Slide 1: Citigroup 2007 Technology Conference
Citigroup 2007 Technology Conference New York, New York Craig DeYoung VP Investor Relations September 06, 2007
Slide 2: Safe Harbor
Safe Harbor "Safe Harbor" Statement under the U.S. Private Securities Litigation Reform Act of 1995: the matters discussed in this document may include forward-looking statements that are subject to risks and uncertainties including, but not limited to: economic conditions, product demand and semico
Slide 3: ASML overview - The world's leading provider of lithography systems
ASML overview - The world's leading provider of lithography systems for the semiconductor industry Established: 1984 Headquarters: Veldhoven, the Netherlands Market cap ~ €10 B Employees ~ 6,200 Customers: Serving 17 of the top 20 semi mfg. Equity Listing: Nasdaq and Euronext Key facts Key financial
Slide 4: Industry growth drives lithography tool consumption
Sources: ASML MCC, VLSI Research, iSuppli, SIA Industry growth drives Lithography tool consumption - NAND Flash fastest growing DRAM LOGIC NAND NOR ANALOG MICRO Other 0 10 20 30 40 50 60 0 5 10 15 20 25 30 CAGR Exposure Area 06-09 [%] Exposure area 2006 [SI*10^9] Segment size: 20 Bio. US$
Slide 5: NAND Flash customer roadmaps drive lithography tool development
NAND Flash Customer Roadmaps drive Lithograph tool development Jan-00 Jan-02 Jan-04 Jan-06 Jan-08 Jan-10 Jan-12 Half Pitch (nm) 200 100 80 60 40 Logic DRAM Half Pitch status : Logic = 65~90nm DRAM = 60~80nm NAND = 55~65nm
Slide 6: ASML Lithography Roadmap 300mm
ASML Lithography Roadmap 300mm
Slide 7: ASML TWINSCAN Product Specifications Continuous Improvement
ASML TWINSCAN? Product Specifications Continuous Improvement
Slide 8: ASML roadmap enables shrink for Logic, DRAM, and NAND flash
ASML roadmap enables shrink for Logic, DRAM, and NAND flash at time required Source: Various customers, dates determine production start/qualification 10 12 200 100 80 60 40 11 07 09 08 04 06 05 01 03 02 00 Resolution/half pitch "Shrink" [nm] Year ASML Product Introduction XT:1400 XT:1700i AT:1200 A
Slide 9: Technology in Time helps grow market share
84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 00 01 02 03 04 05 06 Region 1 0 1 2.5 8.5 7.5 10.5 11.5 10.5 21 21 19 19.5 25.5 31 36 41 41 30 54 45 53 56.5 63 Technology in Time helps grow market share Technology in Time helps grow market share Technology in Time helps grow market share Total marke
Slide 10: Immersion leadership continues
KrF ArF dry ArF wet I line East 15 37 42 6 West North Immersion - Leadership continues Over 50 systems shipped to date to all applications and geographies in the world 25 immersion machines in backlog valued at € 728 M Received repeat orders from major Japanese customers including multiple XT:1900i
Slide 11: First TWINSCAN XT:1900i shipped on schedule early July
First TWINSCAN XT:1900i shipped on schedule early July First tool in the world capable of printing features below 40 nm in volume production in volume production in volume production
Slide 12: Over million wafers processed on ASML immersion systems
Over 2 Million wafers processed on ASML immersion systems with steep production ramp since April 2007 systems with steep production ramp since April 2007 systems with steep production ramp since April 2007 Wafers exposed on ASML immersion equipment
Slide 13: Lithography system costs will continue to rise
1 10 100 1985 1990 1995 2000 2005 2010 Year Lithography System costs will continue to rise Relative List Price i-line 300mm 200mm 150mm KrF ArF ArFi EUV? Wafer Size Wavelength Stepper Platform Step & Scan Dual Stage 0.4 0.5 0.6 0.7 0.8 0.93 1.2 1.35 Aperture
Slide 14: Average Selling Price (ASP) grows
Average Selling Price (ASP) grows 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 3.59 4.38 5.4 5.9 6.8 8.92 9.46 9.28 13.54 14.01 MSGraph.Chart.8 MSGraph.Chart.8 ASML ASP new systems KrF & Step & Scan 300mm & ArF 300mm & ArF ArF volume & ArFi
Slide 15: Are lithography systems becoming unaffordable?
Are lithography systems becoming unaffordable? 1 10 100 1,000 10,000 1986 1988 1990 1992 1994 1996 1998 2000 2002 2004 2006 2008 150mm 200mm 300mm Relative price increase = 40% / generation Relative productivity increase (mm2/hour) = 30% / generation Relative shrink increase (pixels/field) = 100% /
Slide 16: Lithography Affordability for Future Shrink
Lithography Affordability for Future Shrink Relative Performance 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2.0 AT:1150C XT:1400E XT:1900i NEXTi EUVL 90nm 65nm 40nm 28* 22 2003 2005 2007 2009 2011 4GB 8GB 16GB 32GB 64GB Relative System Cost Relative System WPH Relative Cost / Function / Hour Model Resoluti
Slide 17: ASML Competitive Advantage
ASML Competitive Advantage 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2004 2005 2006 2007 2008 ASML ArF Competition ArF ASML ArFi Competition ArFi Pixels per Hour per Million Euro
Slide 18: Summary
Summary Shrinking design rules have been the economical driver of the IC industry. Lithography remains the key enabler Providing the right product at the right time allows market share gains for ASML Shrinking design rules require increasingly more sophisticated lithography systems resulting in a st
Slide 19: ASML Commitment
G “ee ASML Commitment