Formfactor, Inc. · NASDAQ:FORM
Formfactor — Technical Presentation (November 2020)
9 slides from Formfactor's technical presentation, Nov 17, 2020
Slide 1: Surface Metrology for Advanced Packaging Applications
Surface Metrology for Advanced Packaging Applications FRT GmbH a FORMFACTOR company www.frtmetrology.com November 17, 2020
Slide 2: FRT – the art of metrology
FRT – the art of metrologyTM Art – that is the interaction of craft, knowledge, experience, creativity and passion. • Optical 3D surface metrology • Measurement of roughness, topography, layer thickness etc. • Defect Inspection • Multi-sensor technology • Modular hardware configuration • Fast and ac
Slide 3: MicroProf Series
MicroProf Series ® MicroProf® 300 MicroProf® MHU MicroProf®FE MicroProf® AP
Slide 4: Contact free measurement: compact – multi-sensor – modular – standardized
Contact free measurement compact – multi-sensor – modular – standardized
Slide 5: Contact free measurement: compact – multi-sensor – modular – standardized
Contact free measurement compact – multi-sensor – modular – standardized An example of multi sensor configuration including topography point sensors, field of view and film thickness sensors
Slide 6: MicroProf AP wafer metrology tool for Advanced Packaging
MicroProf AP ® wafer metrology tool for Advanced Packaging Applications in Advanced Packaging Trenches Thin film measurement Metal Contacts Step height / width TSV Bump analysis Photo Resist TSV / trench depth / width Interposer CD / Overlay RDL / UBM T-dependent topography Bumps / µ-Bumps Stress BG
Slide 7: 2.5D/3D IC Packaging process flow
2.5D/3D IC Packaging process flow
Slide 8: MicroProf DI Inspection and metrology in one flexible tool
MicroProf DI ® Inspection and metrology in one flexible tool TYPICAL APPLICATIONS • bare wafer inspection (e.g. particles, holes, pits, micro scratches, micro roughness, growth defects, inclusions) • layer defects (e.g. par-ticles, holes, layer crack-ing, delamination, voids, residuals) • filling de
Slide 9: THANK YOU
THANK YOU