Nan Ya Printed Circuit Board Corporation · TWSE:8046

Nan Ya Printed Circuit Board — Nan Ya PCB — Macquarie North Asia Conference 2010

16 slides from Nan Ya Printed Circuit Board's conference presentation, August 2010

  1. Slide 1: Company Briefing

    NAN YA PCB CORPORATION COMPANY BRIEFING August 2010 2010 NYPCB, All Rights Reserved. PAGE 1

  2. Slide 2: Safe Harbor Notice

    NAN YA PCB CORPORATION Safe Harbor Notice Nan Ya PCB’s statements of its current expectations are forward-looking statements subject to significant risks and uncertainties and actual results may differ materially from those contained in the forward-looking statements. Except as required by law, we u

  3. Slide 3: Vertical Integration within FPG

    NAN YA PCB CORPORATION FPG Introduction Vertical Integration within FPG Copper CopperOre Ore Crude CrudeOil Oil Sand Sand Copper Oil OilRefinery Refinery Glass External Copper Naphtha GlassYarn Yarn Wafer Wafer Refinery NaphthaCrake Crake 1991 1998 Procurement Refinery 1998 1998 1991 1998 Copper Cop

  4. Slide 4: Milestone

    NAN YA PCB CORPORATION Company Introduction Milestone Year 1985 Start up PCB mass production Year 1997 Establish Na Ya PCB Corporation Year 2000 Start up wire bond substrate mass production Year 2001 Start up flip chip substrate mass production Year 2002 Start up Kunshan PCB mass production Year 200

  5. Slide 5: Production Allocation and Monthly Capacity

    NAN YA PCB CORPORATION Company Introduction Production Allocation and Monthly Capacity + + + Flip Chip P6 8M Units P7 7M Units P8 (Potential 15M Units) P1+P5 15M Units Wire Bond + P2 180KSF KS 300KSF PCB, HDI + P3 145KSF KS 1.65MSF Note: KS=Kunshan China manufacturing campus 2010 NYPCB, All Rights R

  6. Slide 6: Structure of Shareholders

    NAN YA PCB CORPORATION Structure of Shareholders Norges Bank 2.2% Chunghwa Post 2.2% Others 21.2% Orbis Asia Fund excl. Japan 2.0% New Labor Pension Fund 1.5% Nan Ya Plastics Nan Shan Life Insurance 1.5% 66.7% Labor Pension Fund Supervisory Committee 0.8% Shin Kong Life Insurance 0.7% Fidelity Inves

  7. Slide 7: 2009~2010 Monthly Revenue in Taiwan

    NAN YA PCB CORPORATION Company Current Status 2009~2010 Monthly Revenue in Taiwan NT$ M 4,500 2009 2010 4,000 3,500 3,180 2,998 3,013 3,015 3,016 3,000 2,671 2620 2702 2683 2,646 2,696 2,574 2,364 2,334 2,500 2,201 2,179 1,967 2,000 1,507 1,500 967 1,000 500 0 Jan Feb Mar Apr May Jun Jul Aug Sep Oct

  8. Slide 8: 2010 Sales Breakdown by Application

    NAN YA PCB CORPORATION Company Current Status 2010 Sales Breakdown by Application Networking & Automotive 3% Communication 5% Consumer 4% PC & Peripheral 15% IC Substrate 73% 2010 NYPCB, All Rights Reserved. PAGE 8

  9. Slide 9: Products & Applications - PC

    NAN YA PCB CORPORATION Products & Applications-PC GPU CPU FC-BGA FC-PGA/LGA 35mm*35mm 37.5mm*37.5mm PCH FC-BGA DRAM (WB-BGA) 25mm*25mm DRAM Module (PCB) 2010 NYPCB, All Rights Reserved. PAGE 9

  10. Slide 10: Products & Applications - Game Console

    NAN YA PCB CORPORATION Company Current Status Products & Applications-Game Console A B MPU FC-BGA 27mm*27mm 2/2/2 C Integrated Chipset Integrated Chipset MPU FC-BGA FC-BGA FC-BGA 35mm*35mm 42.5mm*42.5mm 33mm*33mm 3/2/3 3/2/3 2/2/2 MPU Integrated Chipset FC-BGA FC-BGA 21mm*21mm 31mm*31mm 2/2/2 2/2/2

  11. Slide 11: Products & Applications - Others

    NAN YA PCB CORPORATION Company Current Status Products & Applications-Others Set-Top Box HDTV Chipset 37.5mm*37.5mm 35mm*35mm 2/2/2 2/2/2 Set-Top Box and HDTV started to migrate to flip-chip design in 2007, and annual demand has been expected to increase dramatically in 2010 . 2010 NYPCB, All Rights

  12. Slide 12: Thank You Q & A

    NAN YA PCB CORPORATION Thank You Q&A 2010 NYPCB, All Rights Reserved. PAGE 12

  13. Slide 13: IC Substrate Introduction

    NAN YA PCB CORPORATION Appendix 1 IC Substrate Introduction Wire Bonding Substrate Outline： ： By using gold wires to connect electrical pads with the so-call wire bonding substrate which plays the function as the buffer between chips and motherboard. Wire Bond Substrate Motherboard Flip Chip Substra

  14. Slide 14: Types of Wire Bonding Substrates

    NAN YA PCB CORPORATION Appendix 2 Types of Wire Bonding Substrates •Ball Grid Array (BGA) Plastic Ball Grid Array (PBGA) Window BGA •Chip Scale Package (CSP) Wire Bonding CSP (WB-CSP) Flip Chip CSP (FC-CSP) 2010 NYPCB, All Rights Reserved. PAGE 14

  15. Slide 15: Types of Flip Chip Substrates

    NAN YA PCB CORPORATION Appendix 3 Types of Flip Chip Substrates •FC-Pin Grid Array (FC-PGA) •FC-Land Grid Array (FC-LGA) •FC-Ball Grid Array (FC-BGA) 2010 NYPCB, All Rights Reserved. PAGE 15

  16. Slide 16: FC Substrate Development Trend

    NAN YA PCB CORPORATION Appendix 4 FC Substrate Development Trend CPU Development Integrated-Chipset Packaging Status 2 (GHz) Multi-Chipset Packaging Status 1 3.33 4+4+4 37.5x37.5mm Multi-Core 2.66 Dual-Core 5+4+5 37.5x37.5mm 2.33 Pentium 4 (Mainly for high-end product) 2+4+2 2+4+2 37.5mmSQ Chip on B

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