leadi

  8. Slide 8: Established Customer Base in Asia and Expanding Internationally

    Established Customer Base in Asia and Expanding Internationally Beijing South Korea Shandong Jiangsu Shanghai Zhejiang Anhui Sichuan Taiwan Fujian Guangdong Philippines Hubei 8

  9. Slide 9: Production Facilities

    Production Facilities Facility #1 (Shanghai HQ) Facility #2 (Chuansha Production) Lingang Under Construction • Original ACM Research factory, Zhangjiang • Located in Chuansha area of Pudong district, • Broke ground on the new R&D and Shanghai approximately 11 miles from ACM Shanghai’s production fac

  10. Slide 10: Well-Positioned to Participate in Asia Fab Expansion

    Well-Positioned to Participate in Asia Fab Expansion Semiconductor Industry Development New Facilities and Production Lines Industry Center Shifts through the Decades(1) China is projected to grow at a 4% CAGR(2) Starting Operation (2017-2020)(1) ($ in billions) Europe & ME Present to Country / Esti

  11. Slide 11: Innovative Product Introductions Expanding SAM

    Innovative Product Introductions Expanding SAM1 Double Estimated SAM of $8 2 New 2022 Product Current billion addressed by Categories SAM ACM Research’s current and near-term product portfolio 2020: Furnace, ACM Research targets LPCVD, Vacuum Anneal, High- Furnace | $2.9B to double its SAM with Temp

  12. Slide 12: Internal Longer-Term Target for $1B in Revenue

    Internal Longer-Term Target for $1B in Revenue Advanced Packaging & Other >$1,000M* Longer Term Target Composition ECP, Furnace & Other By Geography and Product Category Cleaning ACM Research 1 Mainland China SAM Share Revenue Cleaning $0.9B 50% $0.5B ECP $0.3B 50% $0.2B Furnace $0.8B 30% $0.2B Ad.

  13. Slide 13: Growth Strategy

    Growth Strategy 111 111 111 New Products New Customers New Capacity M&A • Next generation TEBO, Tahoe and • Dedicated sales teams in U.S., Europe • Targeting to reach $625 million of • Use disciplined M&A approach to other new products expand SAM in and other Asia capacity by end of 2022 with existi

  14. Slide 14: Q2 2022 Revenue Details

    Q2 Q12022 2022Revenue DetailsDetails Revenue Product Category1,2,3 Cleaning • $72.6M revenue (up 60%) $146.6 10% Advanced Packaging & Other • Revenue mix 70% vs. 84% $104.4M 22% ECP, Furnace & Other +94% ECP, Furnace & Other 11% • $20.5M revenue (vs. nil last year) 20% • Revenue mix 20% $53.9M 16% 0

  15. Slide 15: Q2 2022 Financial Results

    Q2 Q12022 2022Financial ResultsResults Financial Revenue Non-GAAP Gross Profit +93.8% +103.7% 42.4% 40.5% Q2‘21 Q2’22 Q2‘21 Q2’22 EPS Balance Sheet Data1 GAAP Non-GAAP Finished goods inventory Ending cash & cash equivalents 2 $92M Q2’21 Q2’22 Q2’21 Q2’22 Q2’21 Q3’21 Q4’21 Q1’22 Q2’22 1 Finished good

  16. Slide 16: Wafer Cleaning

    Wafer Cleaning Flagship Cleaning Tools SAPS TEBO Ultra – C Tahoe Bevel Etch Single high tem SPM Megasonic Cleaning for Bubble Oscillation Cleaning for Patterned Hybrid Wafer Cleaning With Significant Bevel Etching process for 3D NAND , Single High Temp SPM Cleaning for metal Flat and Patterned Wafer

  17. Slide 17: Electroplating

    Electroplating Ultra ECP ap Model Ultra ECP map Ultra ECP 3D Ultra ECP ap Ultra ECP GIII (Cu-Ni-SnAg-Au) Dual-damascene plating Pillar bump, Solder bump, High-density Fan Out RF product Application 3D/2.5D high aspect ratio TSV (90nm-28nm) RDL, Conformal TSV Fine Pitch RDL 150mm wafer-level packagin

  18. Slide 18: Vertical Furnace

    Vertical Furnace Ox Ion Metal Mask Photo Exposure Develop Etch CVD ALD /Anneal Implantation Wire Furnace Tube Temperature Existing ACM In Film Type Process Classification Range Research Product Development Oxidation Wet oxygen/dry 700~1200℃ ★ Normal Pressure Annealing oxygen/nitrogen annealing Chemi

  19. Slide 19: Advanced Packaging

    Advanced Packaging Comprehensive solution for wafer-level advanced packaging wet process Scrubber Coater Developer ECP • Make use of ACM Research’s technology advantages to expand application in Asia, especially advanced packaging manufacturers in China • Dedicated to providing diversified and custo

  20. Slide 20: Q2 2022 GAAP to Non-GAAP Reconciliation

    Q2 2022 GAAP to Non-GAAP Reconciliation Three Months Ended June 30, 2022 2021 Actual Other non- Adjusted Actual Other non- Adjusted SBC operating SBC operating (GAAP) adjustments (Non-GAAP) (GAAP) adjustments (Non-GAAP) (In thousands) Revenue $ 104,395 $ - $ - $ 104,395 $ 53,864 $ - $ - $ 53,864 Cos

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