Nano Dimension Ltd · NASDAQ:NNDM

Nano Dimension — Investor Presentation (February 2020)

42 slides from Nano Dimension's investor presentation, Feb 24, 2020

1. Slide 1: Nano Dimension: Electrifying Additive Manufacturing

   Reais RARE NANODIMENSION Electrifying Additive Manufacturing” Nano Dimension is a Developer & Provider of Tale| & for the Fabrication of dditively Manufactured Electronics ( ) February 2020 Nasdaq/TASE: NNDM www.nano-di.com

2. Slide 2: Forward Looking Statements

   Forward Looking Statements This presentation of Nano Dimension Ltd. (the “Company”) contains “forward-looking statements” within the meaning of the Private Securities Litigation Reform Act and other securities laws. Words such as “expects,” “anticipates,” “intends,” “plans,” “believes,” “seeks,” “es

3. Slide 3: AME Machines and Consumable Materials (Polymers & Silver)

   Nano Dimension - Ame Machines and Consumable Materials (Polymers & Silver) https://www.youtube.com/watch?v=UFaWbOaUjPk&list=PLW7YO0iIWnWhTShewSmy657p-OGnD2lotVr High Performance Electronic Devices: Hi-PEDs Fabricated the AME Machines (“3D-Printers”) AME Machines (Printers) apes Using Nano-Particles-

4. Slide 4: Financial Data

   Financial Data Nasdaq / TASE NNDM ADS ratio: 1:50 Shares outstanding 212.5M 4.25M ADS* * As of January 30, 2020 Mi ae INNANODIMENSION TASDAG/TASENOM Revenues 2017: $0.8M 2018: $5.1M 2019: $7.1M Revenue growth of 39% compared to previous year $70M invested mostly in R&D, over 5 years Cash, Dec 31, 20

5. Slide 5: Business Model: Recurring Revenue Model that Scales

   BUSINESS MODEL: Recurring Revenue Model that Scales Razor and blades model: As the installed base of systems grows, the recurring revenues from consumables increases. Positive trend of increased ink consumption by customers is a validation to our recurring- revenue business model. =D INNANODIMENSION

6. Slide 6: New USA Management for Nano Dimension

   New USA Management for Nano Dimension Yoav Stern — Incoming President & CEO Investor and Chairman Cyber, Fintec and Mobile/Visual Tech (USA). President & CEO DVTEL Inc. (Sold to FLIR Systems) (NJ, London, Tel Aviv, New Delhi, Adelaide, Singapore, Hong Kong, Taiwan). A turn-around executive in the Ho

7. Slide 7: Management — Industry Background (1)

   Management — Industry Background (1) ¢ Ofir Baharav — Chairman. A Leader of HW and SW companies in Semiconductors, 3D Printing, PC Security, Healthcare Informatics and Digital Print. Lived and conducted business in Shanghai. Partner Stratus Venture Group, VP Product Portfolio Stratasys, Founder And

8. Slide 8: Management — Industry Background (2)

   Management — Industry Background (2) * Amit Dror—CCSO, Co-Founder. EC! Telecom Ltd., Comverse Technology, Inc., Eternegy Ltd. ¢ Dr. Ram - VP R&D. Physical Chemist, Post Doctoral in Chemistry and Biochemistry, and an MBA. Head of R&D in Medinol, developing in vivo medica! equipment. * Yael Sandler —

9. Slide 9: Market for High Performance Electronic Devices (Hi-PEDs)

   ~ Ah Market for High Hi-PEDs Necessitate Fast time-to-market Performa nce e IP safety (in-house s . rapid prototyping and production) Electronic Devices « iterative development “uy j-PE Ds” * Device performance gains * Control of fabrication facilities (Defense & Homeland Security Industries) Yet, H

10. Slide 10: The Challenge: Bridging The Gap

    The Challenge: Bridging The Gap Nano Dimension’s AME Machines & Inks: Design > Proof of Concepts > Prototype & Short-Run Fabrication of Integrated-PCB (Additively Manufactured Circuit Boards) Additively Manufactured Electronics (AME) Traditional Traditional Integrated Printed Circuit Circuits Boards

11. Slide 11: Cutting-Edge Applications

    Cutting-Edge Applications Breakthrough innovations enable applications never additively manufactured before: Packaging vertically integrated circuits Built-in battery DC to DC PCB side- Sensors: socket converter contact touch, torque, strain gauge Produced in a single step, by converting digital fil

12. Slide 12: Typical High-Performance Electronic Devices (Hi-PED)

    Typical High-Performance Electronic Devices (“Hi-PED”) NASDAQ TASE:NNOM 12 RF antennas Applications: Communications, cell phones, radar, loT Market size: $21B in 2019, 6.9% CAGR by 2025 Segment leaders: Murata, Cobham, Antcom Their challenge: Weight BGA component support Specialized Technological ca

13. Slide 13: The Problem: New Electronic Applications Create The Gap

    The Problem: New Electronic Applications Create “The Gap” Between: Integrated Circuits Printed Circuits Boards High performance miniaturized Electrical-Circuits- Lower performance Printed circuit boards (“PCB”) that Devices (“Chips”, “IC”) that are extremely costly to are costly to develop through p

14. Slide 14: Economic Models of Present Fabrication Technologies Fail to Meet Market Needs

    Economic Models of Present Fabrication Technologies Fail to Meet Market Needs Both IC and PCB fabrication technologies fail to meet today’s primary needs: a. IP security is compromised: IC and PCB fabs are too expensive to own in house Integrated Circuit (Ic, “Chips”) Printed Circuit Boards (PCB) b.

15. Slide 15: The Challenge: Bridging The Gap

    The Challenge: Bridging The Gap Traditional Traditional Integrated Printed Circuit Circuits Boards (PCB) (IC, Chips, CPU, ASICs) NASDAQ TASE:NNOM 15 ‘wvwcnane-dicom | © 2019 Nano!

16. Slide 16: A Rapidly Growing Market for High Performance Electronic Devices

    A Rapidly Growing Market for High Performance Electronic Devices (Hi-PEDs) High Performance Electronic Devices (Hi-PEDs) are integral enablers of: RESEARCH INSTITUTES INDUSTRY VERTICALS ADDITIVE SERVICES * Academic institutions and * Defense * Additive universities ° Aerospace Service * Research & i

17. Slide 17: 2019 Vs. 2018 Sales Breakdown - per Industry

    2019 Vs. 2018 Sales Breakdown - per Industry 2018 Defense Resellers / 30% 40% \ i 6% Research/Unive \Tech/PCB 17% 7% aes INNANODIMENSION TASDAG/TASESNOM gy In number of systems 2019 Resellers 15% Research/U niv. 26% 1 Defense j 41% CB 18%

18. Slide 18: 2019 Vs. 2018 Sales Breakdown - per Region

    2019 Vs. 2018 Sales Breakdown - per Region 2018 2019 30 systems in 2018 27 systems in 2019 INNANODIMENSION TUSDAG/TASENEM 9 swysenano-dicom | © 2039 Nano llrightsreserved.

19. Slide 19: Worldwide Reach and Expansion

    Worldwide Reach and Expansion co] Distributors ce] Customers (e] Headquarters Sais NANODIMENSION NASDAQ TASE:NNOM 19 Footprint As of December 2019 llrightsreserved.

20. Slide 20: First Mover, Advantage and Timing

    Nano Dimension: First Mover, Advantage and Timing Analysts predict 3D printed electronics will be the next high-growth application for product innovation: 2017 3D printed electronics market size is estimated at $176 million, expected to reach $592 million in 2021 and up to $2.4 billion by 2025* =D I

21. Slide 21: Evolution of Nano Dimension

    Evolution of Nano Dimension DragonFly™ LDM DragonFly™ Pro Add materials with new applications Deliver hybridized capabilities that combine mechanical functionality within electrified geometries DragonFly™ Fast Prototyping and Low Volume Production Basic Testing Early Adopters August 2019 =D INNANODI

22. Slide 22: Evolution of Nano Dimension

    Evolution of Nano Dimension Functional Electronic Materials Additive Manufacturing of Electronics apes Integrated Technology of Materials, Process controlled by Al software and Hardware INNANODIMENSION NASDAQ TASE:NNOM 22

23. Slide 23: Nano Dimension's Solutions

    > Aa Na no A AME Machines (controlled by Al algorithms) produce electronic devices Dimension’s by simultaneous 3D-injection of a polymer dielectric and silver conductive Solutions materials to fabricate, within hours: High Performance Electronic Devices: Hi-PEDs B (including sensors, antennas, capac

24. Slide 24: DragonFly LDM System — Introduced Only Since July 2019

    DragonFly LDM™ System — Introduced Only Since July 2019 July 2019: DragonFly Lights-Out Digital Manufacturing (LDM) Machines using 3D printing technology ¢ The only Prototyping & Fabrication Machine; ——— ¢ Around-the-clock 3D-printing of electronic circuitry (AME); = * Cost effective for small-mediu

25. Slide 25: In Summary: The Technological Edge

    In Summary: The Technological Edge High precision inkjet technology Multi material 3D printing Nano-silver & dielectric polymers Combining conductive First additive manufacturing for functional 3D electronics

26. Slide 26: Compelling Value Proposition

    Compelling Value Proposition © TIME Reduces development cycles times. Enables on-site prototyping in a matter of hours instead of weeks, even for complex designs. oO COMPONENT CONSOLIDATION Multi-material additive manufacturing enables functional, compact, denser, non-planar electronics parts. NSS a

27. Slide 27: Case Study: Harris Corporation: RF Amplifier to Space

    Case Study: Harris Corporation: RF Amplifier to Space Joint project for space systems communication satellites: 3D printed RF antenna designed to operate at 5.2 GHz and an RF amplifier with operation up to 6 GHz. Received a 2"¢ grant approval from the Israel Innovation Authority, in cooperation with

28. Slide 28: Growth: 2020-2021

    Growth: 2020-2021 15 Build central Europe Build Asia sales, sales, engineering < engineering and and customer customer support support force to an force to fit market interim scale scale . Build USA headquarters . Re-build USA sales, engineering and customer support force & knowledge to a full scale

29. Slide 29: Cap Table

    Cap Table aS INNANODIMENSION NASDAQ TASE:NNOM 29 Type of securities Amount of securities (‘Shares’ mean ‘ADSs’) #Outstanding ADSs 7,974,483 Treasury Shares 10,541 Employees Options (1) (WAEP: $14.13) 613,348 Warrants (WAEP: $6.23) 2,982,793 Total (2) 11,581,165 (1) Employees, officers, directors and

30. Slide 30: Key Highlights

    Key Highlights Growth company with significant technology and first mover advantage. Successfully transitioned from an R&D company to commercial sales. Rapidly increasing customer’s base and established global presence. Recognized by industry leaders, won prestigious awards and national grant: 57 sy

31. Slide 31: NASDAQ: NNDM

    NASDAQ: NNDM

32. Slide 32: Nano Dimension's Solutions

    .. ~ Nano @® Dimension’s Solutions Nano Dimension systems concurrently integrate in-situ capacitors, antennas, coils, transformers and electromechanical components, to function at unprecedented performance. Nano Dimension BRIDGES THE GAP between PCB and semiconductor integrated circuits. A revolutio

33. Slide 33: Scalable Technology and Manufacturing Platform

    Scalable Technology and Manufacturing Platform In-house DragonFly In-house nano ink system manufacturing - Capacity to meet Top quality certified manufacturing future demand 1SO14001 and OHSAS18001 NASDAQ TASE:NNOM 33 ‘wor nane-dicom | © 2018 Nano

34. Slide 34: Open-Ended Revenue Growth Potential

    Open-Ended Revenue Growth Potential RESEARCH INSTITUTES INDUSTRY VERTICALS ADDITIVE SERVICES *Academic institutions and *Defense * Additive service bureaus universities e Aerospace «PCB service bureaus «Research & innovation «Autonomous Automotive «In-house print services centers Development * Medic

35. Slide 35: Hi-PEDs

    Hi-PEDs DIMENSION 35 NASDAQ/TASE:NNOM ane-dicom| © 2019Nano Dimension Al rights reserved

36. Slide 36: Hi-PEDs

    Hi-PEDs DIMENSION NASDAQ TASE:NNOM 36 wor nano: dcom | © 201 ‘Dimension, Al rights reserved

37. Slide 37: Case Study: The Next Generation in Additive Manufacturing

    Case Study: The Next Generation in Additive Manufacturing First tested by HENSOLDT, global defense & security pioneer: The DragonFly LDM™ Lights-Out Digital Manufacturing system is the industry's only comprehensive additive manufacturing platform for round-the-clock 3D printing of electronic circuit

38. Slide 38: Strategic Growth Plan

    Strategic Growth Plan Sais NANODIMENSION NASDAQ TASE:NNOM 38 Current State Growth by monetizing commercially available products for additive electronics design & prototyping Horizon 1 Deliver manufacturing-grade machines for low volume of Hi-PEDs using AME Horizon 2 ¢ Add materials with new applicat

39. Slide 39: Company Timeline

    Company Timeline 2014: Listed on TASE 3 2016: Listed on Nasdaq g¢ Nasdaq 2016-2017: Early access FORTUNE trials with Fortune 500 companies 2014- 2016 R&D * Developed product, materials & software * Established manufacturing * Built organization 2016-2017: Early access trials with Fortune 500 compani

40. Slide 40: 2019 Highlights

    2019 Highlights 57 systems sold to leading companies and organizations worldwide until 12/2019 Further expansion in the U.S. defense industry. In Q3- four additional sales to leading defense organizations Increased ink consumption validates the company's recurring revenue model Leading technology in

41. Slide 41: Experienced Leadership Team

    Experienced Leadership Team > = — — — Yoav Stern Yael Sandler Jaim Nulman Ofir Baharav President & CEO CFO cTO Chairman of the Board — — — Amit Dror Sela Chen Gilad Reshef Dan Abraham Customer Success Officer VP Customer Support VP Sales VP Operations Co-Founder SB as INNANODIMENSION NASDAQ TASE:NNO

42. Slide 42: Nano Dimension® Copyright Dimension Ltd gonFly logo are trademark: no Dimension. Printed

    Nano Dimension® Copyright 0 Dimension Ltd gonFly logo are trademark: no Dimension. Printed

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