Kla Corporation · NASDAQ:KLAC

Kla — Nasdaq 44th Investor Conference (June 2021)

28 slides from Kla's conference presentation, Jun 16, 2021

  1. Slide 1: KLA and Advanced Packaging

    KLA and Advanced Packaging Oreste Donzella, Executive Vice President EPC Group June 16, 2021

  2. Slide 2: Forward-Looking Statements

    Forward‐Looking Statements Statements in this presentation other than historical facts, such as statements pertaining to: (i) industry trends; (ii) customer demand and investment strategy; (iii) anticipated synergies from acquisitions; (iv) hiring by KLA; (v) anticipated dividends and share repurcha

  3. Slide 3: KLA: Global Leader in Electronics Ecosystem

    KLA Global Leader in Electronics Ecosystem

  4. Slide 4: 2020: Another Outstanding Year for KLA

    2020: Another Outstanding Year for KLA 1976 57,000 >10,000 $6.1B 15% fo u n d e d i n st a l l e d b a s e e m p l o ye e s re ve n u e R&D (tools) % of revenue Revenue Mix by R e v e n u e Ty p e Geography 4 KLA Non‐Confidential | Unrestricted

  5. Slide 5: 2021: The Secular Story Continues

    2021: The Secular Story Continues Artificial Virtual 5G Connectivity Mobile D at a C e nt e r A u t o m o t i ve H e a l t h c a re I nt e l l i ge n c e I nt e ra c t i o n Jul Oct Jan Apr Jul Oct Jan Apr Jul Oct Jan Apr Jul Oct Jan Apr Jul Oct Jan Apr Jul Oct Jan Apr Jul Oct Jan Apr 2020 2020 2021

  6. Slide 6: Semiconductor Process Control

    Semiconductor Process Control KLA systems find the defects and variations that affect chip performance you can’t fix what you can’t control you can’t find what you can’t measure 6 KLA Non‐Confidential | Unrestricted

  7. Slide 7: EPC: The More than Moore Organization

    EPC The “More than Moore” Organization

  8. Slide 8: The Acquisition of Orbotech and SPTS

    The Acquisition of Orbotech and SPTS February 2019  Extends reach within the electronics value chain  Increases exposure to fast growing markets  Complements geographic and customer footprints Specialty Printed Circuit Flat Panel Semiconductor Component Board Display  Provides differentiated pro

  9. Slide 9: Market Expansion Across the Entire Electronics Ecosystem

    Market Expansion Across the Entire Electronics Ecosystem February 2019 PCB Fabrication and IC Test Assembly and Packaging Front End Wafer Fabs Sp e ci alty A d v an c e d PC B, Su b s trate s Ad vance d Pack aging, Ad vanced Su b s trate Se mi co nductor Se mi co nductor Wa f e r L e v e l P a c k a

  10. Slide 10: The Creation of EPC Group

    The Creation of EPC Group February 2020 Rick Wallace President and Chief Executive Officer Ahmad Khan Brian Lorig Oreste Donzella  Consistent strategy and execution President Executive Vice Executive Vice President President  Management by metrics SEMI PC GSS EPC  Financial discipline and rigor 1

  11. Slide 11: The "More than Moore" Organization

    The “More than Moore” Organization M o o re ’s L a w M o re t h a n M o o re M o o re ’s L a w 1965 "Cramming more components onto integrated circuits" “Number of transistors is Specialty Semiconductor Packaging expected to double every 2 years” Semiconductor Logic Front End Scaling PCB and IC Subst

  12. Slide 12: Large and Diversified Customer Base

    Large and Diversified Customer Base 12 K L A N o n ‐ C o n f i d e n t i a l | U n r e s t r i c t e d

  13. Slide 13: Global Organization

    Global Organization UK + Europe 26% US 6% Israel 25% Asia 43% 2,518 E P C h e a d c o u nt 13 K L A N o n ‐ C o n f i d e n t i a l | U n r e s t r i c t e d HQ R&D manufacturing R&D/manufacturing

  14. Slide 14: Advanced Packaging: Everything is Changing

    Advanced Packaging “Everything is Changing”

  15. Slide 15: Semiconductor Technology has been Scaling for 50+ years

    Semiconductor Technology has been Scaling for 50+ years 1980 1990 2000 2010 2020 g‐line (436nm) i‐line (365nm) KrF (248nm) ArF (193nm) ArF Immersion (193i) EUV (13.5nm) 3nm 5nm 7nm 10nm 16nm 32nm 65nm 130nm 500nm 250nm 1μm C o n v e n t i o n a l Tr a n s i s t o r S c a l i n g i s s t i l l h a p

  16. Slide 16: Advanced Packaging: Crucial to Semiconductor Technology Roadmap

    Advanced Packaging: Crucial to Semiconductor Technology Roadmap Source: Intel Source: tsmc From IC Protection to Performance Differentiation 16 K L A N o n ‐ C o n f i d e n t i a l | U n r e s t r i c t e d

  17. Slide 17: More Packaging Types | Higher Complexity

    More Packaging Types | Higher Complexity Time of Flight 2.5D‐3D Sensor InFO‐oS Antenna in Package (AIP) CIS ‐ Sensor 2.5D ‐ ADAS SiP ‐DSMBGA Complex Shape SiP QFN – PMIC Significant Investment Plan to Overcome New Challenges 17 K L A N o n ‐ C o n f i d e n t i a l | U n r e s t r i c t e d

  18. Slide 18: Heterogenous Integration: Scaling while Keeping Cost Down

    Heterogenous Integration: Scaling while Keeping Cost Down  From System on Chip (SOC) to Chiplets  High cost only for core functionalities  Disag gregation of the non‐core functionalities  Heterogenous integration via packaging Source: AMD 18 K L A N o n ‐ C o n f i d e n t i a l | U n r e s t r

  19. Slide 19: Hybrid Bonding: The Big Next Inflection in Heterogeneous Integration

    Hybrid Bonding: The Big Next Inflection in Heterogeneous Integration Integration Schemes Thermo‐Compression (Bump) Hybrid (Bump‐less) Source: tsmc Source: tsmc Source: tsmc  Key Benefits: Speed, Bandwidth and Power Efficiency through increased interconnect density  Hybrid Bonding in Packaging with

  20. Slide 20: Advanced Packaging: Terrific Opportunity for KLA

    Advanced Packaging Terrific Opportunity for KLA

  21. Slide 21: Advanced Packaging Challenges

    Advanced Packaging Challenges  Heterogeneous Integration Multi‐Die Yield  Smaller Features  New Complex Process Steps  New Materials  Larger Packages and Custom Shapes f ro m Wa fe r  Increased Customer Quality Requirements  Variety of Applications and Package Types t o Pa c ka ge d I C C o m

  22. Slide 22: Differentiated Product Portfolio

    Differentiated Product Portfolio Wafer‐Level Packaging Final Assembly and Test SPTS Delta™ SPTS Omega® SPTS Mosaic™ SPTS Sigma® ICOS™ F160XP wafer/tape PECVD Plasma Etch Plasma Dicing PVD inspection, die sort Process Die Sort Process Component Control Sort CIRCL™‐AP Kronos™ 1190 Zeta‐580 ICOS™ T3, T

  23. Slide 23: Advanced Packaging Ecosystem

    Advanced Packaging Ecosystem  3D SoC with cache memory on µP cores for HPC  3 D ‐ I C D R A M d i e s t a c ke d o n l o g i c xPU  Hybrid bonding for high interconnect density and low  HBM demand increasing for AI and data centers HBM power  Hybrid bonding expected HVM in 2022‐23  2.5D interp

  24. Slide 24: Advanced Packaging Key Collaborations

    Advanced Packaging Key Collaborations Die Stacking Process Defectivity Reduction Metrology and Process Control Active Projects with Top5 Semiconductor Companies 24 K L A N o n ‐ C o n f i d e n t i a l | U n r e s t r i c t e d

  25. Slide 25: Data Automation and Process Control will Enter Packaging Fabs

    Data Automation and Process Control will Enter Packaging Fabs Process Control From Defect…Analyze Correlate Identify Unpatterned to Patterned Killer Defect? Correlation Hotspot Discovery Reticle Inspection Problematic Chamber/ Process? Lot History M e t r o l o g y Metrology to Defect Yield Predicti

  26. Slide 26: Advanced Packaging: New Growth Engine for KLA

    Advanced Packaging New Growth Engine for KLA

  27. Slide 27: Packaging: New Growth Engine for KLA

    Packaging: New Growth Engine for KLA KLA Revenue in Packaging 2015 2016 2017 2018 2019 2020 2021 F 2022 F 2023 F New Products Zeta ORBOTECH/ SPTS Share Gain Share Gain Share Gain Share Gain Adoption Acquisition Acquisition New Products New Products New Products Adoption Adoption Adoption >20% CAGR (

  28. Slide 28: Thank You

    Thank You Oreste Donzella, Executive Vice President EPC Group June 16, 2021

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